第五章 結論與未來展望
5.2 未來展望
熱電材料接合技術中，界面性質、電性、接合強度等分析，對於熱電元 件的好壞判別均是必頇量測觀察的，所以希望未來能繼續對於以下幾點進行 實驗檢測：
1.
希望進一步將時效模擬溫度靠近熱電元件適合的工作溫區之詴片，進行接合強度測詴，以達到未來能夠運用在有環境外力的場合中。
2.
電性量測方面，希望能夠將單接腳的熱電元件串聯成對，由此可以 對於單對或多對的熱電元件模組進行轉換效率之性質測詴。92
參考文獻
【1】 經濟部能源局，中華民國 101 年能源統計手冊，台灣，2012。
【2】 http://oee.nrcan.gc.ca/sites/oee.nrcan.gc.ca/files/pdf/commercial/passwo rd/downloads/EMS_20_waste_heat_recovery.pdf.
【3】 F. J. DiSalvo, “Thermoelectric cooling and power generation”, Science, Vol. 285(5428), p. 703, 1999.
【4】 柯文賢，「熱電轉換及其應用」，科技發展政策報導，第 5 期，51-65，
2007。
【5】 https://www.itri.org.tw/chi/news/detail.asp?RootNodeId=060&NodeId=
061&NewsID=673.
【6】 A. D. LaLonde, Y. Pei, H. Wang, G. J. Snyder, “Lead telluride alloy thermoelectrics”, Materials Today, Vol. 14(11), pp. 526-536, 2011.
【7】 http://www.physics.arizona.edu/~pjacquod/Site/Thermoelectricity_files /bmw.pdf.
【8】 莊東漢、葉威廷、黃振東、謝慧霖，「熱電模組接合技術及其挑戰」， 工業材料雜誌，第 322 期，072-079，2013。
【9】 T. M. Ritzer, P. G. Lau, A. D. Bogard, “A critical evaluation of today's thermoelectric modules”, International Conference on Thermoelectrics, pp. 619-623, 1997.
【10】 K. T. Wojciechowski, M. Schmidt, R. Zybala, J. Merkisz, P. Fuć, P.
Lijewski, “Comparison of waste heat recovery from the exhaust of a spark ignition and a diesel engine”, Journal of Electronic Materials, Vol.
39, pp. 2034-2038, 2010.
93 figure of merit”, Physical Review B, Vol. 53(16), pp. 493-496, 1996.
【14】 H. Beyer, J. Nurnus, H. Böttner, A. Lambrecht, T. Roch, G. Bauer,
“PbTe based superlattice structures with high thermoelectric efficiency”, Applied Physics Letters, Vol. 80(7), pp. 1216-1218, 2002.
【15】 Y. Pei , J. L. Falk , E. S. Toberer, D. L. Medlin , G. J. Snyder,“High thermoelectric performance in PbTe due to Large nanoscale Ag2Te precipitates and La-doping“, Advanced functional materials, Vol. 21, pp. 241-249, 2011.
【16】 J P. Heremans, V. Jovovic, E. S. Toberer, A. Saramat, K. Kurosaki, A.
Charoenphakdee, S. Yamanaka, G. J. Snyder, “Enhancement of thermoelectric efficiency in PbTe by distortion of the electronic density of states“, Science, Vol. 321, p. 554, 2008.
【17】 G. Xu, Y. Gao, C. Ge, W. Shen, “Thermoelectric properties of p-type (Bi0.15Sb0.85)2Te3 -PbTe graded thermoelectric materials with different barriers“, Journal of University of Science and Technology Beijing, Vol. 12(4), pp. 347-350, 2005.
94
【18】 K. Qiu, A.C.S. Hayden, “Development of a thermoelectric self-powered residential heating system”, Journal of Power Sources, Vol. 180, pp. 884-889, 2008.
