可自動溫度補償Self Refresh對低功率動態隨機存取記憶體影響之特性分析與量測方法

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(1). . . . . . . . . . . . . Self Refresh

(2) . . . . . . . . . . . . . Auto Temperature Compensated Self Refresh Characteristic Analysis and Testing Methodology for Low Power DRAM. !. .. (. ". 1. ). #. 2. *. $%. 3. +. $,. &. 4. 5 -. I-. 6. -. '. 7. .. 8. /. 9. 0.

(3) . . . . . Self Refresh

(4) . . . . . . . . . . . . . . Auto Temperature Compensated Self Refresh Characteristic Analysis and Testing Methodology for Low Power DRAM . . StudentChia-Jen Wu .

(5) . . . . AdvisorDr. Hao-Chung Kuo. . A Thesis. Submitted to College of Electrical and Computer Engineering National Chiao Tung University in partial Fulfillment of the Requirements for the Degree of Master of Science in Electronics and Electro-Optical Engineering April 2007 Hsinchu, Taiwan, Republic of China. -. II -.

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(9) Auto Temperature Compensated Self Refresh Characteristic Analysis and Testing Methodology for Low Power DRAM. StudentChia-Jen Wu. AdvisorsDr. Hao-Chung Kuo. Degree Program of Electrical and Computer Engineering National Chiao Tung University. ABSTRACT In recent years, due to the increasing number of Portable electronic products, the. specifications. of. electronic. parts. for. low-power. consumption have been proposed continuously for various applications. Inevitably, the specifications for low-power Dynamic Random Access Memory (DRAM) have also been established. The design of Auto Temperature Compensated Self Refresh (ATCSR) is a new design specification and application for memory suppliers in the world to reduce the power consumption of DRAM in refreshing. In this paper, the method of ATCSR is compared with traditional refreshing methods. The concepts for designing ATCSR will also be described. A real circuit after the complete manufacturing process of semi-conductor products is used for analyzing the electric characteristic to investigate the applicability of ATCSR. Finally, a new testing concept and testing method will be proposed by adopting the specifications of ATCSR in DRAM design.. -. IV -.

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(55) d4 . ºÇ 5. Å. Ã,°ST. sÔ. 6. 7. 2. :. É. y. UW. ·k. ¸. ¹. ST. U. . !(Refresh Time)s . a. DDR SDRAMBSDR SDRAM PSRAM x xAuto Refresh Self Refresh . év. (Hidden Refresh)é a. x Self Refresh . XY. º. Equalization (. X. KW. ¶. ]. Auto Refresh å Self Refresh Refresh G. MOS g Á. UÈ. (b. ;. ] Word Line(Row Address) . he. 3. p. jyST. 1 VDD) Bit LineËW 2. (Sense Amplifier)W =. Hp. XY. =. UM. N. Xy Bit Line. h Bit Line Ö. j. xÍ1Ñ(VDD) åÍ0Ñ(VSS)Î Bit Line hx 1Ñ(VDD) åÍ0Ñ(VSS) =. jÍè. =. 9. Ö DRAM «© Õ. PSRAM Refresh â. . 8. Refresh â. q. d'. N Refresh Á. UM. 2.3 Refresh. Y. Ä. !(Data Retention Time)¾ÄST . $. Æ. . . Ñ. . x Refresh G. b. Z[ Array B. Vdd. Q. HI. G W. EQL VBL (Vrefp). . º

(56) Î'. . HpG 2.3 "G 2.4 xST XY. L. ] Word Lin(Row Address)ÄÁ e. =. K. L. Y. =. DB. NVW. XY. G. Equalization Circuit SLp. UM. /DB. SLN. . R. EQR Array VBL (Vrefp) Vdd. BL. A. BL IOm+1. IOm+1 /BL. /BL. BL. BL IOm. IOm. /BL. /BL. WL. WL. Equalization Circuit. G2.3 : ST. UM. NVW -8-. XY. =. Z[. Q. H.

(57) Word Line “On”. Data “1”. Bit Line Equalization Data “0” Word Line “Off”. G2.4 : W. 2.4 TCSR. . Ã. 6. z A3 A4 Code( s½. 4. 5. ³. X IC J 4. _. `. h. z{. i. . . ]. z IC

(58) Refresh /. 5. K. L. Y. =. G$. SDR SDRAM EMRS Code \, TCSR ]. . ^ TCSR x$2 Â Bit$Q. TCSR ¡. =. (. G 2.5 x s. ). XY. J W 4. 5. z IC ¡. Öà. J h. U

(59) Refresh /. Ë?. X% SDR/DDR SDRAM '. ST. ( HI. G. -9-. y EMRS a 5. ° 1@)B4@)B70) 8@)$A. Ë i. X4. ÁÂ4. 5. W. c. d. . . X(Thermometer)«W. G 2.6 :J 4 5. W.

