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軍商兩用貨品及技術出口管制清單及一般軍用貨品清單 新、舊版修正對照與翻譯

編列說明

1. 軍商兩用貨品及技術出口管制清單列入第一項,一般軍用貨品清單列入第二項。

2. 本對照表列出下列情況:

a. 中文有增/刪語詞,原意有所變動者;

b. 舊版無、新版新增之內容;

c. 舊版有、新版刪除之內容;

3. 本對照表未列出下列情況,但已於檔案中進行修正,與現行公布英文版本一致:

a. 標點符號變動、專有名詞單引號或雙引號變動、CAS 編號前加註 CAS 字樣者;

b. 英文編輯改變,未改變原有內容意義者;

c. 排版方式變更,未改變原有內容意義者;

d. 既有版本的錯字與誤植。

4. 為符合國際文體指南(2015 年版),英文版本以逗號分隔整數與小數,以空間分隔表明千位整數。

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2

目錄

第一項:軍商兩用貨品及技術出口管制清單修正對照表... 3 第二項:一般軍用貨品清單修正對照表... 27

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第一項:軍商兩用貨品及技術出口管制清單修正對照表

修正條目 現行內容 擬修正/新增內容 現行內容英譯 擬修正/新增內容英譯

字首集合字 與縮寫

EEPROMS/電氣拭除式可編程唯讀記憶

體 刪除 EEPROMS/Electrically Erasable

Programmable Read Only Memory -

無 EMP/電磁脈衝 - EMP/Electromagnetic Pulse

無 ESD/靜電放電 - ESD/Electrostatic Discharge

無 HDMI/高解析度多媒體介面 - HDMI/ High-Definition Multimedia

Interface

無 LTT/光觸發閘流體 - LTT/ Light Triggering Thyristor

MRAM/磁性隨機記憶體 刪除 MRAM/ Magnetic Random Access

Memory -

無 NIJ/國家司法研究所 - NIJ/National Institute of Justice

無 WHO/世界衛生組織 - WHO/World Health Organization

專用術語定 義

〝網路事件應變〞(第 5 類)指解決網 路安全事件時,由負責處理的個人或 組織或協同處者在網路安全事件上交 換必要訊息的過程。

-

"Cyber incident response" (5) means the process of exchanging necessary information on a cybersecurity incident with individuals or organisations responsible for conducting or

coordinating remediation to address the cybersecurity incident.

〝等效標準〞(第 1 類) 指我國或瓦聖 那協議會員國承認可比對之國家或國 際標準,且適用於相關項目。

-

"Equivalent standards" (1) means comparable national or international standards recognised by Taiwan, ROC, or Wassenaar Arrangement

Participating States and applicable to the relevant entry.

〝硬選擇〞(第 5 類) 指有關於個人之 資料或資料集(如姓、名、電子郵件、

地址、電話號碼或群組關係)。

-

"Hard selectors" (5) means data or set

of data, related to an individual (e.g.,

family name, given name, email, street

address, phone number or group

affiliations).

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4

〝儀器測量範圍〞(第 6 類)係指雷達

之明確顯示範圍。 刪除

"Instrumented range" (6) means the specified unambiguous display range of a radar

-

〝入侵軟體〞 (第 4 類)係指為避免‵監 視工具′之偵測而特別設計或改造之

〝軟體〞,或擊敗電腦或網路功能設 備之‵保護措施′者,其具下列任一 特性:

〝入侵軟體〞(第 4、5 類)係指為避免

‵監視工具′之偵測而特別設計或改 造之〝軟體〞,或擊敗電腦或網路功 能設備之‵保護措施′者,其具下列 任一特性:

"Intrusion software" (4) means

"software" specially designed or modified to avoid detection by

‘monitoring tools’, or to defeat

‘protective countermeasures’, of a computer or network-capable device, and performing any of the following:

"Intrusion software" (4 5) means

"software" specially designed or modified to avoid detection by

‘monitoring tools’, or to defeat

‘protective countermeasures’, of a computer or network-capable device, and performing any of the following:

〝個人區域網絡〞(第 5 類)指具下列 特性之資料通訊系統:

a. 允許任意數量的獨立或互連的

‵資料裝置′直接互相通訊;及 b. 侷限於個人或裝置控制器鄰近範 圍內裝置之間的通訊(例如︰單一房 間、辦公室或汽車,以及其周邊空 間)。

技術註解:

‵資料裝置′指能發射或接收數位資 訊序列之裝備。

〝個人區域網絡〞(第 5 類)指具下列 特性之資料通訊系統:

a. 允許任意數量的獨立或互連的

‵資料裝置′直接互相通訊;及 b. 僅侷限於個人或裝置控制器在物 理性鄰近的範圍內裝置之間的通訊 (例如︰單一房間、辦公室或汽車,以 及其周邊空間)。

技術註解:

1.‵資料裝置′指能發射或接收數位 資訊序列之裝備。

2.〝區域網路〞擴展超出〝個人區域 網絡〞地理範圍以外。

"Personal area network" (5) means a data communication system having all of the following characteristics:

a. Allows an arbitrary number of independent or interconnected ‘data devices’ to communicate directly with each other; and

b. Is confined to the communication between devices within the immediate vicinity of an individual person or device controller (e.g., single room, office, or automobile, and their nearby surrounding spaces).

Technical Note:

‘Data device’ means equipment capable of transmitting or receiving sequences of digital information.

"Personal area network" (5) means a data communication system having all of the following characteristics:

a. Allows an arbitrary number of independent or interconnected ‘data devices’ to communicate directly with each other; and

b. Is confined to the communication between devices within the immediate physical vicinity of an individual person or device controller (e.g., single room, office, or automobile).

Technical Notes:

1. ‘Data device’ means equipment capable of transmitting or receiving sequences of digital information.

2. The "local area network" extends beyond the geographical area of the

"personal area network".

〝解析度〞(第 2 類)係指一測量裝置 的最小增量;在數位儀器中,指最小 之有效位元。(參考:ANSI B-89.1.12)

刪除

"Resolution" (2) means the least increment of a measuring device; on digital instruments, the least significant bit (ref. ANSI B-89.1.12).

-

(5)

5 無

〝次軌道飛行器〞(第 9 類)指備外殼 的飛行器,其設計用於運輸人員或貨 物達到下列目的:

a. 在平流層上方操作;

b. 執行非軌道軌跡;及

c. 將人員或貨物無損帶回地球。

-

"Sub-orbital craft" (9) means a craft having an enclosure designed for the transport of people or cargo which is designed to:

a. Operate above the stratosphere;

b. Perform a non-orbital trajectory; and c. Land back on Earth with the people or cargo intact.

〝超合金〞(第 2、9 類)係指在超過 922 K (649 °C)之溫度下,以及嚴苛環境 與操作情況下,鎳基、鈷基或鐵基合 金,其強度超過 AISI 300 系列中之任 一合金。

〝超合金〞(第 2、9 類)指鎳基、鈷基 或鐵基合金,其在壓力 400 MPa、溫 度 922 K (649 °C)或超過情況下,斷 裂應力壽命大於 1,000 小時者。

"Superalloys" (2 9) means nickel-, cobalt- or iron-base alloys having strengths superior to any alloys in the AISI 300 series at temperatures over 922 K (649°C) under severe environmental and operating conditions.

"Superalloys" (2 9) means nickel-, cobalt- or iron-base alloys having a stress rupture life greater than 1 000 hours at 400 MPa at 922 K (649°C) or higher.

〝弱點公開〞(第 4 類)指以解決漏洞 為目的,由負責處理的個人或組織或 協同處者進行識別,報告或傳播漏洞 或分析漏洞的過程。

-

"Vulnerability disclosure" (4) means the process of identifying, reporting or communicating a vulnerability to, or analysing a vulnerability with,

individuals or organisations responsible for conducting or coordinating

remediation for the purpose of resolving the vulnerability.

