[PDF] Top 20 Threshold current density of electromigration in eutectic SnPb solder

... issue in the microelectronics packaging industry since the dimension of solder joints has continued to ...shrink. In this letter, we report a technique that enables the precise measurement ... See full document

... size of the bumps progressively shrinks, and electromigration has become an important reliability is- sue for flip-chip ...1,2 Eutectic SnPb solder has been adopted for the inter- ... See full document

... Eutectic SnPb solder has been implemented in flip-chip technology for decades due to its low melting point and ex- cellent mechanical ...use of SnPb solder has been ... See full document

... interface of Cu electrode and eutectic SnPb solder, line scans were performed approximately every 7 ␮m along the length direction of the sample to obtain the concentration profile ... See full document

... lot of research has been done on electromigration of solder ...measurement of fundamental electromigration param- eters of ...atoms in a thin SnPb stripe ... See full document

... concentration of atoms per unit volume of the eutectic alloy, D is the effective lattice diffusivity of the solder at testing temperature, Z* is the effective charge number, E is the ... See full document

... side in this study. 14 For eutectic SnPb solder bumps, the concentration of Sn is only 63%, and Pb atoms are accumulated on the anode/chip side to inhabit Cu–Ni–Sn IMC ...prevails ... See full document

... The SnPb solder strips of various lengths were pre- pared, each about ...Details of this process are described elsewhere. 13 Eutectic SnPb solder was re- flowed on a ... See full document

... one of the best structures to resist ...the current density and temperature distributions for eutectic SnPb solder bumps with ...and current crowding effects in the ... See full document

... illustrated in Fig. 1, the drifting electrons collide with atoms causing one of the atoms to exchange position with neighboring vacancy during current ...necessary current density to ... See full document

... (Eutectic SnPb) The material properties which was used in this study are listed in Table ...resistivity of Al trace is 3.2μΩ-cm instead of the bulk resistivity, ...resistivity ... See full document

... were electromigration (EM) tested, and the 3D laminography imaging technique was employed for in-situ observation of the microstructure evolution during ...rate of voids, and the EM parameter ... See full document

... 3.—Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan; e-mail: ...diffusion of solder atoms in a flip-chip solder joint under current ... See full document

... ␮⍀cm in one direction, while it was ...␮⍀cm in another. 25 There is a difference of 20% in the elastic constants in the principal directions (C 11 ⳱ ...8.84 in units of 10 ... See full document

... MTTF of solder joints can be predicted ...TCR of Al traces as a temperature sensor to detect the real temperature in solder bumps during current ...stressing. In addition, ... See full document

... Electromigration in flip-chip solder joints has attracted a lot of attention in recent years due to the miniaturization trend in high-performance ...the current ... See full document

... Institute of Physics. 关DOI: 10.1063/1.2220550兴 Electromigration has become a critical reliability issue for high-density solder joints in flip-chip ...1,2 ... See full document

... Flip-chip solder joints have become the most important technology for high-density packaging in the microelectronic ...size of the joints progressively shrinks, the carried current ... See full document

... This study investigates electromigration study of eutectic SnPb flip-ch.ip .solder joints on ceramic substrates.. The under bump metalltzatlon (UBM) structure consists of 5-J.lIll Cu / 3[r] ... See full document

... top of the bonding pairs during the reflow process, there was less heat loss to the ...application of flux during this final bonding ...design of the Cr/Ni/Cu metallurgy layer is able to eliminate ... See full document