(60) BA1 BA0 A11A10 A9 A8 A7 A6 A5. A4 A3. A2 A1 A0. E13 E12 E11 E10 E9 E8 E7 E6 E5 E4 E3 E2 1. 0. 0. 0. 0. 0. E4 1. E3 1. TCSR 85 C. 0 1. 0 0. 0. 1. 0. 0. 0. TCSR. Address Bus. E1 E0. Extended Mode. PASR. Register (EMRS). E2 E1 E0 PASR Coverage 0 0 0 Full Array (All Banks). . 0. 0. 1 Half Array (2 Banks: BA1=0). 70 C 45 C. 0. 1. 0 Quarter Array (BA1=0,BA0=0). 0. 1. 1 Reserved. 15 C. 1. 0. 0 Reserved. 1. 0. 1 Reserved. 1. 1. 0 Reserved. . ** PASR : Partial Array Self-Refresh. 1 1 1 Reserved ** TCSR : Temperature Compensated Self-Refresh. G2.5 : SDRAM EMRS Code\, TCSR ]^$. External Temperature Sensor. TCSR Register (A4/A3: 2 Bits). Change TCSR Code. Adjust Refresh Frequency Other Controllers. Self-Refresh Current Reduction. Other Devices. SDR/DDR SDRAM. System G2.6 :$J 4. 2.5. ATCSR s. _ â. Z. `. . . ÖJè : á. 5. X%SDR/DDR SDRAM' W. ( HI. G$. (. , ATCSR ¡ ¢ . ³. . ùú. ;yí. . . ¡. . KW. X IC

(61) 4 - 10 -. yé. c. ;yh TCSR J 4. Temperature Sensor)J. . 5. 5. z{. W. d. . O(Mobile). ATCSR p% TCSR V IC

(62) (On-Die. X

(63) I J. K?. ST. U

(64) Refresh.

(65) /. (Real Time)î ¬¡. . . c. EMRS Code \, ATCSR ]^°

(66) ã. b. ATCSR ¡ . ³. . d. 2]^ EMRS Code J. . ° ¡. SDR SDRAM. s. ¢£ . , ATCSR ùE. EMRS Code ]^ A9 xÍ0ÑåÍ1Ñx ATCSR (Disable)e '. ( HI. Self Refresh a z i. W. X%_. `. 6 . z@. yG 2.9 \ TCSR Refresh e. a. ] T1 ,ST Ê. U Refresh ÁÁ2. 5. Ä Refresh / x 15.6 s4 5. Refresh h½ d. 6P. ¨ 5. V 60) î. 9 . y·4. %. Refresh ½. :V «28 s Â.. /. ©. y®®. .. 2¾4. z{. a. 7UC«a A4 A3. 0. 0. 0/1. 0. E9 0. ATCSR. 1. Disable. 0. 0. Enable. ** PASR : Partial Array Self-Refresh. 0. 0. 0. b. E1 E0. PASR. 5. . Refresh 5. V 25) î. 7³. $ Address Bus Extended Mode Register (EMRS). 0. 0. 1 Half Array (2 Banks: BA1=0). 0. 1. 0 Quarter Array (BA1=0,BA0=0). 0. 1. 1 Reserved. 1. 0. 0 Reserved. 1. 0. 1 Reserved. 1. 1. 0 Reserved. 1 1 1 Reserved **A TCSR : Auto Temperature Compensated Self-Refresh. G2.7 : SDRAM EMRS Code\, ATCSR ]^$. . Refresh. E2 E1 E0 PASR Coverage 0 0 0 Full Array (All Banks). - 11 -. y. z{. Refresh Ò. A2 A1 A0. E13 E12 E11 E10 E9 E8 E7 E6 E5 E4 E3 E2 0. 90) 5. :x 64 sª4 9. (Real Time)¬. BA1 BA0 A11A10 A9 A8 A7 A6 A5. 1. '4. ³. T1 ½ h. «©. x 15.6 s yG 2.10 \ ATCSR Refresh ¢y·4. c. &!. SDR/DDR SDRAM TCSR ATCSR ¡ ¥. T1 T2 T3 y23 4 5 6

(67) 4 5 W XW X4 5 ¦ § 23. ¡. . G$. G 2.9 G 2.10 «¤. . 5. G 2.7 . (Enable)å' . G 2.8 x SDR/DDR SDRAM \

(68) 4 f. KÀ IC. î. ¬.

(69) Temperature Sensor. Adjust Refresh Frequency Other Controllers. Self-Refresh Current Reduction (ICC6). Other Devices. SDR/DDR SDRAM. System G2.8 :$SDR/DDR SDRAM

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(71) 2.6 < =. Test Mode. . . >. ?. (. s SDRAM ® Mode Register Select(MRS)â U\¯(Code)Ø. ST 7 . ST. ®ST. U1. °. s. U´. SDRAM x. P. Ù. ±. CAS LatencyBí í. ËÌ. (Address)«². ]. ATCSR C . SDRAM ¯. h. ]¯(Code). . Burst Length ]b. ¯(Code)². . ° 14 Â´. . ³. . :A0~A13). CAS Latency x”2”$ Burst Length x”4”¢ ¶ Ë. ]¯(Code)J¯(Code)«· ïð. ±. ¯ 128Mb(µ. H¯(Code)x”00000000100100”H. . . Z. Ì. h. /. ~ i. Test Mode ® JEDEC \. ¸. rv. 2.1 ¹ E. Test Mode Test Mode C. H\. ° DQM0 DQM1 ºxK L. åj». å». E. ®. Z¼. . 2.1 :$Test Mode $. Test Mode ! ½. TMREFDIS ¹. J K. TMOSCMON B. 9. ¾. IC

(72) Refresh ¡ c. TMPADREF . TMVTP. º(». . L. ?. IC

(73) *+ :*+. ³. IC

(74) Refresh (Oscillator). (Oscillator)¿. - 13 -. j. /». ) E. _ DQM0(» ) DQM1(» E. ). DQM0(» ).