0B004.b.2.

2. 單級式,低壓(即:0.2 MPa)之離心 風機或壓縮機,用於為硫化氫氣體循 環(即氣體含有重量比超過 70%之 H

2

S),其操作壓力大於或等於 1.8 MPa 吸力、且為濕 H

2

S 而附有密封之設 計,氣體流通量等於或大於 56 m

3

/s 者;

2. 單級式,低壓(即:0.2 MPa)之離心 風機或壓縮機,用於為硫化氫(H

2

S) 氣體循環(即氣體含有重量比超過 70%之 H

2

S),其在操作壓力大於或等 於 1.8 MPa 吸力時,氣體流通量等於 或大於 56 m

3

/s,且具有使用溼式 H

2

S 之密封設計。

2. Single stage, low head (i.e. 0,2 MPa) centrifugal blowers or compressors for hydrogen sulphide gas circulation (i.e.

gas containing more than 70 % by weight hydrhogen suplhide, H

2

S) with a throughput capacity greater than or equal to 56 m

3

/s when operating at pressures greater than or equal to 1,8 MPa suction and having seals designed for wet H

2

S service;

2. Single stage, low head (i.e., 0,2 MPa)

centrifugal blowers or compressors for

hydrogen sulphide gas circulation (i.e.,

gas containing more than 70 % by

weight hydrogen sulphide, H

2

S) with a

throughput capacity greater than or

equal to 56 m

3

/s when operating at

pressures greater than or equal to 1,8

MPa suction and having seals designed

for wet H

2

S service;

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6 0B006 Notes

b. 燃料元件之斬斷或切碎機器,即遙 控操作之設備可切、斬,或剪〝核子 反應器〞用過燃料組件、束或棒;

b. 燃料元件去護套與斬斷或切碎機 器,即遙控操作之設備可切、斬,或 剪〝核子反應器〞用過燃料組件、束 或棒;

b. Fuel element chopping or shredding machines, i.e. remotely operated equipment to cut, chop or shear irradiated "nuclear reactor" fuel assemblies, bundles or rods;

b. Fuel element decladding equipment and chopping or shredding machines, i.e., remotely operated equipment to cut, chop or shear irradiated "nuclear reactor" fuel assemblies, bundles or rods;

0C004 Note 1

註解 1:就出口管制而言,出口時會 員國主管機關將進行判定,無論符合 上述規格之石墨出口品是否用於〝核 子反應器〞。

註解 1:就出口管制而言,出口者所 在之會員國主管機關將就符合上述規 格之石墨出口品是否用於〝核子反應 器〞用途進行判定。0C004 不管制石 墨純度優於 5 ppm (百萬分之一) 硼 當量、密度大於 1.50 g / cm

3

,不使用 於〝核子反應器〞者。

Note 1: For the purpose of export control, the competent authorities of the Member State in which the exporter is established will determine whether or not the exports of graphite meeting the above specifications are for

"nuclear reactor" use.

Note 1: For the purpose of export control, the competent authorities of the EU Member State in which the exporter is established will

determine whether or not the exports of graphite meeting the above specifications are for "nuclear reactor" use. 0C004 does not control graphite having a purity level better than 5 ppm (parts per million) boron equivalent and with a density greater than 1,50 g/cm3 not for use in a

"nuclear reactor".

1A002 無

註解 5:1A002 不管制專以機械切碎、

磨碎或切割的碳〝纖維狀或絲狀材 料〞,其長度為 25.0 mm 或以下者。

-

Note 5: 1A002.b.1. does not control mechanically chopped, milled, or cut carbon "fibrous or filamentary materials" 25,0 mm or less in length.

1A005

b. 硬式護身裝甲板,其可提供彈道防 護等於或小於第 IIIA 級(NIJ

0101.06,2008 年 7 月),或相當之國 家標準者。

b. 硬式護身裝甲板,其可提供彈道防 護等於或小於第 IIIA 級(NIJ

0101.06,2008 年 7 月),或相當之〝等 效標準〞者。

b. Hard body armour plates providing ballistic protection equal to or less than level IIIA (NIJ 0101.06, July 2008) or national equivalents.

b. Hard body armour plates providing ballistic protection equal to or less than level IIIA (NIJ 0101.06, July 2008), or "equivalent standards".

1A006

1A006 處理土製爆炸裝置而特別設 計或修改的設備,以及特別設計與修 改的零組件:

1A006 特別設計或修改用於處理簡 易爆炸裝置(土製炸彈) (IEDs)的設 備,以及為其特別設計與修改的零組 件:

1A006 Equipment, specially designed or modified for the disposal of improvised explosive devices, as follows, and specially designed components and accessories therefor:

1A006 Equipment, specially designed or modified for the disposal of Improvised Explosive Devices (IEDs), as follows, and specially designed components and accessories therefor:

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7 1A006

Technical Note

技術註解:

‵防爆裝置′指經特別設計,以發射 液體、固體或易碎物等方式用於防止 爆炸裝置運轉的目的。

技術註解:

1A006.b 所述之‵防爆裝置′,指經 特別設計,以發射液體、固體或易碎 物等方式用於防止爆炸裝置運作。

Technical Note:

‘Disruptors’ are devices specially designed for the purpose of preventing the operation of an explosive device by projecting a liquid, solid or frangible projectile.

Technical Note:

For the purposes of 1A006.b.

‘disruptors’ are devices specially designed for the purpose of preventing the operation of an explosive device by projecting a liquid, solid or frangible projectile.

1B002

1B002 生產金屬合金、金屬合金粉 末或合金材料之設備,為避免污染而 特別設計,並用於 1C002.c.2.所述之 製程者。

1B002 設計用以生產金屬合金、金 屬合金粉末或合金材料之設備,具備 下列所有特性:

a. 特別設計為避免污染;及 b. 特別設計用於 1C002.c.2.所述之製 程者。

1B002 Equipment for producing metal alloys, metal alloy powder or alloyed materials, specially designed to avoid contamination and specially designed for use in one of the processes specified in 1C002.c.2.

1B002 Equipment designed to produce metal alloy powder or particulate materials, and having all of the following:

a. Specially designed to avoid contamination; and

b. Specially designed for use in one of the processes specified in 1C002.c.2.

1B231.b. 2. 以金屬氫化物作為儲存或純化介 質之氫同位素儲存或純化系統。

2. 氫同位素儲存或純化系統,以金屬 氫化物作為儲存或純化介質。

2. Hydrogen isotope storage or purification systems using metal hydrides as the storage or purification medium.

2. Hydrogen isotope storage or hydrogen isotope purification systems using metal hydrides as the storage or purification medium.

1C001.a.

Note 1.d. 2. 最大操作溫度為 548 K(275 °C)。 2. 最大操作溫度為 548 K(275 °C)或 更低。

2. A maximum operating temperature of 548 K (275°C);

2. A maximum operating temperature of 548 K (275 °C) or less;

1C002 Technical

Note

3. ‵低週期疲勞壽命′應依 ASTM 標準 E-606‵固定振幅、低週期疲勞 測試之建議程序′進行,或依等效國 家標準測量。測試應依平均應力比為 1,且應力集中因子(Kt)亦為 1 之軸向 進行。平均應力定義為最大應力減最 小應力除以最大應力。

3. ‵低週期疲勞壽命′應依 ASTM 標準 E-606‵固定振幅、低週期疲勞 測試之建議程序′進行,或依等效國 家標準測量。測試應依軸向進行,其 平均應力比為 1,且應力集中因數(Kt) 亦為 1。平均應力比率之定義為最大 應力減最小應力除以最大應力。

3. ‘Low cycle fatigue life’ should be measured in accordance with ASTM Standard E-606 ‘Recommended Practice for Constant-Amplitude Low-Cycle Fatigue Testing’ or national equivalents. Testing should be axial with an average stress ratio equal to 1 and a stress-concentration factor (Kt) equal to 1. The average stress is defined as maximum stress minus

3. ‘Low cycle fatigue life’ should be measured in accordance with ASTM standard E-606 ‘Recommended Practice for Constant-Amplitude Low-Cycle Fatigue Testing’ or national equivalents. Testing should be axial with an average stress ratio equal to 1 and a stress-concentration factor (Kt) equal to 1. The average stress ratio is defined as maximum stress

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8

minimum stress divided by maximum stress.

minus minimum stress divided by maximum stress.

