• 沒有找到結果。

光電化學製程在氮化鎵發光二極體製作上之應用 范文轅、蕭宏彬

N/A
N/A
Protected

Academic year: 2022

Share "光電化學製程在氮化鎵發光二極體製作上之應用 范文轅、蕭宏彬"

Copied!
2
0
0

加載中.... (立即查看全文)

全文

(1)

光電化學製程在氮化鎵發光二極體製作上之應用 范文轅、蕭宏彬

E-mail: [email protected]

摘 要

本論文中,我們證明利用偏壓輔助光電化學技術能夠提升氮化銦鎵/氮化鎵發光二極體之光取出效率。偏壓輔助光電化學 製程為一高反應速率且能將n型氮化鎵的表面粗化並蝕刻邊璧形成倒梯形形狀外貌的方法。表面粗化與倒梯形形狀的晶粒 能夠降低內部全反射而提升其光取出效率。 在此我們使用兩種不同方向照光的光電化學反應,其一為垂直於表面照光,其 二為平行於表面。利用垂直照光式光電化學法對於n型氮化鎵進行反應,能使其形成粗糙的表面;使用水平照光式光電化 學反應能同時將n型氮化鎵表面進行粗化並將邊璧蝕刻形成倒梯形形狀的外貌。經由光電化學處理後的試片,我們使用掃 描式電子顯微鏡以及原子力顯微鏡來觀察表面形貌,並對元件量測其電壓-電流特性曲線與電流-光輸出強度曲線。在本實 驗中,嘗試改變不同的氫氧化鉀濃度與偏壓進行反應並對元件特性進行量測。 利用2V偏壓輔助於0.1M、0.5M、1M與2M 的氫氧化鉀中進行垂直照光式光電化學反應,反應後其發光效率分別能提升13.4%、33.87%、47.34%與29.7%。此外,利 用2V偏壓輔助於1M的氫氧化鉀中進行水平照光式光電化學反應能將發光效率提升至52.23% 。

關鍵詞 : 光電化學反應 ; n型氮化鎵表面 ; 邊璧

目錄

封面內頁 簽名頁 授權書.................... iii 中文摘要.................

.. iv 英文摘要................... v 誌謝..................... vi 目 錄..................... vii 圖目錄.................... ix 表目錄..

.................. xii 第一章 序論.................. 1 1.1 前言......

..............1 1.2 氮化鎵材料簡介...............2 1.3 氮化鎵發光二極體演進..

..........5 1.4 發光二極體原理與介紹............7 1.5 研究動機與背景.........

......9 第二章 光電化學反應.............. 12 2.1 濕式蝕刻................

..12 2.2 乾式蝕刻..................14 2.3 光電化學原理................17 第三章 實驗步驟................ 21 3.1 試片結構..................21 3.2 製程 步驟..................22 3.3 光電化學製程................24 第四章 結果與討 論............... 27 4.1 n型電極平台表面與邊壁之形貌分析...... 27 4.2 元件之電壓-電流特性 與發光效率....... 41 第五章 結論.................. 52 參考文獻...........

.........53 參考文獻

[1] S. Nakamura, M. Senoh, and T. Mukai, “ High-power InGaN/GaN double-heterostructure violet light emitting diodes, ” Appl. Phys. Lett. , vol.62, pp. 2390, 1992.

[2] M. Hansen, J. Piprek, P. M. Pattison, J. S. Speck, S. Nakamura, and S. P. DenBaars ,“ Higher efficiency InGaN laser diodes with an improved quantum well capping configuration, ” Appl. Phys. Lett. , vol.81, pp. 4520, 2002.

[3] K. S. Stevens, M. Kinniburgh, and R. Beresford, “ Photoconductive ultraviolet sensor using Mg-doped GaN on Si(111), ” Appl. Phys. Lett. , vol.63, pp. 3518, 1995.

[4] A. F. M. Anwar, Richard T. Webster, and Kurt V. Smith, “ Bias induced strain in AlGaN/GaN heterojunction field effect transistors and its implications, ” Appl. Phys. Lett. , vol. 88, pp. 203510, 2006.

