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生醫用熱降解型高分子光彈解析之相關研究 Photoelastic Analysis of Thermo-degradable Polymer for Biomedical use

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生醫用熱降解型高分子光彈解析之相關研究

Photoelastic Analysis of Thermo-degradable Polymer for Biomedical use

中文摘要

論文名稱:生醫用熱降解型高分子光彈解析之相關研究 私立台北醫學大學口腔復健醫學研究所

指導教授:李勝揚博士

台北醫學大學口腔復健醫學研究所 教授兼所長 共同指導教授:曾厚博士

台北醫學大學醫學研究所 副教授

生物可吸收性高分子材料在植入人體後,隨著組織的修復,其會慢慢的降解成 小分子被人體吸收進而隨著身體代謝排出體外,具有如良好的生物相容性、合適 的堅硬度、生物可吸收可代謝性,且無需第二次手術移除等優點。因此近年來可 吸收高分子材料的開發應用,使骨內固定裝置發生質上的進步和轉變,而聚乳 酸(PLA)又是其中最受矚目的材料之一。然而,目前的研究多針對於如何對生 物可吸收性聚乳酸高分子施以不同加工條件。對於所合成之高分子,能否有一樣 便利易行、非破壞性且能精確反應出所合成之高分子性質的檢測工具,以作為高 分子合成時品質的即時監控。這方面的研究至今仍未獲得一清楚的了解。

光彈檢測可用來偵測物品內應力狀態,且為非破壞性檢測,對於臨床所使用的 材料在應力分布分面的研究上有其優越性,已廣泛的應用於牙醫學研究中。因此 本研究以改變聚乳酸製程時加熱溫度與加熱時間為控制變因,將光彈檢測所觀 測之現象,與聚乳酸基本材料性質之分子量、結晶度、機械強度等參數相互比較 評估以光彈檢測作為聚乳酸品質監控參數的可行性,

經實驗發現當聚乳酸製程參數改變時,光彈檢測下所反映出內應力條紋分布狀 態變化情形與聚乳酸高分子之基本性質如分子量、結晶度等改變的趨勢均相似。

因此進一步研究後,利用光彈檢測找出聚乳酸之最佳製程條件,以及消除應力 之方法,提高製成品強度是可預期的。並可在未來將光彈檢測非接觸、非破壞性 的特性,作為生產線上產品之品質管制(QC)的最佳工具之一。

關鍵辭:聚乳酸、光彈檢測法、結晶性、熱性質、彎曲模數

英文摘要

Thermal degradable polymer (e.g. polylactic acid) is characterized by its photo- elasticity. During the polymerization process, its crystallization and mechanical properties are critically affected by temperature, pressure and other processing condition. Whether the magnitude and location of the residual stress inside a polymer are also affected by the processing conditions is unclear. This study used polymerization of lactic acid into #20 (pure PLLA) and #30 (95% PLLA and 5%

PDLA) under different processing conditions (e.g. heating temperature, heating

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time) as experimental model. Photoelastic analysis apparatus,MTS, were used to examine the distribution of residual stress inside the polymerized product and its relationship with the breaking point; X-ray diffractometer and Gel Permeation Chromatography were used to examine the relationship between crystallization, molecular weight and distribution of residual stress. The results showed a non- linear log regression in stress (i.e.no.of fringe order ) of #20 and #30 under different processing temperature. The fringe order in #20 was gradually reduced with the processing temperature increasing from 170°C to 190°C, indicating a degradation of PLLA and a reduction of internal stress under higher temperature.

The stress in #30 was however the lowest at a processing temperature of 160°C when the temperature was increased from 150°C to 170°C. These results suggest that photoelastic analysis is a convenient and non-invasive technique that can be used to accurately examine the internal stress of a polymer product. It can be used as an important indication for the best processing procedure for high- molecule injection processes and quality control of the products.

Key words: PLA, photoelastic analysis, crystallnility, annealing, Bending modulus

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