1C006 d. 具下列所有特性之氟碳化物電子 冷卻液:

d. 氟碳化物液體設計用於電子冷卻 且具下列所有特性:

d. Fluorocarbon electronic cooling fluids having all of the following:

d. Fluorocarbon fluids designed for electronic cooling and having all of the following:

1C010

c. 無機〝纖維或絲狀材料〞,具下列 所有特性:

1.〝比模數〞超過 2.54 × 10

6

m;及 2. 在惰性環境中,熔點、軟化點、分 解點及昇華點超過 1,922 K(1,649

°C);

c. 無機〝纖維或絲狀材料〞,具下列 所有特性:

1.具下列任一特性:

a. 材料重量由 50%或更多二氧化矽 組成,且〝比模數〞超過 2.54 × 10

6

m;

b. 1C010.c.1.a.未管制,且〝比模數〞

超過 2.54 × 10

6

m;及

c. Inorganic "fibrous or filamentary materials", having all of the following:

1. "Specific modulus" exceeding 2,54 x 106 m; and

2. Melting, softening, decomposition or sublimation point exceeding 1 922 K (1 649 °C) in an inert environment;

c. Inorganic "fibrous or filamentary materials", having all of the following:

1. Having any of the following:

a. Composed of 50 % or more by weight silicon dioxide and having a "specific modulus" exceeding 2,54 × 106 m; or b. Not specified in 1C010.c.1.a. and having a "specific modulus" exceeding 5,6 × 106 m; and

2. Melting, softening, decomposition or sublimation point exceeding 1 922 K (1 649 °C) in an inert environment;

1C010.e.2

c. ‵動態機械性分析玻璃轉換溫度 (DMA Tg)′等於或大於 505 K (232

°C),且含有非 1C008 或 1C009.b.所 述,且非屬酚醛樹脂的其他樹脂或瀝 青;

c. ‵動態機械性分析玻璃轉換溫度 (DMA Tg)′等於或大於505 K (232 ° C),且含有未由 1C008 或 1C009.b.所 述之樹脂或瀝青,且非屬酚醛樹脂;

c. ‘Dynamic Mechanical Analysis glass transition temperature (DMA Tg)’ equal to or exceeding 505 K (232

°C) and having a resin or pitch, not specified in 1C008 or 1C009.b., and not being a phenolic resin;

c. ‘Dynamic Mechanical Analysis glass transition temperature (DMA Tg)’ equal to or exceeding 505 K (232

°C) and having a resin or pitch, not specified in 1C008 or 1C009.b., and not being a phenolic resin;

1C350 無

66. 二氯磷酸甲酯 (CAS 677-24-7);

67. 二氯磷酸鹽乙酯 (CAS 1498-51-7);

68. 二氟磷酸甲酯 (CAS 22382-13-4);

69. 二氟磷酸乙酯 (CAS 460-52-6);

70. 氯亞磷酸二乙酯 (CAS 589-57-1);

-

66. Methyl dichlorophosphate (CAS 677-24-7);

67. Ethyl dichlorophosphate (CAS 1498-51-7);

68. Methyl difluorophosphate (CAS 22382-13-4);

69. Ethyl difluorophosphate (CAS 460-52-6);

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9 71. 氯氟磷酸甲酯 (CAS 754-01-8);

72. 氯氟磷酸乙酯 (CAS 762-77-6);

73. N,N-二甲基甲脒 (CAS 44205-42-7);

74. N,N-二乙基甲脒 (CAS 90324-67-7);

75. N,N-二丙基甲脒 (CAS 48044-20-8);

76. N,N-二異丙基甲脒 (CAS 857522-08-8);

77. N,N-二甲基乙脒 (CAS 2909-14-0);

78. N,N-二乙基乙脒 (CAS 14277-06-6);

79. N,N-二丙基乙脒 (CAS 1339586-99-0);

80. N,N-二甲基丙脒 (CAS 56776-14-8);

81. N,N-二乙基丙脒 (CAS 84764-73-8);

82. N,N-二丙基丙脒 (CAS 1341496-89-6);

83. N,N-二甲基丁脒 (CAS 1340437-35-5);

84. N,N-二乙基丁脒 (CAS 53510-30-8);

85. N,N-二丙基丁脒 (CAS 1342422-35-8);

86. N,N-二異丙基丁脒 (CAS

70. Diethyl chlorophosphite (CAS 589-57-1);

71. Methyl chlorofluorophosphate (CAS 754-01-8);

72. Ethyl chlorofluorophosphate (CAS 762-77-6);

73. N,N-Dimethylformamidine (CAS 44205-42-7);

74. N,N-Diethylformamidine (CAS 90324-67-7);

75. N,N-Dipropylformamidine (CAS 48044-20-8);

76. N,N-Diisopropylformamidine (CAS 857522-08-8);

77. N,N-Dimethylacetamidine (CAS 2909-14-0);

78. N,N-Diethylacetamidine (CAS 14277-06-6);

79. N,N-Dipropylacetamidine (CAS 1339586-99-0);

80. N,N-Dimethylpropanamidine (CAS 56776-14-8);

81. N,N-Diethylpropanamidine (CAS 84764-73-8);

82. N,N-Dipropylpropanamidine (CAS 1341496-89-6);

83. N,N-Dimethylbutanamidine (CAS 1340437-35-5);

84. N,N-Diethylbutanamidine (CAS 53510-30-8);

85. N,N-Dipropylbutanamidine (CAS 1342422-35-8);

86. N,N-Diisopropylbutanamidine (CAS

(10)

10 1315467-17-4);

87. N,N-二甲基異丁脒 (CAS 321881-25-8);

88. N,N-二乙基異丁脒 (CAS 1342789-47-2);

89. N,N-二丙基異丁脒 (CAS 1342700-45-1)。

1315467-17-4);

87. N,N-Dimethylisobutanamidine (CAS 321881-25-8);

88. N,N-Diethylisobutanamidine (CAS 1342789-47-2);

89. N,N-Dipropylisobutanamidine (CAS 1342700-45-1).

1C350 Note

註解 3:1C350 不管制含 1 種或以上 1C350.2、.6、.7、.8、.9、.10、.14、

..15、.16、.19、.20、.24、.25、.30

、.37、.38、.39、.40、.41、.42、.43

、.44、.45、.46、.47、.48、.49、.50

、.51、.52、.53、.58、.59、.60、.61 及.62 所述化學品之〝化學品混合 物〞,惟化學品混合物中所含上列管 制化學品個別成分之重量百分比不超 過 30 %。

註解 3:1C350 不管制含有 1 種或以 上

1C350.2、.6、.7、.8、.9、.10、.14、

.15、.16、.19、.20、.24、.25、.30

、.37、.38、.39、.40、.41、.42、.43

、.44、.45、.46、.47、.48、.49、.50

、.51、.52、.53、.58、.59、.60、.61

、.62、.64、.66、.67、.68、.69、.70

、.71、.72、.73、.74、.75、.76、.77

、.78、.79、.80、.81、.82、.83、.84

、.85、.86、.87、.88 及.89 所述化學 品之〝化學品混合物〞,惟化學品混 合物中所含上列管制化學品個別成分 之重量百分比不超過 30 %。

Note 3: 1C350 does not control

"chemical mixtures" containing one or more of the chemicals specified in entries

1C350 .2,.6, .7, .8, .9, .10, .14, .15, .16, .19, .20, .24, .25, .30, .37, .38, .39, .40, .41, .42, .43, .44, .45, .46, .47, .48, .49, .50, .51, .52, .53, .58, .59, .60, .61,.62 and .64 in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.