[5] J. Chen, J. F. Wang, H. Wang, J. J. Zhu, S. M. Zhang, D. G. Zhao, D.S. Jiang, H. Yang, U. Jahn and K. H. Ploog, “ Measurement of threading dislocation densities in GaN by wet chemical etching, ” Semicond. Sci. Technol. , vol. 21 pp. 1229–1235, 2006.

[6] S. Yoshida, S. Misawa, and S. Gonda, “Improvements on the electrical and luminescent properties of reactive molecular beam epitaxially grown GaN films by using AlN-coated sapphire substrates, ” Appl. Phys. Lett. , vol. 42, pp. 427-429, 1983.

[7] H. Amano, N. Sawaki, I. Akasaki, and Y. Toyoda, “ Metalorganic vapor phase epitaxial growth of a high quality GaN film using an AlN buffer layer, ” Appl. Phys. Lett., vol. 48, pp. 353-355, 1986.

[8] M. Hao, S. Mahanty, T. Sugahara, Y. Morishima, H. Takenaka, J. Wang, S. Tottori, K. Nishino, Y. Naoi, and S. Sakai, “ Configuration of

(2)

dislocations in lateral overgrowth GaN films, ” J. Appl. Phys. , vol. 85, pp. 6479-6507, 1999.

[9] E. Fred Schubert, Light-Emitting Diodes, Cambridge University Press, pp. 15-22, 2006.

[10] T. N. Oder, K. H. Kim, J. Y. Lin, and H. X. Jiang, “ III-nitride blue and ultraviolet photonic crystal light emitting diodes, ” Appl. Phys.

Lett. , vol. 84, pp. 466-468, 1999.

[11] Y. J. Lee, T. C. Lu, H. C. Kuo, S. C. Wang , T. C. Hsu, M. H. Hsieh, M. J. Jou, and B. J. Lee, “ Nano-roughening n-side surface of AlGaInP-based LEDs for increasing extraction efficiency, ” Materials Science and Engineering B, vol. 138, pp. 157-160, 2007.

[12] Y. J. Lee, J. M. Hwang, T. C. Hsu, M. H. Hsieh, M. J. Jou, B. J. Lee, T. C. Lu, H. C. Kuo, and S. C. Wang, “ Enhancing the output power of GaN-based LEDs grown on wet-etched patterned sapphire substrates, ” IEEE Photonics Technology Letters, vol. 18, pp. 1152-1154, 2006.

[13] M. R. Krames, M. Ochiai-Holcomb, G. E. HOfler, C. Carter-Coman, E. I. Chen, I.- H. Tan, P. Grillot, N. F. Gardner, H. C. Chui, J.-W.

Huang, S. A. Stockman, F. A. Kish, M. G. Craford, T. S. Tan, C. P. Kocot, M. Hueschen, J. Posselt, B. Loh, G. Sasser and D. Collins, “ High-power truncated-inverted-pyramid (AlxGa1-x)0.5In0.5P/GaP light- emitting diodes exhibiting > 50% external quantum effciency, ” Appl.

Phys. Lett. , vol. 75, pp. 2365-2367, 1999.

[14] J. W. Seo, C. S. Oh, H. S. Jeong, J. W. Yang, K. Y. Lim, C. J. Yoon, and H. J. Lee, “ Bias-assisted photoelectrochemical oxidation of n-GaN in H2O, ” Appl. Phys. Lett. , vol. 81, pp. 1029-1031, 2002.

[15] Z. H. Hwang, J. M. Hwang, H. L. Hwang, and W. H. Hung, “ Electrodeless wet etching of GaN assisted with chopped ultraviolet light, ” Appl. Phys. Lett. , vol. 84, pp. 3759-3761, 2004.

[16] 莊達人,VLSI製造技術,高立圖書有限公司,1996.

[17] S. k. Ghandhi, VLSI Fabrication Principles, John Wiley & Sons, p.613, 1994.

[18] S. J. Fonash, “Advances in Dry Etching Processes-A Review,” Solid State Technology, pp. 150, 1985.

[19] 劉博文,ULSI製造技術,新文京開發出版有限公司,2003.

