6.1 結論
本論文目的是研究大規模產出下，半導體廠應該採取何種設計方案。針對此 議題，本研究分成三個子題進行研究，各子題的研究貢獻分述如下：
子題一是發展單廠區最適運輸軌道層數設計的方法，此子題過去並無文獻探 討，本研究應可視為首創性研究。子題一分成兩階段求解，階段一提出了單廠區 最適機台數目的決定方法，階段二則提出了單廠區最適運輸軌道層數設計的方 法，可提供作為未來單廠區半導體廠房設計時的參考依據。實例驗證說明運輸軌 道在大規模晶圓廠時很容易成為生產瓶頸，因此可能需要設置多層軌道的運輸系 統，亦即廠房高度需要適度加高，此中資訊對於建築師非常重要，若未能在建築 廠房即考慮建築高度，到最後可能因為運輸軌道成為瓶頸，而使機台的產能無法 充分發揮。
子題二是發展一個可快速求解的雙廠區跨廠途程規劃方法，亦分成兩階段求 解。階段一說明各產品途程切割點的選擇方式，階段二則說明途程生產比例的微 調機制。此子題過去雖有文獻探討，但計算時間太長，本研究所提出的方法可大 幅縮短計算時間。在一典型的實驗案例，過去的研究約需計算 13 小時，本研究 提出的方法只需數十分鐘。但是求解品質約有 2%的誤差。
子題三是上述兩子題的應用，主要為提供半導體廠在不同產出規模時，廠房 該如何設計？實例驗證顯示，在小規模產出時應採用方案一（單廠區多層軌道的 方案），大規模產出時則應採用方案二（雙廠區跨廠生產的方案）。
6.2 未來研究方向
未來研究有兩個可能方向：(1)增加途程切割點；(2)多廠區的跨廠途程規劃。
在增加途程切割點方面，本研究目前只考慮一個切割點，亦即每種產品最多只能 跨廠一次，如果有多個切割點，在途程選擇上會比較有彈性，也可能會提高產出。
在多廠區的跨廠途程規劃方面，本研究目前只考慮兩個廠區的跨廠問題，當 可跨廠的廠區增多時，其複雜度會更高，管理上會更複雜，因此多廠區跨廠途程 規劃是另一個值得研究的議題。
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