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(76)

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(78) t1. t1. CLK RAS# CAS# CKE. High. Refresh Signal. High. High. Average Current I1. G3.1 : Auto Refresh( t1 ) ?. ( I1 )' @. t2. (G. t2. CLK RAS# CAS# CKE. Low. Low. Refresh Signal. Low. Average Current I 2. G3.2 : Self Refresh( t 2 ) ? ÀG 3.1 G 3.2 é1. @. ( I 2 )'. Auto Refresh Self Refresh á. (G y CKE ºx . Í1Ñ(High) åxÍ0Ñ(Low)$» IC

(79) Refresh §= Ù ¥. E. F«©. Auto Refresh ( t1 )Ê. ]y 60ns~100ns( -. 2. 3. Á2 Clock. 23. Rate( t CK )Ú Ö 10 Â Clock t CK Û6ns¢ Auto Refresh ( t1 )x 6ns × 10 =60ns) sH. h. i. . x t CK Û8nsAuto Refresh ( t1 )x 8ns × 10 =. 80nsÀ(Simulation). G 3.3 3-1 s ¤ . p¾ÄG 3.3 \ Word Line . Line c. d 3.1 xy 85. µ. (Raising Edge)"' . . . . . . !Ü 30nsq. (Falling Edge)Ý.

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(82) . . %

(83) c. Charge. d. G $. Q . . During One Time Refresh Operation (88°C/FF/2.1V/1.55V/3.0V) . . M ³. $. #$. . . ?. 78#$. @ 8K A. @. j$. @4K. Q. %. Q. VPP. -7.76E-11. 25%. -3.10E-10. -9.94. -9.94. VINT_CORE. -1.15E-10. 100%. -1.15E-10. -3.67. -3.67. VINT_PERI. -1.01E-10. 100%. -1.01E-10. -3.25. -1.62. VINTA_CORE. -4.04E-10. 100%. -4.04E-10. -12.93. -12.93. VINTA_PERI. -6.08E-12. 100%. -6.08E-12. -0.19. -0.10. VLOW. 4.49E-11. 40%. 1.12E-10. 3.59. 3.59. 33.57. 31.85. sub total. - 16 -. A.

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(85) 3.3 ATCSR 3.3.1 Refresh . Fuse

(86) . ñSDRAM IDD6(Self Refresh Current)¢£ ¬ IDD6 ÁÂâ Z. ¨ç. Fuse 1 "/å Fuse 2è% % Fuse &!'. IC

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(88) 3.3.2 Refresh . TCSR

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(90) 3.3.3 Refresh G 3.6 xä ®ÁÂ

(91) I v. _ 4. 5. ( I 1 ). «ã W. ë. ATCSR

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(97) . . . . . .

(98). 4.1 H. v. w. / b. Äa. _yv ä. Z. w. û. a. ¨CD. à. CD. CD. â. ý. Z. ATCSR h i b. %CD. |. }. % BCD. IC J ®v. h jþ. â. a. CD. â. P. . &. ¸. a. ü. b. H.. i /. ü. a a. { yCD z. C¿. ATCSR h ò. d»y. éÌ. CD. ra. ¢ym, IC

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(100) Chamber «¨. Å. ® v. ä. w. ÃÏrg. k. î. 4. . )CD. k.

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(103) 4.3 Ä.. /. ¢;xà1.78#C( I REF (Refresh Current)B I OFF ¸. v. (Oscillator)% VTP '. (Junction Leakage) I DC (DC Current))B2. IC

(104) *+ B3.J ùú. &v. ¸. *+. z{ ¸. ¢;v. 5.

(105). 1CD @ z. ¸ v. â. %â. a. ËÌ. Z. B4. ¸. (&v. !(Retention Time)%4 . 4¿ z. C¿. Refresh % I REF '. 5. &!'. B 2CD. z|. }. 4. ra. . IC

(106) 5. (01. (. ÁÂv. ¸. B 3. $. $. 4.3.1 ( I REF I OFF I DC ). 4.3.1.1 CD HCD Ä. . ¤. é¤. ³ HI. '. . 78g. å IC I REF B I OFF I DC #(90)|. 78#%#á. C IDD6 #Î ¡. Z. %â. 7. . ÄCD. Z. â. . 2. }. 6. Test Mode. TMREFDIS(Refresh Disable) Test Mode h Refresh . I OFF + I DC 3. "#¾Äé£. GG 4.4 x I OFF I DC $CHI. Test Mode (No Need). Input. I REF #G 4.3 x IDD6 C 7. G. IC. Measure. Measure IDD6 From VDD Pin. PMU UNIT. Tester Test Chamber. G4.3 : IDD6 C$HI. Test Mode (TMREFDIS). Input. IC. G$. Measure. Measure I OFF + I DC From VDD Pin. PMU UNIT. Tester Test Chamber. G4.4 : I OFF I DC $C$HI. - 26 -. G$.

