Chapter 6 Conclusions and Future Work
6.2 Future Work
Wireless medical micro-sensors are usually with two different operating modes:
Low-Power Mode and Performance Mode because the well-known signals of the
main characteristics of cardiac activity. More than 99% operating time of sensor nodes are operating in low-power mode to record various physiological signals throughout its life time while only less than 1% operating time in performance mode to process and transmit real-time informative cardiovascular parameters to a host.
This low-power-mode-dominated scenario is capable of further reducing total energy consumption if dynamic voltage frequency scaling (DVFS) technique is applied. The benefit of DVFS technique is attributed to the quadratic savings in active CVDD2
f
110
power.
The proposed 0.5V~0.25V PVT sensors can be used for DVFS system operated in sub/near-threshold region. Figure 6.1 shows the sub/near-threshold DVFS system, it is composed of two switched-capacitor (SC) DC-DC converters, decoupling capacitors (DeCaps), the proposed clock generator, level shifters (LS), DVFS controller, PVT sensors, supply switch, and near/sub-threshold 8T SRAM-based FIFO.
The PVT sensors are used to measure environment process, voltage and temperature variation information. This information will be utilized by DVFS controller to switch supply voltage and scale operating frequency.
VddH
Figure 6.1 Sub/near-threshold DVFS system.
The process invariant temperature sensor can be utilized to monitor temperature variation in 3D IC. The process invariant property would make it special suitable to sense temperature in different layer without much inaccuracy. The conceptual image of heterogeneous 3D integration is shown in Figure 6.2. Based on discussion in section 5.2.2, the thermal issue is taken into account. Microchannel cooling elements
111
are set between face of each chip to remove the heat dissipated locally by each chip.
The cold fluid is injected into microchannel and heat of chips is taken away by hot fluid. If there is some approach to control the fluid strength with the proposed temperature sensor, we can make temperature in the 3D-ICs as stable as possible. In this way, the power consumption of system would be reduced significantly.
Cold Fluid
Hot Fluid
TSV & Bonding Front-End Circuit
DRAM
L2 Cache
Multi-Core + L1 Cache
Figure 6.2 Conceptual image of heterogeneous 3D integration with interlayer cooling.
112
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Vita
林上圓 Shang-Yuan Lin
PERSONAL INFORMATION
Birth Date: Aug. 12, 1987
Birth Place: Kaohsiung, TAIWAN.
E-Mail Address: exad7758@gmail.com
EDUCATION
07/2009 – 09/2011 M.S. in Electronics Engineering, National Chiao Tung University Thesis: Ultra-low Dynamic Voltage Scaling Fequency-Ratio-Based PVT Sensor Design and Applications
09/2005 – 06/2009 B.S. in Engineering Science, National Cheng Kung University.
PUBLICATIONS
Ming-Hung Chang, Jung-Yi Wu, Wei-Chih Hsieh, Shang-Yuan Lin, You-Wei Liang, and Wei Hwang ―High Efficiency Power Management System for Solar Energy Harvesting Applications‖ Asia Pacific Conference on Circuits and Systems, Dec.
2010.
PATENTS
Shang-Yuan Lin, Shi-Wen Chen ,Ming-Hung Chang, Wei Hwang and Kun-Ru Cai
―Fully On-Chip All Digital Process Invariant Temperature Sensor‖ US/TW Patent Pending. (pending)