Note 3: 1C350 does not control

"chemical mixtures" containing one or more of the chemicals specified in entries

1C350.2, .6, .7, .8, .9, .10, .14, .15, .16, .19, .20, .24, .25, .30, .37, .38, .39, .40, .41, .42, .43, .44, .45, .46, .47, .48, .49, .50, .51, .52, .53, .58, .59, .60, .61, .62, .64, .66, .67, .68, .69, .70, .71, .72, .73, .74, .75, .76, .77, .78, .79, .80, .81, .82, .83, .84, .85, .86, .87, .88 and .89 in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.

1C351.a 無 59. 中東呼吸症候群冠狀病毒(MERS

相關冠狀病毒);

-

59. Middle East respiratory syndrome-related coronavirus (MERS-related coronavirus);

1C353

a. 任何‵基因改造之有機體′含 有,或‵遺傳因子′為其編碼下列任 一者:

1. 1C351.a. 或 1C354.a.中任何病毒之 基因。

a. 任何‵基因改造之有機體′含 有,或‵遺傳因子′為其編碼下列任 一者:

1. 1C351.a. 或 1C354.a.所述之任何病 毒之任何基因。

a. Any ‘genetically-modified organism’ which contains, or

‘genetic element’ that codes for, any of the following:

1. Any gene or genes specific to any virus specified in 1C351.a. or

a. Any ‘genetically-modified organism’ which contains, or

‘genetic element’ that codes for, any of the following:

1. Any gene or genes specific to any virus specified in 1C351.a. or

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11 2. 1C351.c. 或 1C354.b.中之任何細菌

之基因,或 1C351.e.或 1C354.c.中任 何真菌之基因,其具下列任一特性:

2. 1C351.c. 或 1C354.b.所述之任何細 菌之任何基因,或 1C351.e.或 1C354.c.

所述之任何真菌之任何基因,其具下 列任一特性:

1C354.a.;

2. Any gene or genes specific to bacterium specified in 1C351.c. or 1C354.b. or fungus specified in 1C351.e. or 1C354.c., and which is any of the following:

1C354.a.;

2. Any gene or genes specific to any bacterium specified in 1C351.c. or 1C354.b. or fungus specified in 1C351.e. or 1C354.c., and which is any of the following:

2A001 2A001 抗磨軸承或軸承系統及其零 件,如下:

2A001 抗磨軸承、軸承系統及零 件,如下:

2A001 Anti-friction bearings and bearing systems, as follows, and components therefor:

2A001 Anti-friction bearings, bearing systems and components, as follows:

2A001 Note

註解:2A001 不管制經製造商依 ISO 3290:2001 標示之公差為等級 G5 (或 其他等效國家標準),或較次級之滾 珠。

刪除

Note: 2A001 does not control balls with tolerances specified by the manufacturer in accordance with ISO 3290:2001 as grade G5 (or national equivalents) or worse.

-

2A001.c c. 使用下列任一者之主動磁浮軸承 系統:

c. 使用下列任一者之主動磁浮軸承 系統,及特別為其設計之零件:

c. Active magnetic bearing systems using any of the following:

c. Active magnetic bearing systems using any of the following, and specially designed components therefor:

2B001 無

註解 4:除車削、銑削或研磨功能外,

尚具備增材製造功能之工具機,必須 依 2B001.a.、b.或 c.所規範之每一適用 項目進行評估。

-

Note 4: A machine tool having an additive manufacturing capability in addition to a turning, milling or grinding capability must be evaluated against each applicable entry 2B001.a.,.b. or.c

2B350

g. 閥及其零件,如下:

1. 閥,其具下列所有特性:

a. ‵標稱尺寸′大於 10 mm (3/8");及

b. 所有與生產、處理或容納之化學 品直接接觸之表面,其由包含‵抗腐 蝕材料′所製成;

g. 閥及其零件,如下:

1. 閥,其具下列所有特性:

a. ‵標稱尺寸′大於 DN 10 或 NPS 3/8;及

b. 所有與生產、處理或容納之化學 品直接接觸之表面,其由包含‵抗腐 蝕材料′所製成;

g. Valves and components, as follows:

1. Valves, having both of the following:

a. A ‘nominal size’ greater than 10 mm (3/8"); and

b. All surfaces that come in direct contact with the chemical(s) being produced, processed, or contained are

g. Valves and components, as follows:

1. Valves, having both of the following:

a. A ‘nominal size’ greater than DN 10 or NPS 3/8; and

b. All surfaces that come in direct contact with the chemical(s) being produced, processed, or contained are

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12 2. 2B350.g.1.未規範之其他閥,其具下

列所有特性:

a. ‵標稱尺寸′等於或大於 25.4 mm(1")且等於或小於 101.6mm(4");

2. 2B350.g.1.未規範之其他閥,其具下 列所有特性:

a. ‵標稱尺寸′等於或大於 DN 25.4 或 NPS 1,且等於或小於 DN 100 或 NPS 4;

made from ‘corrosion resistant materials’;

2. Valves, other than those specified in 2B350.g.1., having all of the following;

a. A ‘nominal size’ equal to or greater than 25,4 mm (1") and equal to or less than 101,6 mm (4");

made from ‘corrosion resistant materials’;

2. Valves, other than those specified in 2B350.g.1., having all of the following;

a. A ‘nominal size’ equal to or greater than DN 25 or NPS 1 and equal to or less than DN 100 or NPS 4;

2B350 Technical

Note 無

3. 閥之標稱尺寸(DN)符合

ISO6708:1995。標稱管道尺寸(NPS) 符合 ASME B36.10 或 B36.19 或國家 等效標準。

-

3. Nominal sizes (DN) of valves are in accordance with ISO 6708:1995.

Nominal Pipe Sizes (NPS) are in accordance with ASME B36.10 or B36.19 or national equivalents.

2B352.b

技術註解:

就 2B352.b.目的,發酵器包括生物反 應器、一次性使用(拋棄式)生物反應 器、恆化器及連續流動系統。

技術註解:

1. 就 2B352.b.目的,發酵器包括生物 反應器、一次性使用(拋棄式)生物反 應器、連續培養裝置及連續流動系統。

2. 培育室保持設備包括具備硬質壁 之一次性使用之培育室。

Technical Note:

For the purposes of 2B352.b.

fermenters include bioreactors, single-use (disposable) bioreactors, chemostats

and continuous-flow systems.

Technical Notes:

1. For the purposes of 2B352.b.

fermenters include bioreactors, single-use (disposable) bioreactors, chemostats and continuous-flow systems.

2. Cultivation chamber holding devices include single-use cultivation chambers with rigid walls.

3B001.f 2. 覆膜誤差小於 23 nm (3σ); 2. 覆膜誤差小於 27 nm (平均 +3 sigma);

2. An overlay error less than 23 nm (mean + 3σ);

2. An overlay error less than 27 nm (mean + 3 sigma);

3B001.h 無 說明:為光學感測器特別設計之光罩

與網線,參照 6B002。

-

NB: For masks and reticles, specially designed for optical sensors, see 6B002.