(107) 4.3.1.2 CD. ra. . k. l. ®CD. x IDD6 Cq. . h. Test Mode(TMREFDIS) i. CD. ra BG 4.6 xC$IDD6 $Pattern ra. I DC $Pattern ra. $. ra. G 4.5. G 4.7 xC I OFF. START #00. ICC236:. NOP. INIT. TS1. LCON= 0. NOP. COUT. TS1 PREA. PCON =0. NOP. COUT. TS1. L0: NOP. COUT. TS1 AUREF. SEND MPAT PATDC1 ; PATTERN DO DCT1 III=1,VCCII,1 ;VDD SEL VS1=VCHAR(III),R10V,M400UA. IDXI8 #6 COUT. TS1. JNI7 L0 COUT. TS1. VS2=VCHAR(III),R10V,M400UA. NOP. XT. TS1 MRS. IN1. = VCHAR(III)-0.2V,0.2V. NOP. COUT. TS1. VT1. = VCHAR(III)/2. NOP COUT L0: JMP L0 COUT. OUT1 = VT1+0.1V,VT1-0.1V GOSUB PGSSM1. ;WAVEFORM. GOSUB TMA070 ; TIMING CALL CALB("PRDSA","NORMAL") SET WET SELECT MPAT INHIBIT LIMIT VS1=ISBHL,NEGLECT REG MPAT PC=#00 ;PC CODE SEL SRON START MPAT * WAIT TIME 100MS MEAS VS1 !100:VICCX STOP MPAT. ;MEASURE. TS1 SELF CKE. STPS G4.6 :C$IDD6 $Patternra. $$. START #00 NOP. INIT. TS1. NOP. COUT. TS1 PREA. NOP. COUT. TS1. L0: NOP. COUT. TS1 AUREF. IDXI8 #6 COUT. TS1. JNI7 L0 COUT. TS1. NOP. XT. TS1 MRS. NOP. COUT. TS1. ;FOR TMREFDIS TEST MODE. SROF. JSR TMODE COUT XT<#1300 TS1. RESET WET. JSR TMODE COUT XT<#1100 TS1. SELECT MPAT NORMAL. JSR TMODE COUT XT<#1201 TS1 NOP COUT TS1 SELF L0: JMP L0 COUT CKE. DCT1: GOTO CONTINE. STPS TMODE:NOP G4.5 :C$IDD6 q. ra. $$. - 27 -. XT. TS1 MRS. RTN G4.7 :C I OFF I DC $Patternra. $$.

(108) 4.3.1.3 C¿ z. IDD6 .VS. VDD. 120 115 110 105 IDD6 100 [uA] 95 90 85 80 2.5 2.4 Sample 1. 2.3 2.2 2.1 Sample 2 Sample 3. 2 1.9 Sample 4. G4.8 :$IDD6 % VDD(Power Supply)'. !#"%$&$('%!*),+ - .,/10. 1.8. 1.7. VDD[V]. (G. Ioff+Idc .VS. VDD. 70 65 60 55 50 45 40 35 30 25 20 2.5. 2.4 Sample 1. 2.3 2.2 Sample 2. 2.1 Sample 3. 2 1.9 Sample 4. G4.9 :$ I OFF + I DC % VDD(Power Supply)'. 1.8 1.7 VDD[V]. (G. IREF .VS. VDD. 70 65 60 55 50 IREF[uA]45 40 35 30 25 20 2.5 2.4 Sample 1. 2.3 2.2 2.1 Sample 2 Sample 3. 2 1.9 Sample 4. G4.10 :$ I REF % VDD(Power Supply)'. - 28 -. (G. 1.8 VDD[V]. 1.7.

(109) 4.3.1.4 ¿ z. ¸ v. ÁG 4.8éÂ. 4 Â Sample IDD6 #Á 1.7V 2.5V ¯. #(95 A~115 A)» # . ( I OFF Ü 30 A3. . #=.

(110) DC Level #(h Ïr¾. i. . . yÊ. ]. ÁG 4.9 I OFF + I DC #(50 A~65 A)0 =. I DC Ü 9 A). Á:g. ¸. v. IC ¯. Â. #x VPP(2.9V)BVLOW(-0.58V) VBB(-0.2V))¾. <. Ã IC

(111) I OFF #0#R R. ß. Ã

(112) DC Level #¿. (C. #x VPP Ü 3.2V~2.95VBVLOW Ü-0.6V~-0.8V VBB Ü-0.2V~-0.35V)ÄÁ :g. IDD6 #v w. . G 4.11 \ DC Tune s IDD6 t . G 4.11 \ VPP&VLOW VPP&VLOW&VBB t VBB #9 !v. w Ä9. 25) -30)|. ,. v. w. ;v. 6 IDD6 t u. v. IDD6 Ö E. é ¸. . w é. w. . w. x, VPPBVLOW. . \ 50 A~80 A. 5 G 4.12 x:g Ò. E. v. v. IDD6 #·4 5. y 90)B. 6î. . ¬. VPP&VLOW. G4.11 :$ IDD6 %

(113) DC Level#9. - 29 -. VPP&VLOW&VBB. :s 9. :;t. 150~400. 140~150. 130~140. 120~130. 110~120. 100~110. 90~100. 80~90. 40~50. 30~40. 20~30. 10~20. 0~10. Before DC Tune. 70~80. IDD6 vs Count. 900 800 700 600 Count 500 [ea] 400 300 200 100 0. 60~70. §î. }. :°. u. 50~60. R. :; IDD6 t. u. u. u. IDD6[uA]. v. w. G. .

(114) IDD6 vs Count 900 800 700 600 Count 500 [ea] 400 300 200. -30'C. 25'C. 90'C. G4.12 :$ IDD6 % 4. 150~400. 140~150. 130~140. 120~130. 110~120. 100~110. 90~100. 80~90. 70~80. 60~70. 50~60. 40~50. 30~40. 20~30. 10~20. 0~10. 100 0. 5. IDD6[uA]. 90)B25) -30). - 30 -. t. u. v. w. G.

