[PDF] Top 20 Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
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Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
... that the electromigration induced damage occurs when a void initiates first at the corner of the bump, where the electric current enters the bump; then, the void ... See full document
7
The effect of pre-aging on the electromigration of flip-chip SnAg solder joints
... effect of pre-aging on electromi- gration is investigated in this study us- ing fl ip-chip SnAg solder ...joints. The solder joints were pre-aged at 170°C for 1 h, ... See full document
4
Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration
... and 3b, respectively. Figures 3a and 3b show that the original ...layer of Cu had been replaced by a series of Cu 6 Sn 5 ...scallops. The scallops on ... See full document
7
Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration
... Abstract Flip-chip solder joints have become the most important technology for high-density packaging in the microelectronic ...As the size of the joints ... See full document
5
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
... CONCLUSIONS The effect of Al-trace width on EM in flip-chip solder joints was investigated ...For the same stressing conditions (0.5 A on a 165°C hotplate), ... See full document
8
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
... occurred in the Al trace instead of inside solder bumps under this stressing ...C. The radiance of Al was smaller than that of the ...brighter in the ... See full document
4
Effect of al trace dimension on electromigration failure time of flip-chip solder joints
... examine the Joule heat- ing effect in the solder joints, the temperature dis- tribution in the Al trace and in the Al pad was measured using an IR ...Figure ... See full document
5
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
... understand the degree of current crowding, a three-dimensional finite-element simulation was used to calculate the current density distribution of the ...shows the mesh geometry ... See full document
6
Joule heating effect under accelerated electromigration in flip-chip solder joints
... for the temperature distribution in the solder bump, Figure 8(a) shows the distribution in the solder bump only, in which the Al pad, UBM, IMC ... See full document
4
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
... appear in the Cu 3 Sn layer; most of them are closer to the Cu 3 Sn/Cu interface ...(82). The thickness of Cu 3 Sn and the number ... See full document
28
Optimal Design of Passivation/UBM Openings for Reducing Current Crowding Effect Under Electromigration of Flip-chip Solder Joint
... role on the failure ...simulate the current density distribution in solder ...With the simulation results, designing a robust structure becomes an urgent issue to relieve ... See full document
5
Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints
... of the UBM opening. As described above, the tem- perature increase is approximately ...when the voids occupied 75% of the UBM ...verify the evolution of the ... See full document
6
Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
... Since the input/output pin count for flip chip prod- ucts has drastically increased recently, the bump pitch and the diameter of under-bump metallization (UBM) have been forced ... See full document
6
Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
... Figure 3共c兲 shows the magnified figure for the initial stage of electromigration up to 22% increase in resistance in ...Fig. 3共b兲. When the bump resistance ... See full document
4
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
... depicts the three- dimensional view of the pair. The cut surface is denoted as the first cross-sectional surface for in situ observation in electromigration, and ... See full document
5
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
... structure of a face-centered-cubic metal such as Cu can be represented by a stacking of (1 1 1) planes in the sequence of ...error of stacking occurs and changes the ... See full document
5
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
... qualitatively the current crowding to the electromigration flux in the solder joint, marker analysis was used to measure the nonuniform dis- tribution of ... See full document
6
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
... investigate the change in bump resistance due to void formation, 3D modeling was performed to simulate the volt- age distribution in the solder ...shows the voltage ... See full document
4
Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
... that of the stan- dard model under 0.6 A at 70 ° C, in which the relief of current crowding contributed about ...and the de- crease in Joule heating contributed ... See full document
4
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
... However, the mechanism of void nucleation and growth and especially the corresponding change of current distribution in the solder joint due to void formation are ... See full document
4
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