[PDF] Top 20 Thermomigration in flip-chip SnPb solder joints under alternating current stressing
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Thermomigration in flip-chip SnPb solder joints under alternating current stressing
... Electromigration in flip-chip solder joints has attracted a lot of attention in recent years due to the miniaturization trend in high-performance ...the current ... See full document
4
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
... heating in the silicon chip generates a thermal gra- dient in a flip-chip solder ...high current stressing also produces a nonuniform tem- perature distribution, ... See full document
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Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
... applied current densities were wrongly ...correct current densities is shown below. In addition, the value of ...” in the abstract, on p. 152105, and in figure caption of ... See full document
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In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing
... The current density simulation yields information on the electron flow direction and the density at every location. Figure 7a shows the information at selected locations. Based on the assumption that the migration ... See full document
6
Thermomigration of Ti in flip-chip solder joints
... migrate under a thermal ...Ti in solder joints. In this study, thermomigration tests were performed in flip-chip solder joints with Cu/Ti UBMs where Ti ... See full document
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Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
... local current density but possessed a tempera- ture higher than the hot-spot value described ...located in the right-hand side of the hot spot and close to the underfill, as marked by one of the white ... See full document
7
Thermal gradient in solder joints under electrical-current stressing
... the solder bump. In general, most joule heating is generated in the Al trace on the Si chip side because its electrical resistance is at least one order of magnitude larger than those of the ... See full document
5
Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints
... form in the chip/anode side for bump ...the flip chip solder joints at 165 ° C for 90 h, by taking into account the higher temperature due to Joule heating, we found no void ... See full document
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Joule heating effect under accelerated electromigration in flip-chip solder joints
... distribution in the solder bump, Figure 8(a) shows the distribution in the solder bump only, in which the Al pad, UBM, IMC layer, and the BT substrate were ...arrow in the ... See full document
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Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization
... of solder joints can be predicted ...temperature in solder bumps during current stressing. In addition, Kelvin bump probes were used to monitor the bump resistance during ... See full document
7
Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
... applied current, the Joule heating power is proportional to the total resistance of the stressing ...the stressing circuit configuration with smaller total resistance. In addition, for the ... See full document
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Effect of bump size on current density and temperature distributions in flip-chip solder joints
... for current density, Q is the activation energy, k is Boltzmann’s constant, and T is the aver- age bump temperature in degrees ...application in solder joints. In this letter, ... See full document
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Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
... failures in SnAg solder bumps with and without Cu column UBMs have been investigated under a current density of ...SnAg solder bumps with 2 lm Ni UBMs were stressed at ...occurred ... See full document
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Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration
... potential. In this paper, two different substrate sur- face finishes, Au/Ni and organic solderable preser- vative (OSP)/Cu, were used in combination with the Cu/Ni/Al UBM to study the effect of the surface ... See full document
7
Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
... the current, R is the resistance, j is the local current density, V is the volume of the material, and is the ...volume. In our simulation model, the total resistance of the Al trace was about 900 ... See full document
4
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
... [email protected] Flip-chip solder joints with Cu/Ni/Al underbump metallurgy (UBM) on the chip and an Au/Ni surface finish on the substrate were studied under current ... See full document
6
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
... for in situ observation in electromigration, and the arrows indicate the direction of electron ...drift in the Al trace and then enter the left bump on from the upper-right ...The chip side of ... See full document
5
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
... the current stressing, which is an in- crease of ...arrow in the figure. This condition is denoted as stage I in this ...form under the IMC layer in the left corner of the ... See full document
4
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
... occurred in the Al trace instead of inside solder bumps under this stressing ...before current stressing at 100 ° ...brighter in the image. The Al trace can be clearly ... See full document
4
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization
... limited in the thin-film ...to current stressing, current crowding leads to a rapid dissolution of the 5-m-thick Cu UBM at the corner where electrons entered from Al interconnect to Cu UBM ... See full document
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