(115) 4.3.2 IC (Oscillator) VVTP . 4.3.2.1 CD. %â. HCD. èÁJ 9. å IC

(116) *+. 78g. 6h. i. á. . : VVTP #(*+. (Oscillator)*+. Refresh *+. Bias j)z{ «¤. î. %#. (90)| 3. 2 ÄCD. *+. â. } Z. . TMVTP( VVTP Forcing) Test Mode DQM0 ºhJ j(0V~1.4V) . ». Z. IC

(117) Î *+. K e. L. CHI. TMOSCMON(Oscillator Monitor) Test Mode h*+. èÀ DQM1 ºH ®Äâ. a. . E G 4.13 x*+. *+. K. L. CHI. C IDD6 #G 4.14 xy TMVTP z{. Input. DQM0 Channel. Force. Tester. Oscillator Period From DQM1 Pin. Test Chamber. G4.13 : x*+. Test Mode (TMVTP) & (TMOSCMON). Input. DQM0 Channel. Force. Tester. Monitor. IC. *+. IC. K. L. C$HI. Measure. G4.14: yTMVTPz{. - 31 -. . G$. Measure IDD6 From VDD Pin. PMU. Test Chamber. 6$IDD6 C$HI. G. 6 IDD6 . G. Test Mode (TMVTP) & (TMOSCMON). . G$.

(118) 4.3.2.2 CD. ra. . k. l. . ®CD CD C*+. ra. . h. i. Test Mode(TMVTP) Test Mode(TMOSCMON). G 4.15 xy TMVTP z{. $Pattern ra. 6$IDD6 Cq. ra. $ $G 4.16. $. ICC236:. START #50. LCON= 0. NOP. INIT. TS1. PCON =0. NOP. COUT. TS1 PREA. SEND MPAT PATDC1 ; PATTERN DO DCT2 III=1,VCCII,1 ; VVTP SEL. NOPCOUT. TS1. L0: NOPCOUT. TS1 AUREF. VS1=2.0V,R10V,M400MA. IDXI8 #6 COUT. TS1. VS2=2.0V,R10V,M400MA. JNI7 L0 COUT. TS1. IN1 = 1.8V,0.2V. NOPXT. TS1 MRS. DQM0=2.0V, VCHAR(III). NOPCOUT. TS1. VT1 = 1.0V ;FOR TMVTP TEST MODE JSR TMODE COUT XT<#1300 TS1. OUT1 = 1.1V, 0.9V GOSUB PGSSM1. ;WAVEFORM. GOSUB TMA070 ; TIMING CALL CALB("PRDSB","NORMAL"). JSR TMODE COUT XT<#1101 TS1 JSR TMODE COUT XT<#1204 TS1. SET WET ;FOR TMOSCMON TEST MODE JSR TMODE COUT XT<#1300 TS1. SELECT MPAT INHIBIT LIMIT VS1=ISBHL,NEGLECT REG MPAT PC=#50 ;PC CODE SEL SRON. JSR TMODE COUT XT<#1104 TS1 JSR TMODE COUT XT<#1208 TS1. IF FLAG0=0 THEN ENTRY;FOR IDD6 START MPAT * WAIT TIME 100MS EXIT. NOPCOUT TS1 SELF L0: JMP L0 COUT CKE STPS. MEAS VS1 !100:VICCX STOP MPAT. ;MEASURE TMODE:NOP. SROF. XT. TS1 MRS. RTN. RESET WET SELECT MPAT NORMAL DCT2: GOTO CONTINE G4.15 :TMVTPz{. 6IDD6Cq. ra. - 32 -. $ G4.16 :C*+. Patternra. $.

(119) 4.3.2.3 C¿. 2. z. 4.17:VVTP=0V(Osc=15.6 s). 345 2 2. 4.18:VVTP=0.1V(Osc=15.6 s). 345 2. 2. 4.19:VVTP=0.2V(Osc=15.4 s). 345 2 2. 4.20:VVTP=0.3V(Osc=15.6 s). 345 2. 2. 4.21:VVTP=0.4V(Osc=15.6 s). 345 2 2. 4.22:VVTP=0.5V(Osc=16.2 s). 345 2. 2. 4.23:VVTP=0.6V(Osc=17.6 s). 345 2 2. 4.24:VVTP=0.7V(Osc=19.4 s). 345 2. - 33 -.

(120) 2. 4.25:VVTP=0.8V(Osc=23.2 s). 345 2 2. 4.26:VVTP=0.9V(Osc=32.8 s). 345 2. 2. 4.27:VVTP=1.0V(Osc=46.4 s). 345 2 2. 4.28:VVTP=1.1V(Osc=56.4 s). 345 2. 2. 4.29:VVTP=1.2V(Osc=60.4 s). 345 2 2. 4.30:VVTP=1.3V(Osc=60.8 s). 345 2. 2. 4.31:VVTP=1.4V(Osc=60.8 s). 345 2 - 34 -.

(121) 4.3.2.4 ¿ z. ¸ v. ÁG 4.17~G 4.31 xy23. VVTP #6*+. H. G 4.32G 4.33 xy 0V~1.4V VVTP #6 I REF ' 78g . !. Gk:p; u ÁG 4.32 é7. (t. å IC

(122) VVTP #y 0V~0.5V 1.2V~1.4V.