3D003

3D003 為微影、蝕刻或沉積製程之

〝開發〞而特別設計,並以‵物理為 基準′之模擬〝軟體〞,可將光罩圖 案轉換為導體、介電質或半導體材料

3D003 為〝開發〞極紫外線(EUV) 微影光罩或網線之上圖案所特別設計 之‵計算微影′軟體。

技術註解:

3D003 ‘Physics-based’ simulation

"software" specially designed for the

"development" of lithographic, etching or deposition processes for

3D003 ‘Computational lithography’

"software" specially designed for the

"development" of patterns on EUVlithography masks or reticles.

(13)

13 之特定表面起伏圖案。

技術註解:

3D003 中之‵物理為基準′係指利用 計算方法以決定一連串基於物理特性 (如溫度、壓力、擴散常數與半導體材 料性質)所引起物理上之因果現象。

‵計算微影′為利用電腦模型進行預 測、校正、優化與驗證微影製程在一 系列圖案、製程與系統條件下之成象 性能。

translating masking patterns into specific topographical patterns in conductors, dielectrics or

semiconductor materials.

Technical Note:

‘Physics-based’ in 3D003 means using computations to determine a sequence of physical cause and effect events based on physical properties (e.g., temperature, pressure, diffusion constants and semiconductor materials properties).

Technical Note:

‘Computational lithography’ is the use of computer modelling to predict, correct, optimise and verify imaging performance of the lithography process over a range of patterns, processes, and system conditions.

3E002.a

a. 設計用於同時執行 2 個以上浮點向 量(32 位元或以上之 1 維陣列)計算之

‵向量處理器單元′;

技術註解:

‵向量處理器單元′是一個處理元件 具有內建指令,可同時執行多重浮點 向量(32 位元或以上之 1 維陣列)計 算,並具有至少一個向量運算邏輯單 元及至少有 32 個元件之向量暫存器。

a. 設計用於同時執行 2 個以上浮點向 量(32 位元或以上之 1 維陣列)計算之

‵向量處理器單元′;

技術註解:

‵向量處理器單元′是一個處理元件 具有內建指令,可同時執行多重‵浮 點′向量(32 位元或以上之 1 維陣列) 計算,並具有至少一個向量運算邏輯 單元及至少有 32 個元件之向量暫存 器。

a. A ‘vector processor unit’

designed to perform more than two calculations on floating-point vectors (one-dimensional arrays of 32-bit or larger numbers)

simultaneously;

Technical Note:

A ‘vector processor unit’ is a processor element with built-in instructions that perform multiple calculations on floating-point vectors (one-dimensional arrays of 32-bit or larger numbers)

simultaneously, having at least one vector arithmetic logic unit and vector registers of at least 32 elements each.

a. A ‘vector processor unit’

designed to perform more than two calculations on ‘floating-point’

vectors (one-dimensional arrays of 32-bit or larger numbers)

simultaneously;

Technical Note:

A ‘vector processor unit’ is a processor element with built-in instructions that perform multiple calculations on ‘floating-point’

vectors (one-dimensional arrays of 32-bit or larger numbers)

simultaneously, having at least one vector arithmetic logic unit and vector registers of at least 32 elements each.

3E002.b b. 設計在每一循環中執行大於 4 個 64 位元或以上浮點運算之結果者;或

b. 設計在每一循環中執行大於 4 個 64 位元或以上‵浮點′運算之結果 者;或

b. Designed to perform more than four 64-bit or larger floating-point operation results per cycle; or

b. Designed to perform more than four 64-bit or larger ‘floating-point’

operation results per cycle; or

(14)

14 3E002.c

c. 設計在每一循環中執行大於 8 個 16 位元定點乘積結果者(例如,對已 經數位化之類比資料進行數位處理,

也稱為數位訊號處理)。

c. 設計在每一循環中執行大於 8 個 16 位元‵定點′乘積結果者(例如,

對已經數位化之類比資料進行數位處 理,也稱為數位訊號處理)。

c. Designed to perform more than eight 16-bit fixed-point

multiply-accumulate results per cycle (e.g., digital manipulation of analogue information that has been previously converted into digital form, also known as digital "signal processing").

c. Designed to perform more than eight 16-bit ‘fixed-point’

multiply-accumulate results per cycle (e.g., digital manipulation of analogue information that has been previously converted into digital form, also known as digital "signal processing").

3E002 Technical

Notes:

技術註解:

1. 3E002.a 與 3E002.b 所述之‵浮 點′,由 IEEE-754 所定義。

2. 3E002.c 所述之‵定點′,指同時 具有整數分量和小數分量之固定寬度 實數,且不包括僅有整數格式者。

-

Technical Notes:

1. For the purpose of 3E002.a. and 3E002.b., ‘floating-point’ is defined by IEEE-754.

2. For the purpose of 3E002.c.,

‘fixed-point’ refers to a

fixed-width real number with both an integer component and a fractional component, and which does not include integer-only formats.

3E004 無

對直徑 300 mm (12 吋)矽晶圓進行切 割、研磨與拋光,使其能在晶圓表面 且排除小於或等於 2 mm 的邊緣範圍 之內,任意決定面積 26 mm × 8 mm 的單元之中,達到‵表面基準部位平 坦度指標′(‵SFQR′)小於或等於 20 nm 之〝必要〞〝技術〞。

技術註解:

3E004 所指之‵表面基準部位平坦 度′(‵SFQR′),為參考晶圓基準單 元之最大及最小之偏差範圍,該範圍 是由所有晶圓表面數據,包括單元內

-

"Technology" "required" for the slicing, grinding and polishing of 300 mm diameter silicon wafers to achieve a ‘Site Front least sQuares Range’

(‘SFQR’) less than or equal to 20 nm at any site of 26 mm × 8 mm on the front surface of the wafer and an edge exclusion less than or equal to 2 mm.

Technical Note:

For the purposes of 3E004 ‘SFQR’ is the range of maximum deviation and minimum deviation from front

reference plane, calculated by least

(15)

15

的邊界在內,以最小平方法計算所得。

square method with all front surface data including site boundary within a site.

4E001 Note 1

註解 1:4E001.a.與 4E001.c.不管制

‵弱點公開′或‵網路事件應變′。

註解 1:4E001.a.與 4E001.c.不管制 〝弱 點公開〞或〝網路事件應變〞。

Note 1: 4E001.a. and 4E001.c. do not control ‘vulnerability disclosure’

or ‘cyber incident response’.

Note 1: 4E001.a. and 4E001.c. do not control "vulnerability disclosure" or

"cyber incident response".

4E001 Technical

Notes:

1. ‵弱點公開′指以解決漏洞為目 的,由負責處理的個人或組織或協同 處者進行識別,報告或傳播漏洞或分 析漏洞的過程。

2. ‵網路事件應變′指解決網路安 全事件時,由負責處理的個人或組織 或協同處者在網路安全事件上交換必 要訊息的過程。

刪除

Technical Notes:

1. ‘Vulnerability disclosure’ means the process of identifying,

reporting, or communicating a vulnerability to, or analysing a vulnerability with, individuals or organizations responsible for conducting or coordinating remediation for the purpose of resolving the vulnerability.

2. ‘Cyber incident response’ means the process of exchanging necessary information on a cyber security incident with individuals or organizations responsible for conducting or coordinating remediation to address the cyber security incident.

