國 立 交 通 大 學
工學院半導體材料與製程設備學程
碩 士 論 文
錫銀覆晶銲錫中金屬墊層電遷移與熱遷移行為之研究 Effect of UBM structure on Electromigration and thermomigration behavior in flip chip SnAg solder
joints
研 究 生：楊宗霖
指導教授：陳 智 博士
游欽宏 博士
錫銀覆晶銲錫中金屬墊層電遷移與熱遷移行為之研究 Effect of UBM structure on Electromigration and thermomigration behavior in flip chip SnAg solder
joints
研 究 生：楊宗霖 Student：Zong Lin Yang
指導教授：陳 智 博士 Advisor：Dr. Chih Chen
游欽宏 博士 Advisor：Dr. Chin Horng Yau
國 立 交 通 大 學
工學院半導體材料與製程設備學程 碩 士 論 文
A Thesis
Submitted to Degree Program of Semiconductor Material and Process Equipment
College of Engineering National Chiao Tung University in Partial Fulfillment of the Requirements
for the Degree of Master
in
Program of Semiconductor Material and Processing Equipment July 2011
Hsinchu, Taiwan, Republic of China