(123) *+. y 16 s 60 s¾ÄéÁG 4.33 \èÀ VVTP #«v. *+. 1 . 16.2 s ( VVTP =0.5V)B. 17.6 s( VVTP =0.6V)B19.4 s( VVTP =0.7V)B23.2 s ( VVTP =0.8V)B32.8 s( VVTP =0.9V) B46.4 s( VVTP =1.0V)B56.4 s( VVTP =1.1V) 60.4 s( VVTP =1.2V) 8 *+ ÁG 4.33 § . . I REF #¾*+ % & î ¬(Á 40 A î V 15 A)¾ E. ÄhG 4.32 G 4.33 :pÃG 4.34é '. . E. VVTP #6*+. y23. % I REF. ( Osc. .VS. VVTP. 65 60 55 50 45 40 Osc.[uS] 35 30 25 20 15 10 5 0 0. 0.1. 0.2. 0.3. G4.32 :$*+. 0.4. 0.5. 0.6. 0.7. 0.8. % VVTP '. 0.9. (t. 1. u. G. 0.6 0.7 0.8 0.9 DUT03 DUT04. 1. 1.1. 1.2 1.3 1.4 VVT P [V]. 1.1. 1.2 1.3 1.4 VVT P [V]. IREF .VS. VVTP. 42 40 38 36 34 32 30 28 IREF[uA]26 24 22 20 18 16 14 12 10 0. 0.1 0.2 DUT01. 0.3 0.4 DUT02. 0.5. G4.33 :$ I REF % VVTP '. - 35 -. (t. u. G.

(124) >> 67 ==,7;7 6677 Osc. <<%6 7 [uS] : :;8 67 8967 67. Osc.&IREF .VS. VVTP. 45 40 35 30 25 IREF 20 [uA] 15 10 5 0. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 VVT P [V] OSC IREF. G4.34 :$*+. & I REF % VVTP '. - 36 -. (t. u. G.

(125) 4.3.3

(126) . 4.3.3.1 CD. Refresh I REF . %â. HCD. èÁJ 9. IC I REF #yJ 9 â. Z. . Z : Refresh z{. : Refresh 6î. %#. 3. «¤. (90)| }. 78g. å. 6ÄCD. TMPADREF(Refresh Period Forcing) Test Mode DQM1 º. hJ Refresh (0V~1.4V)» Refresh K L. z{. Test Mode (TMPADREF). IC

(127) C IDD6 #G 4.35 xJ. 6 IDD6 CHI. G. Input Measure. IC DQM1 Channel. Tester. Measure IDD6 From VDD Pin. Force. PMU. Test Chamber. G4.35: yJ RefreshK L. - 37 -. z{. 6IDD6C$HI. G$.

(128) 4.3.3.2 CD. ra. . k. l. ®CD. . h. 4.36 xJ Refresh K $Pattern ra. Test Mode(TMPADREF) i. L. z{. 6 IDD6 Cq. ra. CD. ra. $ $G 4.37 . G$ Refresh. $. PADREF:. START #A0. LCON= 0. NOP. INIT. TS1. PCON =0. NOP. COUT. TS1 PREA. SEND MPAT PATDC1 ; PATTERN. NOPCOUT. DO DCT2 III=1,VCCII,1 ;PERIOD SEL. L0: NOPCOUT. TS1 TS1 AUREF. RATE=<4>TMUS<III>;PERIOD RATE VS1=2.0V,R10V,M400MA. IDXI8 #6 COUT. TS1. JNI7 L0 COUT. TS1. VS2=2.0V,R10V,M400MA. NOPXT. TS1 MRS. IN1 = 1.8V,0.2V. NOPCOUT. TS1. VT1 = 1.0V ;FOR TMPADREF TEST MODE JSR TMODE COUT XT<#1300 TS1. OUT1 = 1.1V, 0.9V GOSUB PGSSM1. ;WAVEFORM. GOSUB TMA070 ; TIMING CALL CALB("PRDSB","NORMAL"). JSR TMODE COUT XT<#1100 TS1 JSR TMODE COUT XT<#1208 TS1. SET WET SELECT MPAT INHIBIT. NOPCOUT TS1 SELF CKE L0: JMP L0 COUT . LIMIT VS1=ISBHL,NEGLECT REG MPAT PC=#A0 ;PC CODE SEL SRON. STPS. START MPAT *. TMODE:NOP. XT. TS1 MRS. WAIT TIME 100MS MEAS VS1 !100:VICCX STOP MPAT. ;MEASURE. RTN. SROF RESET WET SELECT MPAT NORMAL DCT2: GOTO CONTINE G4.36 : J RefreshK. IDD6Cq. ra. L. z{ $$. 6. G4.37 :. - 38 -. Refresh$Patternra. $.