【19】 朱旭山、徐振庭，「薄型熱電元件在環境環境能源擷取之應用與發 展方向」，工業材料雜誌，第 322 期，087-093，2013。
【20】 吳奕諼，“碲化鉍合金熱電薄膜發電器之設計與製造”，國立臺灣科 技大學，碩士學位論文，2009。
【21】 A. Schmitz, C. Stiewe, E. Müller, “Preparation of ring-shaped thermoelectriclegs from PbTe powders for tubular thermoelectric modules”, Journal of Electronic Materials, Vol. 42(7), pp. 1702-1706, 2013.
【22】 M. Kubo, T. Itoh, K. Tokuda, J. Shan, K. Kitagawa, “Fabrication of layered p-type AgSbTe2-(Bi,Sb)2Te3 thermoelectric module and its performances”, International Conference on Thermoelectrics, pp.
429-432, 2003.
【23】 O. Yamashita, H. Odahara, S. Tomiyoshi, “Effect of metal electrode on thermoelectric power in bismuth telluride compounds”, Journal of Materials Science, Vol. 39, pp. 5653-5658, 2004.
【24】 J. Fan, L. Chen, S. Bai, X. Shi, “Joining of Mo to CoSb3 by spark plasma sintering by inserting a Ti interlayer”, Materials Letters, Vol. 58, pp. 3876–3878, 2004.
【25】 D. Zhao, X. Li, L. He, W. Jiang, L. Chen, “High temperature reliability evaluation of CoSb3 electrode thermoelectric joints”, Intermetallics, Vol.
17, pp. 136-141, 2009.
95
【26】 C. Long, Y. Yan, J. Zhang, B. Ren, Z. Wang, “New integration technology for PbTe element”, International Conference on Thermoelectrics, pp. 386-391, 2006.
【27】 A. Singh, S. Bhattacharya, C. Thinaharan, D. K. Aswa, S. K. Gupta, J.
V. Yakhmi, K. Bhanumurthy, “Development of low resistance electrical contacts for thermoelectric devices based on n-type PbTe and p-type TAGS-85((AgSbTe2)0.15(GeTe)0.85)”, Journal of Physics D: Applied Physics, Vol. 42(1), pp. 1-6, 2009.
【28】 S. Nakamura, Y. Mori, K. Takarabe, “Analysis of the microstructure of Mg2Si thermoelectric devices”, Journal of Electronic Materials, 2014.
【29】 K. Hasezaki, H. Tsukuda, A. Yamadal, S. Nakajimaz, Y. Kang, M.
Niino, “Thermoelectric semiconductor and electrode-fabrication and evaluation of SiGe/electrode”, International Conference on Thermoelectrics, pp. 599-602, 1997.
【30】 K. Hasezaki, H. Tsukuda, A. Yamada, S. Nakajima, Y. Kang, M. Niino,
“SiGe/electrode response to long-term high-temperature exposure”, International Conference on Thermoelectrics, pp. 460-463, 1998.
【31】 H. Ono, T. Nakano, T. Ohta, “Diffusion barrier effects of transition metals for Cu/M/Si multilayers (M=Cr, Ti, Nb, Mo, Ta, W)”, Applied Physics Letters, Vol. 64(12), pp. 1511-1513, 1994.
【32】 G. Xu, Y. Gao, C. Ge, W. Shen, “Thermoelectric properties of p-type (Bi0.15Sb0.85)2Te3-PbTe graded thermoelectric materials with different barriers”, Journal of University of Science and Technology Beijing, Vol.
12(4), pp. 347-350, 2005.
96
【33】 Y.C. Lan, D.Z. Wang, G. Chen, Z.F. Ren, “Diffusion of nickel and tin in p -type (Bi,Sb)2Te3 and n -type Bi2(Te,Se)3 thermoelectric materials”, Applied Physics Letters, Vol. 92, pp. 1-3, 2008.
【34】 M. Orihashi, Y. Noda, L. Chen, Y.S. Kang, A. Moro, T. Hirai, “Electric properties of Ni/n-PbTe and Ni/p-Pb0.5Sn0.5Te joined by plasma activated sintering”, International Conference on Thermoelectrics, pp.
