Erratum: “Thermomigration in flip-chip SnPb solder joints under alternate current
stressing” [Appl. Phys. Lett.90, 152105 (2007)]
Hsiang-Yao Hsiao and Chih Chen
Citation: Applied Physics Letters 90, 249902 (2007); doi: 10.1063/1.2748851 View online: http://dx.doi.org/10.1063/1.2748851
View Table of Contents: http://scitation.aip.org/content/aip/journal/apl/90/24?ver=pdfcov Published by the AIP Publishing
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Erratum: “Thermomigration in flip-chip SnPb solder joints under alternate
current stressing”
†Appl. Phys. Lett. 90, 152105 „2007…‡
Hsiang-Yao Hsiao and Chih Chena兲
Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu, 30010 Taiwan, Republic of China
共Received 21 May 2007; accepted 21 May 2007; published online 15 June 2007兲 关DOI:10.1063/1.2748851兴
The applied current densities were wrongly calculated. The revised Fig.3with correct current densities is shown below. In addition, the value of “9.2⫻104A / cm2” in the abstract, on p. 152105, and in figure caption of Fig. 2共b兲 should be modified
as “9.7⫻103A / cm2.” The value of “5⫻104A / cm2” on p. 152105 should be revised as “5.3⫻103 A / cm2.” These corrections
do not affect any other part of the article and the conclusions.
a兲Electronic mail: [email protected]
FIG. 3. The measured temperature increases in the bump as a function of applied current and current densities.
APPLIED PHYSICS LETTERS 90, 249902共2007兲
0003-6951/2007/90共24兲/249902/1/$23.00 90, 249902-1 © 2007 American Institute of Physics
This article is copyrighted as indicated in the article. Reuse of AIP content is subject to the terms at: http://scitation.aip.org/termsconditions. Downloaded to IP: 140.113.38.11 On: Thu, 01 May 2014 00:25:59