(129) 4.3.3.3 C¿ z. IREF.VS.Refresh Period. 105 100 95 90 85 80 75 70 65 60 IREF 55 [uA] 50 45 40 35 30 25 20 15 10 5 0. . . 12. 14. 16. Sample 1. 20. 24. Sample 2. 28 Sample 3. z v. 48. 64. 128. 196. 256. Refresh Period[uS]. Sample 4. 6 I REF #%Refresh'. G4.38: yJ Refreshz{. 4.3.3.4 ¿. 32. . Refresh . (G$. ¸. ÁG 4.38J Refresh À 12 s V 256 s¢ I REF #· Refresh %. &. . 6î. 01y.. /. h. i. á. . Refresh *+. 4.3.2 4.3.3 I REF # 4.1 .. 1¾ÄéÒ. /. 2 ¾Ä. *+. 4.3.2 %. /. å IC

(130) Refresh Ü*+. ] 78g. 4.3.3 I REF #0 *+. 2. 4.1 :$. /. 4.3.2 32 s(Osc:16). .. .. I REF # /. 4.3.3. I REF #. /. 4.3.2 %. /. 4.3.3 I REF #01. 46.8 s(Osc:23.4). 62.8 s(Osc:31.4) 122.4 s(Osc:61.2). 37.8 A. 29.2 A. 22.6 A. 15.8 A. 32 s. 48 s. 64 s. 128 s. 37.8 A. 27.2 A. 19.2 A. 12.4 A. - 39 -.

(131) 4.3.4 . 4.3.4.1 CD. IC Z. %â. HCD. è. *+. (Oscillator)*+. z{. (. z|. î. z Test Chamber 4. Mode h*+. *+. K. Test Mode (TMOSCMON). 4. z{. %#. ) 5. 5. 3. *+ }. 4. 5. K. L. CHI. Input. Z â. . Ge. E. ®Äâ. Test Mode (TMOSCMON). 4. 5. z{. Input. 6*+. a. }. 4. 4. 5. . C IDD6 . From DQM1 Pin. *+. K. L. 5. z{. - 40 -. C$HI. 6$IDD6 C$HI. G$. Measure IDD6 From VDD Pin. PMU. Test Chamber. G4.40: y|. }. Oscillator Period. Measure. IC. Tester. z|. G. Monitor. IC. }. . À DQM0 ºC e. Test Chamber. G4.39 : y|. å IC

(132) . 78g. ÄCD. 6 IDD6 CHI. z{. Tester. «¤. TMOSCMON(Oscillator Monitor) Test. èÀ DQM1 ºH L. VVTP #G 4.39 x*+ #G 4.40 xy|. }. G$.

(133) 4.3.4.2 CD. . k. l. . 5. z{. ®CD. 4.41 xy|. . ra. }. 4. $Pattern ra. h. i. 6*+. Test Mode(TMOSCMON) *+. K. L. Cq. ra. CD. ra. G$. $ $G 4.42 xC*+. $. ICC236:. START #100. LCON= 0. NOP. INIT. TS1. PCON =0. NOP. COUT. TS1 PREA. SEND MPAT PATDC1 ; PATTERN VS1=2.0V,R10V,M400MA. NOPCOUT L0: NOPCOUT. TS1 TS1 AUREF. VS2=2.0V,R10V,M400MA. IDXI8 #6 COUT. TS1. IN1 = 1.8V,0.2V. JNI7 L0 COUT. TS1. VT1 = 1.0V. NOPXT. TS1 MRS. OUT1 = 1.1V, 0.9V. NOPCOUT. TS1. ;WAVEFORM. GOSUB PGSSM1. GOSUB TMA070 ; TIMING CALL CALB("PRDSB","NORMAL"). ;FOR TMOSCMON TEST MODE JSR TMODE COUT XT<#1300 TS1. SET WET. JSR TMODE COUT XT<#1104 TS1. SELECT MPAT INHIBIT. JSR TMODE COUT XT<#1208 TS1. LIMIT VS1=ISBHL,NEGLECT REG MPAT PC=#100 ;PC CODE SEL SRON IF FLAG0=0 THEN ENTRY;FOR IDD6 START MPAT * WAIT TIME 100MS. NOPCOUT TS1 SELF L0: JMP L0 COUT CKE STPS TMODE:NOP. EXIT. XT. TS1 MRS. RTN. MEAS VS1 !100:VICCX STOP MPAT. ;MEASURE. SROF RESET WET SELECT MPAT NORMAL GOTO CONTINE G4.41 :$y| *+. *+. K. L. }. 4. 5. z{. Cq. G4.42 :C*+. 6$ ra. $$. - 41 -. $Patternra. $$.

(134) 4.3.4.3 C¿ z. G4.43 :4 5. 25°C ( OSC=24.6 s )$. G4.44 :4 5. 45°C ( OSC=22.6 s )$. G4.45 :4 5. 70°C ( OSC=15.8 s )$. G4.46 :4 5. 90°C ( OSC=15.2 s )$. - 42 -.

(135) 4.3.4.4 ¿. H. z. ¸ v. ÁG 4.43~G 4.46 xy23. 4. G 4.2 x23. 678 IC *+. 8*+. 4. %° . 0.5V¾Äe f. ô. ó. Z¼. ì. #) 9. *+. #. " . =. á. :; *+. ç. %#01 7. ü. Fuse «9. H. : VVTP #V 0.6V(. R1 V Rm . GG 4.47~G 4.50» 9 :;*+. I REF % VVTP '. :;*+. (t. :;. %#01 u. G$. $ $ 4.2 :$23. 6 78IC*+. 4. 5. %#01. 5. 25). 45). 70). 90). 78*+. . 24.6 s. 22.6 s. 15.8 s. 15.2 s. *+. . 47.7 s. 44.7 s. 27.0 s. 15.6 s. #. 23.1 s. 22.1 s. 11.2 s. 0.4 s. 4.3 :$23. 4. . 4. á. . 5. 6 9. :;*+. %#01. 5. 25). 45). 70). 90). 78*+. . 40.2 s. 37.2 s. 25.2 s. 15.6 s. *+. . 47.7 s. 44.7 s. 27.0 s. 15.6 s. 7.5 s. 6.5 s. 1.8 s. 0.0 s. . á. 4. . #. . #y 90)6À DQM0 VVTP #Ü . (Laser)â a. 6(25)B45)B70) 90))*+. Z# 4.3 x9 A. G 4.51 x9. 5. 5. - 43 -.