[20] C. Youysey, I. Adesida , L.T. Romano, and G. Bulman, “ Smooth n-type GaN surface by photoenhanced wet etching, ” Appl. Phys. Lett. , vol. 72, pp. 560-562, 1997.

[21] T. Rotter, D. Mistele, F. Fedler, J. Aderhold, J. Graul, and M.Heuken, “ Photoinduced oxide film for mation on n-type GaN surfaces using alkaline solution, ” Appl. Phys. Lett. , vol. 76, pp.3923-3925, 2000.

[22] L. Y. Chang, “ Etching Study of GaN by Photoelectrochemical Reaction Method, ” Department of Electrical Engineering, Da-Yeh University, June, 2006.

[23] D. J. Fu, Sh. U. Yuldashev, Y. H. Kwon, N. H. Kim, S. H. Park and T. W. Kang, “ Photoelectrochemical Oxygenation of GaN Epilayers,

” Journal of the Korean Physical Society, Vol. 39, pp. S313-S317, 2001.

[24] J. E. Borton, C. Cai and M. I. Nathan, P. Chow, J. M. VanHove, A. Wowchak, and H. Morkoc, “ Bias-assisted photoelectrochemical etching of p-GaN at 300K, ” Appl. Phys. Lett. , vol. 77, pp. 1227-1229, 2000.

[25] Chia-Feng Lin, Jing-Hui Zheng, Zhong-Jie Yang, Jing-Jie Dai, Der-Yuh Lin, Chung-Ying Chang, Zhao-Xu Lai, and C. S. Hong, “ High-efficiency InGaN-based light-emitting diodes with nanoporous GaN:Mg structure, ” Appl. Phys. Lett. , vol. 88, pp. 083121, 2006.

[26] A. P. Vajpeyi, S. J. Chua, S. Tripathy, E. A. Fitzgerald, W. Liu, P. Chen, and L. S. Wang “ High optical quality nanoporous GaN prepared by photoelectrochemical etching, ” Electrochem. Solid-State Lett. , vol. 8, pp. G85-G88, 2005.

[27] J. M. Hwang, J. T. Hsieh, H. L. Hwang, and W. H. Hung, “ A damage-reduced process revealed by photoluminescence in photoelectrochemical etching GaN, ” MRS Internet J. Nitride Semicond. , Res. 5S1, W11. 73, 2000.

[28] C. C. kao, H. C. Kuo, H. W. Huang, J. T. Chu, Y. C. Peng, Y. L. Hsieh, C. Y. Luo, S. C. Wang, C. C. Yu and C. F. Lin, “ Light-output enhancement in a nitride-based light-emitting diode with 22° undercut sidewalls, ” IEEE Photonics Technology Letters, vol. 17, pp. 19-21, 2005.

[29] C. F. Lin, J. J. Dai1, R. H. Jiang, J. H. Zheng, Z. J. Yang, C. C. Yu, and W. C. Lee, “ Photoelectrochemical sidewall etching enhances light output power in GaN-based light emitting diodes, ” Phys. stat. sol. , vol. 3, pp. 2182-2186, 2006.

參考文獻

相關文件

解答 根據圖 1.14 可知氮的陰電性(EN = 3.0)大於碳的 陰電性(EN = 2.5),故胺被極化成碳為 δ+ ,而 氮為 δ- 。.

二、高壓氣體用途甚廣,各事業單位大多使用以作為生產製程之消耗性原、物

其他光學儀器及設備製造業 從事 2771 細類以外光學儀器及設 備製造之行業,如望遠鏡、顯微

在1980年代,非晶矽是唯一商業化的薄膜型太 陽能電池材料。非晶矽的優點在於對於可見光

The prepared nanostructured titania were applied for the photoanodes of dye-sensitized solar cell.. The photoanodes were prepared by the doctor blade technique and the area

規劃順序:第二層 → 第一層 → 第三層 →

校本文化 文化 文化及 文化 及 及文學課程 及 文學課程 文學課程整體規畫 文學課程 整體規畫 整體規畫 整體規畫. 一年級 二年級 三年級

課程 上課地點 對象 (智障學生) 包餅製作(A班)..