543-546, 1998.
【35】 H. Xia, F. Drymiotis, C.L. Chen, A. Wu, G.J. Snyder, “Bonding and interfacial reaction between Ni foil and n-type PbTe thermoelectric materials for thermoelectric module applications”, Journal of Materials Science, Vol. 49, pp. 1716-1723, 2014.
【36】 吳騌豪，“碲化鉛/奈米銀複合粉體之製備及其火花電漿燒結體之熱 電性質研究”，國立成功大學，碩士學位論文，2009。
【37】 Y. Gelbstein, G. Gotesman, Y. Lishzinker, Z. Dashevsky , M.P. Dariel,
“Mechanical properties of PbTe-based thermoelectric semiconductors”, Scripta Materialia, Vol. 58, pp. 251-254, 2008.
【38】 李昂倖，“碲化鉛熱電材料與銅電極之填料接合性質研究”，國立 臺灣師範大學，碩士學位論文，2012。
【39】 A. J. Strauss, “Effect of Pb- and Te- saturation on carrier concentrations in impurity-doped PbTe”, Journal of Electronic Materials, Vol. 2(4), pp. 553-569, 1973.
【40】 Y. Pei, A. F. May, G. J. Snyder, “Self-tuning the carrier concentration of PbTe/Ag2Te composites with excess Ag for high thermoelectric performance”, Advanced Energy Materials, Vol. 1, pp. 291-296, 2011.
97
【41】 C.P. Cheng, Y.S.Ke, M.J. Dai, C.K. Liu, L.L.Liao, C.H Cheng,
“High-temperature failure analysis of thermoelectric PbTe module using Al-Si bonding”, International Conference on Thermoelectrics, 2013.
【42】 T.B. Massalski, H.Okamoto, Binary alloy phase diagrams, ASM International, 1990.
【43】 S. Bader, W. Gust, H. Hieber, “Rapid formation of intermetallic compounds interdiffusion in the Cu-Sn and Ni-Sn systems”, Acta Metallurgica et Materialia, Vol. 43(1), pp. 329-337, 1995.
【44】 T. Laurila, V. Vuorinen, J.K. Kivilahti, “Interfacial reactions between lead-free solders and common base materials”, Materials Science and Engineering: R: Reports, Vol.49(1-2), pp. 1-60, 2005.
【45】 J.P. Coughlin, J.J. Williams, G.A. Crawford, N. Chawla, “Interfacial reactions in model NiTi shape memory alloy fiber-reinforced Sn matrix
„„Smart‟‟ composites”, Metallurgical and Materials Transactions A, Vol.
40A, pp. 176-184, 2009.
【46】 D. C. Yeh , H. B. HunSngton, “Extreme fast-diffusion system : nickel in single-crystal Sn” , Phys. Rev. Lett., Vol.53(15), pp. 1469-1472, 1984.
【47】 H.S. Dow, M.W. Oh, B.S. Kim, S.D. Park, B.K. Min, H.W. Lee, D.M.
Wee, “Effect of Ag or Sb addition on the thermoelectric properties of PbTe”, Journal of Applied Physics, Vol. 108, pp. 1-7, 2010.
【48】 J. Andrieux, O. Dezellus, F. Bosselet, M. S. Peronnet, C. Sigala, R.
Chiriac, J.C. Viala, “ Details on the formation of Ti2Cu3 in the Ag-Cu-Ti system in the temperature range 790 to 860℃”, Journal of Phase Equilibria and Diffusion, Vol. 29, pp. 156-162, 2008.
98
【49】 W.P. Lin, D.E. Wesolowski, C.C. Lee,“Barrier/bonding layers on bismuth telluride (Bi2Te3) for high temperature thermoelectric modules”, Journal of Materials Science: Materials in Electronics, Vol.
22, pp. 1313-1320, 2011.