Experimental Study of Fluid Flow and Heat Transfer Characteristics in the Square Channel with a Perforation Baffle
鄭森耀、黃國修
E-mail: [email protected]
ABSTRACT
This work performed a detailed measurement of heat transfer coefficients in a square channel with a step baffle and perforation baffle by using the transient liquid crystal method. The varied parameters were Reynolds number and the baffle height、different hole number. The results showed that the enhancements of local heat transfer appeared in the leading edge of the baffle due to the impinging effect. Proved that some high temperature often burns out the part, instead of be burnt out by the whole too high horizontal temperature by the experiment. Obstacle piece cliff side hot to strike effect is most easy to be it accumulates hotly to produce. Proposing boring a hole, the figure scatters evenly in a cliff side of obstacle, lengthen the life-span of the component. When gas crosses the more porous obstacle one, after the gas flows through many holes in a utensil to keep in touch again, will produce more turbulence it causes system to be hot to be relatively average to spread coefficient, favorable as to whole system.
Keywords : Transient liquid crystal method, perforation baffle, channel flow, step baffle, Reynolds number Table of Contents
封面內頁 簽名頁 授權書---iii 中文摘要---v 英文摘 要---vi 誌謝---vii 目
錄---viii 圖目錄---x 表目
錄---xii 符號說明---xiv 第一章 研究背景與目 的---1 1.1 背景與目的---1 1.2 研究目
標---2 第二章 理論分析---3 2.1 液晶的特
性---3 2.2 文獻回顧---4 2.2.1液晶在熱傳研究之應 用---5 2.2.2背向階梯熱傳之研究---7 第三章 研究設備與進行步 驟---11 3.1 實驗理論---11 3.2 實驗設
備---12 3.2.1 影像擷取設備---12 3.2.2 數據擷取設 備---13 3.2.3 實驗測試段---13 3.2.4 加熱設
備---15 3.2.5 液晶---15 3.2.6 影像分析程
序---17 3.3 實驗程序---17 3.4 實驗參數之不準確度分 析---19 第四章 實驗結果與討論---22 4.1 空槽熱傳效
應---22 4.2 不等高障礙塊熱傳效應---23 4.2.1不等高度未穿孔障礙塊熱傳效 應---23 4.2.2不等高度不同孔數障礙塊熱傳效應---24 4.3 不等高度障礙塊紐塞數分布效
應---25 4.4 不等高度相同Re數障礙塊熱傳效應---26 4.5 不等高度不同孔數障礙塊紐塞數分布 效應---28 4.6 Re與h/H對Nu分布影響---29 第五章 結論與建
議---31 5.1 研究結論---31 5.2 建 議---33 參考文獻---71 REFERENCES
[1]R.J. Moffat, "Experimental Heat Transfer," Keynote Paper, KN11, Proc. 9th Int. Heat Transfer Conf., Jerusalem, 1990,Vol.1, pp. 882-890.
[2]T.E. Cooper, R.J. Field and J.F. Meyer, "Liquid Crystal Thermography and Its Application to the Study of Convective Heat Transfer," ASME, Journal of Heat Transfer, 1975, pp.442-450.
[3]J.C. Simonich and R.J. Moffat, "Liquid Crystal Visualization of Surface Heat Transfer on a Concavely Curved Turbulent Boundary Layer,"
Journal of Engineering for Gas Turbulent and Power, 1984, Vol.106, pp.619-627.
[4]P.T. Ireland and T.V. Jonse, "The Response Time of Surface Thermometer Employing Encapsulated Thermochromic Liquid Crystals,"
Journal of Physics E, 1985, Vol 20, pp 1195-1199.
[5]J.W. Baughn and D.B. Markel, "Improvements in a New Technique for Measureing and Mapping Heat Transfer Coefficients," 1986 Rec. Sci.
Instrum., Vol.57, No.4, pp.65-654.
[6]A. Hoffs, A. Bolcs and S. P. Harasgama, "Transient Heat Transfer Experiments in a Liner Cascade Via An Insertion Mechanism Using the Liquid Crystal Technique," , 1995, ASME 95-GT-8.