-

5A001.h

h. 干擾簡易爆炸裝置(土製炸 彈)(IED)設備及相關設備,如下:

1. 未由 5A001.f.管制,專門設計或改 裝之無線電頻率(RF)設備,用於提前 啟動或防止啟動之簡易爆炸裝置(土 製炸彈);

h. 簡易爆炸裝置(土製炸彈)(IED)設 備及相關設備,如下:

1. 未為 5A001.f.所述之無線電頻率 (RF)設備,專門設計或改造用於提前 啟動或防止啟動簡易爆炸裝置 (IEDs);

h. Counter Improvised Explosive Device (IED) equipment and related equipment, as follows:

1. Radio Frequency (RF) transmitting equipment, not specified in 5A001.f., designed or modified for prematurely activating or preventing the initiation of Improvised Explosive

h. Counter Improvised Explosive Device (IED) equipment and related equipment, as follows:

1. Radio Frequency (RF) transmitting equipment, not specified in 5A001.f., designed or modified for prematurely activating or preventing the

initiation of Improvised Explosive

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16

Devices; Devices (IEDs);

5A001.j 2. 為特別設計用於履行所有下列者:

a. 在‵硬選擇′基礎下執行搜尋;及

2. 為特別設計用於履行所有下列者:

a. 在〝硬選擇〞基礎下執行搜尋;及

2. Being specially designed to carry out all of the following:

a. Execution of searches on the basis of ‘hard selectors’; and

2. Being specially designed to carry out all of the following:

a. Execution of searches on the basis of "hard selectors"; and

5D001.e 無

e. 5D001.a.或 5D001.c.所述之外,特別 設計或修改用於執法部門監視或分析 之〝軟體〞,提供下列所有者:

1. 使用‵切換介面′,在通訊服務提 供者的通訊內容或獲得的元資料之 中,以〝硬選擇器〞為基礎執行搜尋;

2. 依據搜尋通訊內容或元資料或 5D001.e.1 所述之搜尋之結果,映射關 係網路或追蹤個別目標的移動。

-

e. "Software", other than that specified in 5D001.a. or 5D001.c., specially designed or modified for monitoring or analysis by law enforcement, providing all of the following:

1. Execution of searches on the basis of "hard selectors" of either the content of communication or metadata acquired from a communications service provider using a ‘handover interface’; and

2. Mapping of the relational network or tracking the movement of targeted individuals based on the results of searches on content of communication or metadata or searches as described in 5D001.e.1.

5D001.e.

Technical Note

技術註解:

1. 5D001.e.所述之‵切換介面′為實 體與邏輯介面,設計為授權執法機關 使用,通信服務提供者依據提出的請 求,針對特定目標採取攔截措施,其 攔截結果將由通訊服務提供者送交提 出請求的機構。‵切換介面′在系統 或設備(例如:中介裝置)之中,針對

-

Technical Notes:

1. For the purposes of 5D001.e., a

‘handover interface’ is a physical and logical interface, designed for use by an authorised law enforcement authority, across which targeted interception measures are requested from a communications service provider and the results of

(17)

17 被請求的攔截完成接收與驗證,且僅 將完全滿足該請求的攔截結果交付給 請求機構。

2. ‵切換介面′可能由國際標準(包 括但不限於 ETSI TS 101 331、ETSI TS 101 671、3GPP TS 33.108),或國 家等效標準所指定。

interception are delivered from a communications service provider to the requesting authority. The

‘handover interface’ is implemented within systems or equipment (e.g., mediation devices) that receive and validate the interception request, and deliver to the requesting authority only the results of interception that fulfil the validated request.

2. ‘Handover interfaces’ may be specified by international standards (including but not limited to ETSI TS 101 331, ETSI TS 101 671, 3GPP TS 33.108) or national equivalents.

5D001.e.

Note 無

註解:5D001.e.不管制〝軟體〞,其 特別設計或修改為下列任一者:

a. 帳務目的;

b. 網路服務品質(QoS);

c. 經驗品質(QoE);

d. 中介裝置;

e. 行動支付或銀行用途。

-

Note: 5D001.e. does not control

"software" specially designed or modified for any of the following:

a. Billing purposes;

b. Network Quality of Service (QoS);

c. Quality of Experience (QoE);

d. Mediation devices; or

e. Mobile payment or banking use.

5E001.a.

a. 依照一般技術註解,為〝開發〞、

〝生產〞或〝使用〞(操作除外) 5A001 所述之設備、功能或特性,或 5D001.a.

所述〝軟體〞之〝技術〞。

a. 依照一般技術註解,為〝開發〞、

〝生產〞或〝使用〞(操作除外) 5A001 所述之設備、功能或特性,或為 5D001.a.、5D001.e.所述〝軟體〞之〝技 術〞。

a. "Technology" according to the General Technology Note for the

"development", "production" or "use"

(excluding operation) of equipment, functions or features specified in 5A001 or "software" specified in 5D001.a.;

a. "Technology" according to the General Technology Note for the

"development", "production" or "use"

(excluding operation) of equipment, functions or features specified in 5A001 or "software" specified in 5D001.a. or 5D001.e.;

5A002.a a. 設計或修改用於‵資料機密性密 a. 設計或修改用於具‵描述安全演

a. Designed or modified to use a. Designed or modified to use

(18)

18 碼學′,其具‵描述安全演算法′,

密碼功能能夠以不使用安全機制的

〝密碼啟用〞進行使用、已經啟用或 能夠啟用,如下:

算法′之‵資料機密性密碼學′,其 密碼功能可經由安全〝密碼啟用〞之 外之任何方式進行使用、已啟用或能 夠啟用,如下:

‘cryptography for data confidentiality’ having a

‘described security algorithm’, where that cryptographic capability is usable, has been activated, or can be activated by means of

"cryptographic activation" not employing a secure mechanism, as follows:

‘cryptography for data confidentiality’ having a

‘described security algorithm’, where that cryptographic capability is usable, has been activated, or can be activated by any means other than secure "cryptographic activation", as follows:

5A002.a Note.f

f. 項目之〝資訊安全〞功能僅限於無 線〝個人區域網路〞的功能,符合下 列所有特性:

f. 項目之〝資訊安全〞功能僅限於無 線〝個人區域網路〞的功能,僅能使 用公開或商業密碼標準;

f. Items, where the "information security" functionality is limited to wireless "personal area network"

functionality, meeting all of the following:

f. Items, where the "information security" functionality is limited to wireless "personal area network"

functionality, implementing only published or commercial cryptographic standards;

5A002.a Note.h

h. 路由器、交換器或中繼器,其〝資 訊安全〞功能被限制在〝操作、管理 或維護〞(〝OAM〞)任務,執行僅為 發佈或商用密碼規範;或

h. 路由器、交換器、閘道器或中繼 器,其〝資訊安全〞功能被限制在〝操 作、管理或維護〞(〝OAM〞)任務,

執行僅為發佈或商用密碼規範;或

h. Routers, switches or relays, where the "information security"

functionality is limited to the tasks of "Operations, Administration or Maintenance" ("OAM") implementing only published or commercial cryptographic standards; or

h. Routers, switches, gateways or relays, where the "information security" functionality is limited to the tasks of "Operations,

Administration or Maintenance"

("OAM") implementing only published or commercial cryptographic

standards; or

5A004 無

b. 未由 4A005 或 5A004.a.所管制之項 目,設計或修改用於執行下列所有者:

1. 由計算或通信裝置中‵提取原始 資料′;及

2. 規避裝置〝驗證〞或授權控制,以 執行 5A004.b.1 所述之功能。

-

b. Items, not specified in 4A005 or 5A004.a., designed to perform all of the following:

1. ‘Extract raw data’ from a computing or communications device;

and

2. Circumvent "authentication" or authorisation controls of the device, in order to perform the function

(19)

19

described in 5A004.b.1.

5A004 Technical

Note 無

技術註解:

由計算或通信裝置中‵提取原始資 料′,指由設備的儲存媒體(例如:

RAM、快閃記憶體或硬碟)中檢索二 進制數據,而無需設備操作系統或檔 案系統進行解釋。

註解 1:5A004.b.不管制為〝發展〞或

〝生產〞計算或通信裝置所特別設計 的系統或設備。

-

Technical Note:

‘Extract raw data’ from a computing or communications device means to retrieve binary data from a storage medium (e.g., RAM, flash or hard disk) of the device without interpretation by the device’s operating system or filesystem.

