[PDF] Top 20 Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
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Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
... CONCLUSIONS The effect of Al-trace width on EM in flip-chip solder joints was investigated ...For the same stressing conditions (0.5 A ... See full document
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Effect of al trace dimension on electromigration failure time of flip-chip solder joints
... words: Electromigration, flip chip, Joule heating INTRODUCTION To meet the miniaturization trend for portable devices, flip-chip technology has been adopted for high-density packaging due to its ... See full document
5
Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints
... with the trend of miniaturization and high perfor- mance in microelectronic devices, thousands of solder bumps are fabricated onto one ...Subsequently, the size of solder ... See full document
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Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
... understand the degree of current crowding, a three-dimensional finite-element simulation was used to calculate the current density distribution of the ...shows the mesh geometry ... See full document
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Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
... if the increase in resistance of the Al trace can have substantial influence on Joule heating effect, 3D ther- moelectric simulations were carried out with and without ... See full document
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Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration
... that the original 0.8 mm layer of Cu had been replaced by a series of Cu 6 Sn 5 ...scallops. The scallops on the right side of ...that the Ni UBM on ... See full document
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Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
... meet the relentless drive for miniaturization of por- table devices, flip-chip technology has been adopted for high-density packaging due to its excellent electrical charac- teristic and ... See full document
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The effect of pre-aging on the electromigration of flip-chip SnAg solder joints
... The effect of pre-aging on electromi- gration is investigated in this study us- ing fl ip-chip SnAg solder ...joints. The solder joints were pre-aged ... See full document
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Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
... study, solder bumps with two kinds of composition and two kinds of UBM were EM tested under two values of current ...minimize the drawbacks of the destructive observation ... See full document
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Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration
... Abstract Flip-chip solder joints have become the most important technology for high-density packaging in the microelectronic ...As the size of the ... See full document
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Joule heating effect under accelerated electromigration in flip-chip solder joints
... 77 on the rest of the three ...heating on the three corners. To examine the Joule heating effect on the Al trace, the ... See full document
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Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
... shows the magnified figure for the initial stage of electromigration up to 22% increase in resistance in ...When the bump resistance increases 20% of its initial value, ... See full document
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Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints
... As the voids grow, the current redistributes due to the void ...depicts the distribu- tion of current density when the voids deplete ...74.5% of the UBM opening, ... See full document
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Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
... of the contact opening was eclipsed by the propagating ...Institute of Physics. 关DOI: 10.1063/1.2220550兴 Electromigration has become a critical reliability issue for high-density ... See full document
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Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints
... facilitate the observation of electromigration and thermomigration, the joints were polished laterally and ap- proximately to their centers, as shown in ...After the polishing, ... See full document
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Effect of bump size on current density and temperature distributions in flip-chip solder joints
... Conclusions The current density and temperature distributions in flip-chip solder joints with several reduced bump sizes have been simulated by the finite-element ...method. The ... See full document
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Thermomigration of Ti in flip-chip solder joints
... studies of solder bumps were em- ployed to facilitate the observation of both electromigra- tion and thermomigration ...damages. The test layout is shown in Figure 1a. Figure 1b shows ... See full document
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Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
... during electromigration can be precisely measured using Kelvin bump probes, and it can be employed to monitor the void formation and micro- structure change during ...shows the total resistance for ... See full document
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Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy
... shows the cross-sectional schematic for the solder joint used in this ...study. The Al trace was ...lines on the substrate were 25 m thick and 100 m wide. ... See full document
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Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization
... The electromigration-induced failure in flip-chip eutectic SnPb solder joints with a 10-m-thick Cu under-bump metallization (UBM) was studied without the ... See full document
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