[PDF] Top 20 Thermal gradient in solder joints under electrical-current stressing
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Thermal gradient in solder joints under electrical-current stressing
... The thermal gradient and temperature increase in SnAg3.5 solder joints under electrical-current stressing have been investigated by thermal infrared ... See full document
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Thermomigration in flip-chip SnPb solder joints under alternating current stressing
... Electromigration in flip-chip solder joints has attracted a lot of attention in recent years due to the miniaturization trend in high-performance ...the current density in ... See full document
4
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
... Cross-sectioned solder bumps were employed to facili- tate the detection of the movement of markers and the mea- surement of the thermal gradient inside the solder ...model, in Fig. 1, ... See full document
4
Joule heating effect under accelerated electromigration in flip-chip solder joints
... of solder joints was ...temperature in the Al trace was higher than temperature in the solder bump and in the Si die, and the maximum value reach 147 ...the current ... See full document
4
Thermomigration in solder joints
... the solder needs to be melted to react with UBM to form ...temperature gradient during reflow process in oven or on a hot plate. In addition, hot compression method is sometimes adopted to join ... See full document
16
Effect of bump size on current density and temperature distributions in flip-chip solder joints
... The current density and temperature distributions in flip-chip solder joints with several reduced bump sizes have been simulated by the finite-element ...der joints became smaller, the ... See full document
7
Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
... average current density involved in a volume of 5 m⫻5 m⫻5 m was estimated to be ...temperature in the hot spot and the average temperature in the solder as a func- tion of applied ... See full document
4
Thermomigration of Ti in flip-chip solder joints
... migrate under a thermal ...Ti in solder joints. In this study, thermomigration tests were performed in flip-chip solder joints with Cu/Ti UBMs where Ti acts ... See full document
4
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
... of solder bumps connecting it to the ...for in situ observation during ...excellent thermal conduction of Si and the small strip used, whenever one pair of the bumps is powered by dc or ac ... See full document
28
Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints
... IR thermal gradient measurement agrees with this cal- ...form in the chip/anode side for bump ...chip solder joints at 165 ° C for 90 h, by taking into account the higher temperature ... See full document
4
In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing
... concentration gradient affect the diffusion of solder atoms in a flip-chip solder joint under current ...Sn in eutectic SnPb solder was 5 3 10 10 cm 2 ... See full document
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Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
... local current density but possessed a tempera- ture higher than the hot-spot value described ...located in the right-hand side of the hot spot and close to the underfill, as marked by one of the white ... See full document
7
Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
... temperature in the solder bump with the Cu column appears to be lower than that in the solder joint with a 2 lm Ni UBM, which also increases the MTTF of the solder joint with the Cu ... See full document
8
Temperature and current-density distributions in flip-chip solder joints with Cu traces
... the current, R is the total resistance of the circuit, j is the cur- rent density, r is the electrical resistivity, and V is the ...lower stressing current, the Joule heating effect was not ... See full document
7
Electromigration issues in lead-free solder joints
... the solder bump continues decreasing and the current that each bump carries keeps rising owing to higher performance requirement of electronic ...stated in 2003 International Technology Roadmap for ... See full document
10
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
... change in the stress state in the joint may also have a large effect on the whisker ...During current stressing, both electron wind force and electromigration-induced back stress may af- fect ... See full document
5
Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization
... the stressing circuit as a function of stressing time is shown in ...of stressing time at 150°C and within 142 h at 100°C because the diffusivity of metal atoms are larger at high ...the ... See full document
6
Relieving the current crowding effect in flip-chip solder joints during current stressing
... work, current density distribution in a solder joint was thoroughly studied by a three-dimensional fi- nite element ...maximum current density in a solder bump can be much higher ... See full document
10
Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
... The horizontal temperature difference remains almost the same, whereas the vertical temperature difference continues to increase up to 16.7 °C, as illustrated in Figure 3(b) and 3{c). Th[r] ... See full document
4
Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
... applied current densities were wrongly ...correct current densities is shown below. In addition, the value of ...” in the abstract, on p. 152105, and in figure caption of ... See full document
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