5A004 Note 無

註解 1:5A004.b.不管制為〝發展〞或

〝生產〞計算或通信裝置所特別設計 的系統或設備。

註解:5A004.b.不包括:

a. 除錯器、虛擬化管理程序;

b. 僅限於邏輯資料提取的項目;

c. 利用晶片分離(chip-off)或 JTAG 進 行資料提取的項目;或

d. 特別設計限制越獄(jail-breaking)或 獲得作業系統超級使用者權限 (rooting)的項目。

-

Note 1: 5A004.b. does not control systems or equipment specially designed for the "development" or

"production" of a computing or communications device.

Note: 5A004.b. does not include:

a. Debuggers, hypervisors;

b. Items limited to logical data extraction;

c. Data extraction items using chip-off or JTAG; or

d. Items specially designed and limited to jail-breaking or rooting.

5D002.a 3. 5A004 管制之設備或 5D002.c.3.管 制之〝軟體〞;

3. 設備或〝軟體〞,如下:

a. 5A004.a.管制之設備或 5D002.c.3.a.

管制之〝軟體〞;

b. 5A004.b.管制之設備或 5D002.c.3.b.

管制之〝軟體〞。

3. Equipment specified in 5A004 or

"software" specified in 5D002.c.3.;

3. Equipment or "software", as follows:

a. Equipment specified in 5A004.a. or

"software" specified in 5D002.c.3.a.;

b. Equipment specified in 5A004.b. or

"software" specified in 5D002.c.3.b.

5D002.c 3. 5A004 管制之設備; 3. 設備,如下:

a. 5A004.a.管制之設備;

3. Equipment specified in 5A004. 3. Equipment, as follows:

a. Equipment specified in 5A004.a.;

(20)

20 b. 5A004.b.管制之設備。

註解:5D002.c.3.b.不管制〝入侵軟 體〞。

b. Equipment specified in 5A004.b.

Note: 5D002.c.3.b. does not control

"intrusion software".

5E002.a.

a. 依照一般技術註解,用於〝開發〞、

〝生產〞或〝使用〞由 5A002、5A003、

5A004 或 5B002 所述而設計或修改之 設備,或 5D002.a.或 5D002.c.所述之

〝軟體〞所使用之〝技術〞。

a. 依照一般技術註解,用於〝開發〞、

〝生產〞或〝使用〞由 5A002、5A003、

5A004 或 5B002 所述而設計或修改之 設備,或 5D002.a.或 5D002.c.所述之

〝軟體〞所使用之〝技術〞。

註解:5E002.a.不管制 5A004.b.、

5D002.a.3.b.或 5D002.c.3.b 所指定項 目之〝技術〞。

a. "Technology" according to the General Technology Note for the

"development", "production" or "use"

of equipment specified in 5A002, 5A003, 5A004 or 5B002, or of

"software" specified in 5D002.a. or 5D002.c.

a. "Technology" according to the General Technology Note for the

"development", "production" or "use"

of equipment specified in 5A002, 5A003, 5A004 or 5B002, or of

"software" specified in 5D002.a. or 5D002.c.

Note: 5E002.a. does not control

"technology" for items specified in 5A004.b., 5D002.a.3.b. or 5D002.c.3.b

6A001.a.1.c .1

b. 設計用於 100%工作週期下連續操 作,及其輻射‵自由場訊源位準 (SLRMS)′超過(10log(f) + 159,77) dB(在 1 公尺深度下 1μ Pa 為參考基 準),f 為最大發送電壓響應(TVR)頻 率,單位為 Hz,其低於 10kHz 者;

b. 設計用於 100%工作週期下連續操 作,及其輻射‵自由場訊源位準 (SL

RMS

)′超過(10log(f) + 159,77) dB(在 1 公尺深度下 1μ Pa 為參考基 準),f 為最大發送電壓響應(TVR)頻 率,單位為 Hz,其低於 10kHz 者;

b. Designed for continuous operation at 100 % duty cycle and having a continuously radiated ‘free-field Source Level (SLRMS)’ at 100 % duty cycle exceeding (10log(f) + 159,77) dB (reference 1 μPa at 1 m) where f is the frequency in Hertz of maximum Transmitting Voltage Response (TVR) below 10kHz; or

b. Designed for continuous operation at 100 % duty cycle and having a continuously radiated

‘free-field Source Level (SL

RMS

)’ at 100 % duty cycle exceeding (10log(f) + 159,77) dB (reference 1 μPa at 1 m) where f is the frequency in Hertz of maximum Transmitting Voltage Response (TVR) below 10kHz; or

6A001.a.1.c .1 Technical

Note

技術註解:

‵自由場訊源位準(SLRMS)′定義為 沿聲波投射器最大響應軸線與最遠區 域,其可由發送電壓響應(TVR)獲得 如下公式:SLRMS= (TVR +

20logVRMS) dB(在 1 公尺深度下 1μ Pa 為參考基準),其中 SLRMS 為訊源 位準,TVR 為發射電壓響應,VRMS 為聲波投射器之驅動電壓。

技術註解:

‵自由場訊源位準(SL

RMS

)′定義為 沿聲波投射器最大響應軸線與最遠區 域,其可由發送電壓響應(TVR)獲得 如下公式:SL

RMS

= (TVR + 20logV

RMS

) dB(在 1 公尺深度下 1μ Pa 為參考基 準),其中 SL

RMS

為訊源位準,TVR 為發射電壓響應,V

RMS

為聲波投射器 之驅動電壓。

Technical Note:

The ‘free-field Source Level (SLRMS)’ is defined along the maximum response axis and in the far field of the acoustic projector. It can be obtained from the Transmitting Voltage Response using the following equation: SLRMS = (TVR + 20log VRMS) dB (ref 1μPa at 1 m), where SLRMS is the source level, TVR is the

Technical Note:

The ‘free-field Source Level (SL

RMS

)’

is defined along the maximum

response axis and in the far field of

the acoustic projector. It can be

obtained from the Transmitting

Voltage Response using the following

equation: SL

RMS

= (TVR + 20log

V

RMS

) dB (ref 1μPa at 1 m), where

SL

RMS

is the source level, TVR is the

(21)

21

Transmitting Voltage Response and VRMS is the Driving Voltage of the Projector.

Transmitting Voltage Response and V

RMS

is the Driving Voltage of the Projector.

6A004.c

4. 由〝複合〞材料製成,其在任一座 標方向之線性熱膨脹係數等於或小於 5×10

-6

4. 由〝複合〞材料製成,在任何座標 方向,其線性熱膨脹係數等於或小於 5×10

-6

/K。

4. Components manufactured from

"composite" materials having a coefficient of linear thermal expansion equal to or less than 5 x 10-6 in any coordinate direction;

4. Components manufactured from

"composite" materials having a coefficient of linear thermal expansion, in any coordinate direction, equal to or less than 5 × 10

–6

/K;

6A005.a.6.a

a. ‵單橫向模式′且具下列特性:

1. 平均輸出功率超過 1,000W;或 2. 具下列所有特性:

a. 平均輸出功率超過 500 W;且 b. 光譜帶寬小於 40 GHz;或

a. ‵單橫向模式′且具下列特性:

1. 輸出功率超過 1,000 W;或 2. 具下列所有特性:

a. 輸出功率超過 500 W;且 b. 光譜帶寬小於 40 GHz;或

a. ‘Single transverse mode’ output and any of the following:

1. Average output power exceeding 1 000 W; or

2. Having all of the following:

a. Average output power exceeding 500 W; and

b. Spectral bandwidth less than 40 GHz; or

a. ‘Single transverse mode’ output and any of the following:

1. Output power exceeding 1 000 W; or 2. Having all of the following:

a. Output power exceeding 500 W; and b. Spectral bandwidth less than 40 GHz; or

6A005.a.6.b Technical

Note

技術註解:

就 6A005.a.6.b.註解 2.a.目的,‵亮 度′定義為〝雷射〞輸出功率除以波 束參數積(BPP)之平方,即(輸出功 率)/BPP

2

刪除

Technical Note:

For the purpose of 6A005.a.6.b. Note 2.a., ‘brightness’ is defined as the output power of the "laser" divided by the squared Beam Parameter Product (BPP), i.e., (output power)/BPP2.