[7]C. Camci, K. Kim and S.A. Hippensteele, "A new hue capturing technique for the quantitative interpretation of liquid crystal image used in convective heat transfer studies," ASME, J. Turbomachinary, 1992, Vol.114, pp.765-775.
[8]Von Wolfersdorf, R. Hoecker and T. Sattelmayer, "A Hybrid Transient Step-Heat Transfer Measurement Technique Using Heater Foils and Liquid Crystal Thermography, " ASME, Journal of Heat Transfer, 1993, Vol.115, pp.319-324.
[9]Z. Wang, P.T. Ireland, T.V. Jones and R. Davenport, "A Color Image Processing System for Transient Liquid Crystal Heat Transfer Experiments," ASME, Journal Turbomachinery, 1996, Vol.118, pp.421-427.
[10]J.C. Han and S.V. Ekkad, "Turbine Blade Cooling and Heat Transfer Measurement Using a Transient Liquid Crystal Image Method," Invited Paper for the 5th Cooling on Turbomachinery Seoul National University Seoul, Korea, 1996, pp.263-302.
[11]J.W. Baughn, J.E. Mayhew, M.R. Anderson and R.J. Butler, "A Periodic Transient Method Using Liquid Crystals for the Measurement of Local Heat Transfer Coefficients," ASME, Journal of Heat Transfer, Technical Notes, 1998, Vol.120, pp.772-777.
[12]J.W. Baughn, P.T. Ireland and N. Sanniei, "A Comparison of the Transient and Heatrd-Coating Methods for the Measurement of Local Heat Transfer Coefficients on a Pin Fin," Journal of Heat Transfer, 1989, Vol. 111, pp.877-881.
[13]W.H. Schofield and E. Logan, "Turbulent Shear Flow Over Surface Mounted Obstacle," ASME J. Fluids Engineering, 1990, Vol.112, pp.376-385.
[14]B.H. Kang and Y. Jaluria, "Mixed Convection Transport from a Protruding Heat Source Module on a Vertical Surface," AIAA, Journal of Thermophysics and Heat Transfer, 1990, Vol.4,pp.384-390.
[15]E.R. Meinders, T.H. Van DerMeer and K. Hanjalic, "Local Convective Heat Transfer form an Array of Well-Mounted Cubes," Int. J. Heat Transfer, 1998, Vol.41, No.2, pp.335-346.
[16]Hiroshi Iwai, Kazuyoshi Nakabe and Kenjiro Suzuki, "Flower and Heat Transfer Characteristics of Backward-Facing Step Laminar Flow in a Rectangular Duct," Int. J. Heat and Mass Transfer, 2000, Vol.43, pp.457-471.
[17]J. T. Yang and C. H. Tsai, "Transient Effect of Micro-Jet Cooling on a Flat in Separated Flow Field," Proceedings of the Eleventh International Symposium on Transport Phenomena, Hsinchu, 1998,Taiwan, R.O.C., November 29-December 3, pp. 278-282.
[18]J. T. Yang, B. B. Tsai and G. L. Tsai, "Separated-Reattaching Flow over a Backstep with Uniform Normal Mass Bleed," J. Fluid Eng., 1994,Vol.116,29-35.
[19]W. Nakayama and S.H. Park, "Conjugate Heat Transfer from a Single Surface-Mounted Block to Forced Convective Air Flow in a Channel,"
ASME, Journal of Heat Transfer, 1996, Vol.118, pp.301-309.
[20]葉兆雄,"外在裝置對大型積體電路流場之影響",國立成功大學工程科學研究所,1990。
[21]M.K. Chyu and V. Natarajan, "Local heat/mass transfer distributions on the surface of a wall-mounted cube," ASME J. Heat Transfer, 1991, Vol.113, pp.851-857.
[22]I.S. Kinnear, A.L. May and R.A. Wall, 1980, "Secondary Control in Axial Fluid Machine," UK Patent Application GB 2 042 675 A".
[23]Y.P. Gan, Q.J. Deng, C.F. Ma, X.Y. Yuan and D.Y. Cai, "Forced convection air cooling from electronic component arrays in a parallel plate channel," IEEE Transactions On Components, Packaging, and Manufacturing Technology, 1996, Part A, Vol.19, No.2, pp.163-167.