(136) G4.47 :4 5. 25°C ( OSC=40.2 s )$. G4.48 :4. G4.49 :4 5. 70°C ( OSC=25.2 s )$. G4.50 :4. 45°C ( OSC=37.2 s )$ 5. 5. 90°C ( OSC=15.6 s )$. Osc.&IREF VS Temperature(VVTP) 45 40 35 30 Osc 25 [uS] 20 15 10 5 0. ?. ?. 90 (0.60V) 70 (0.77V) Osc. IREF. G4.51 :$9. :;*+. 55. ?. (0.92V). ?. 25 (0.95V). & I REF % VVTP '. - 44 -. 45 40 35 30 25 IREF 20 [uA] 15 10 5 0. Temperature(VVT P ). (t. u. G.

(137) 4.3.5 (Retention Time) . 4.3.5.1 CD HCD 78g. Z. è. å IC . z|. }. 4. 5. z{. . z|. }. 4. 5. (. z{. 5. z{. 78g 5. ¹. ST. UM. å IC yÄ4. N 5. . )«CD. Ý. î. 6. &!CrG¤. Refresh î. 4. UM. 5. ) . . Õ. í. 6 e. f. ê. . NÍ0Ñ Í1Ñµ Ò. !¨é¤. 4. 5. Pause t Read “0”. T=T+20C. Pass/Fail Pass Write “1” Pause t Read “1”. Fail. Pass/Fail. Pass Record t G4.52 :$ . !(Retention Time)%4. - 45 -. 5. !x. 6. Write “0”. Fail. #. !%4. @. t = t-5MS. ß. #. Ñß. Start t=30S,T=5 C Refresh Disable. $. z ¿. ÄCD. Refresh (ÀJ ùú Ý. ¸. TMREFDIS. !(Retention Time)G 4.52 x 5. )«¤ 5. (Äv. dCD. xÍ0Ñ Í1ÑÄÍ<. . 4. p CD. . z Test Chamber 4. (Refresh Disable) Test Modeh°ST !;Î. ( . !(Retention Time)% Refresh ' . ÁÂx ATCSR(Refresh ·4. ùE â. Z. %â. &!CrG. Refresh.

(138) 4.3.5.2 CD. ra. . k. l. ®CD. 4.53 x Patternra. . h. Test Mode(TMREFDIS) i. !(Retention Time)Cq . ra. CD. $G4.54 xC. ra. G$. . !. $. TREF:. MODE PAUSE. LCON= 0. REGISTER. PCON =0. TIMER=400MS START #150 ; PATTERN. NOP. INIT. TS1. NOP. COUT. TS1 PREA. VS1=2.0V,R10V,M400MA. NOP. COUT. TS1. VS2=2.0V,R10V,M400MA. L0: NOP. COUT. TS1 AUREF. SEND MPAT. PATAC1. IN1 = 1.8V,0.2V. IDXI8 #6 COUT. TS1. VT1 = 1.0V. JNI7 L0 COUT. TS1. OUT1 = 1.1V, 0.9V. NOPXT NOP. TS1 MRS COUT. TS1. GOSUB PGSSM1. ;WAVEFORM. ;FOR TMREFDIS TEST MODE. GOSUB TMA070. ; TIMING. JSR TMODE COUT XT<#1300 TS1 JSR TMODE COUT XT<#1100 TS1. CALL CALB("PRDST","NORMAL"). JSR TMODE COUT XT<#1201 TS1 NOP INIT TS1. REG MPAT PC=#150 ;PC CODE SEL. L0: NOP. COUT. TS1 ACT. NOP. COUT. TS1 NOP. CALL SHM2(STATIC) ;RUN SHMOO. NOP W COUT. TS1 WRIT. JNI3 L0 ACOUT TS1 PREA GOTO CONTINE. NOP L1: NOP. T COUT. TS1 ACT. NOP. COUT. TS1 NOP. NOP R COUT. TS1 READ. JNI3 L1 ACOUT TS1 PREA JZD L0 STPS TMODE:NOP. XT. TS1 MRS. RTN G4.53 :$ . !(Retention Time)$ Cq. ra. $ - 46 -. G4.54 :C . !Patternra. $.

(139) 4.3.5.3 C¿ z. G4.55 : . 25. 45. 70. !(Retention Time)%4. - 47 -. 5. 90. '. 5~10. 4.5~5. 4~4.5. A. 3.5~4. 3~3.5. A. 2.5~ 3. 2~2.5. A. 1.5~ 2. A. 0.7~1. 0.5~0.7. A. 0.4~0.5. 0~0.4. 5. 1~1.5. Retention Time .VS. Count. 42 40 38 36 34 32 30 28 26 24 Count 22 [ea] 20 18 16 14 12 10 8 6 4 2 0. Rentenation Time[Second]. (&~t. u. v. w. G$.

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