-

6A008.i Note

1. 最大〝儀器測量範圍〞為 500km 或 以下;

1. 最大‵儀器測量範圍′為 500 km 或以下;

1. A maximum "instrumented range" of 500 km or less;

1. A maximum ‘instrumented range’ of 500 km or less;

6A008.i Technical

Note 無

技術註解:

6A008.i.所指之‵儀器測量範圍′為 雷達明確指定之顯示範圍。

-

Technical Note:

For the purposes of 6A008.i.

‘instrumented range’ is the specified unambiguous display range of a radar.

7A103 c. ‵整合導航系統′,設計或修改用 c. ‵整合導航系統′,設計或修改用

c. ‘Integrated navigation systems’, c. ‘Integrated navigation systems’,

(22)

22 於‵飛彈′,且能提供導航準確度

200 m 〝誤差圓徑〞(〝CEP〞)或以下。

於‵飛彈′,且能提供導航準確度 200 m ‵誤差圓徑′(‵CEP′)或以 下。

designed or modified for ‘missiles’

and capable of providing a

navigational accuracy of 200 m "CEP"

or less;

designed or modified for ‘missiles’

and capable of providing a

navigational accuracy of 200 m ‘CEP’

or less;

7A103.c Technical

Notes

技術註解:

‵整合導航系統′一般包含下列零 件︰

1. 慣性測量裝置(例如姿態與航向參 考系統、慣性參考單元或慣性導航系 統);

2. 使用於整個航程中,定時或連續提 供更新位置及/或速度之 1 個或以上 的外部感應器(如衛星導航接收器、雷 達航空高度計或都卜勒 Doppler 雷 達);及

3. 整合硬體及軟體;

技術註解:

1.‵整合導航系統′一般包含下列零 件︰

a. 慣性測量裝置(例如姿態與航向參 考系統、慣性參考單元或慣性導航系 統);

b. 使用於整個航程中,定時或連續提 供更新位置及/或速度之一個或以上 的外部感應器(如衛星導航接收器、雷 達航空高度計或都卜勒 Doppler 雷 達);及

c. 整合硬體及軟體;

2. 7A103.c.所述之‵CEP′(誤差圓徑 或圓形機率誤差)為準確度的衡量,定 義為有 50%機率將位於圓半徑的內 部。

Technical Note:

An ‘integrated navigation system’

typically incorporates the following components:

1. An inertial measurement device (e.g., an attitude and heading reference system, inertial reference unit, or inertial navigation system);

2. One or more external sensors used to update the position and/or velocity, either periodically or continuously throughout the flight (e.g., satellite navigation receiver, radar altimeter, and/or Doppler radar); and

3. Integration hardware and software;

Technical Notes:

1. An ‘integrated navigation system’ typically incorporates the following components:

a. An inertial measurement device (e.g., an attitude and heading reference system, inertial reference unit, or inertial navigation system);

b. One or more external sensors used to update the position and/or velocity, either periodically or continuously throughout the flight (e.g., satellite navigation receiver, radar altimeter, and/or Doppler radar); and

c. Integration hardware and software;

2. In 7A103.c. ‘CEP’ (Circular Error Probable or Circle of Equal

Probability) is a measure of accuracy, defined as the radius of the circle inside of which there is a 50 % probability of being located.

7A117

7A117 〝導航裝置〞可用於〝飛彈〞,

使其系統使準確度能達到射程之 3.33

%或以下 (如在 300 km 射程時,‵誤 差圓徑′為 10 km 或以下)。

7A117 〝導航裝置〞可用於〝飛彈〞,

使其系統準確度能達到射程之 3.33 % 或以下 (例如在 300 km 射程時,‵誤 差圓徑′(‵CEP′)為 10 km 或以 下)。

7A117 "Guidance sets", usable in

"missiles" capable of achieving system accuracy of 3,33 % or less of the range (e.g., a ‘Circle of Equal Probability’ of 10 km or less at a range of 300 km).

7A117 "Guidance sets", usable in

"missiles" capable of achieving system accuracy of 3,33 % or less of the range (e.g., a ‘CEP’ of 10 km or less at a range of 300 km).

(23)

23 7A117

Technical Note

技術註解:

7A117 中之‵誤差圓徑′指一常態分 布的圓,其半徑由包含 50%之個別測 量所組成,或其半徑具 50%機率位於 其中。

技術註解:

7A117 所述之‵CEP′(誤差圓徑或 圓形機率誤差)為準確度的衡量,定義 為以目標中心畫圓的半徑,有 50%酬 載將影響該特定範圍。

Technical Note:

In 7A117 ‘Circle of Equal Probability’ is a measure of accuracy, defined as the radius of the circle centred at the target, at a specific range, in which 50 % of the payloads impact.

Technical Note:

In 7A117 ‘CEP’ (Circular Error Probable or Circle of Equal

Probability) is a measure of accuracy, defined as the radius of the circle centred at the target, at a specific range, in which 50 % of the payloads impact.

9A004.h. 無 h. 〝次軌道載具〞。

- h. "Sub-orbital craft".

9A011

9A011 衝壓噴射發動機、超音速燃 燒衝壓發動機或組合式循環發動機,

及其特別設計之零件。

9A011 衝壓噴射發動機、超音速燃 燒衝壓發動機或‵組合式循環發動 機′,及其特別設計之零件。

9A011 Ramjet, scramjet or combined cycle engines, and specially designed components therefor.

9A011 Ramjet, scramjet or ‘combined cycle engines’, and specially designed components therefor.

9A011 Technical

Note 無

技術註解:

9A011 所述之‵組合式循環發動 機′,為結合兩種或更多類型之發動 機,如下:

—燃氣渦輪發動機(渦輪噴射發動 機、渦輪螺旋槳發動機與渦輪風扇發 動機);

—衝壓噴射發動機或超音速燃燒衝壓 發動機;

—火箭發動機或引擎(液體/凝膠/固體 推進劑與混合動力)。

-

Technical Note:

For the purposes of 9A011, ‘combined cycle engines’ combine two or more of the following types of engines:

— Gas turbine engine (turbojet, turboprop and turbofan);

— Ramjet or scramjet;

— Rocket motor or engine (liquid/gel/solid-propellant and hybrid).

9A012 說明:參照 9A112。

說明 1:參照 9A112。

說明 2:〝無人飛行載具〞(〝UAVs〞) 為〝次軌道載具〞,參照 9A004.h.。

N.B. SEE ALSO 9A112.

NB: 1 SEE ALSO 9A112.

NB: 2 For "UAVs" that are "sub-orbital craft", see 9A004.h.

9A101.a

1. ‵最大推力值′大於 400 N(在無 裝配時達到此值),但不包括‵最大推 力值′大於 8,890 N(在無裝配時達到 此值),且經認證之民用發動機;及

1. ‵最大推力值′大於 400 N,但不 包括‵最大推力值′大於 8,890 N,且 經認證之民用發動機;及

2. 燃油消耗比為 0.15 kg N

-1

hr

-1

或以

1. ‘Maximum thrust value’ greater than 400 N (achieved un-installed) excluding civil certified engines with a ‘maximum thrust value’

1. ‘Maximum thrust value’ greater than 400 N excluding civil certified engines with a ‘maximum thrust value’ greater than 8 890 N;

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