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有機添加劑和改變稀釋比例之化學機械研磨

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(1)國立交通大學 電子工程學系 電子研究所碩士班 碩 士 論 文 有機添加劑和改變稀釋比例之 化學機器研磨 Cu-CMP with Organic Additive and W-CMP with Different Dilution Ratio. 研 究 生:洪啟哲 指導教授:葉清發. 教授. 中 華 民 國 九十四年 七 月.

(2) 有機添加劑和改變稀釋比例之化學機器研磨 Cu-CMP with Organic Additive and W-CMP with Different Dilution Ratio 研究生:洪啟哲. Student: Chi-Che Hong. 指導教授:葉清發教授. Advisor: Dr. Ching-Fa Yeh. 蔡明蒔博士. Dr. Ming-Shih Tsai 國立交通大學. 電子工程學系 電子研究所碩士班 碩 士 論 文. A Thesis Submitted to Department of Electronics Engineering & Institute of Electronics Engineering and Computer Science National Chaio Tung University in Partial Fulfillment of Requirements for Degree of Master of Science in Electronics Engineering June 2005 Hsinchu, Taiwan, Republic of China. 中華民國九十四年七月.

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