[PDF] Top 20 Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

... of packages with Au/Ni/Cu or Ag/Cu pads, the Au or Ag surface finish dissolves rapidly into the solder matrix and a liquid/solid reaction ... See full document

... Cu and Ag/Cu pads in ball grid array (BGA) pack- ...of in- termetallic compounds that takes place at the inter- face allows for sound wetting ... See full document

... words: Intermetallic compounds, Sn-9Zn, Au/Ni/Cu pads, Ag/Cu pads, ball shear strength INTRODUCTION Out of environmental concerns, the development of ... See full document

... 2 intermetallic compounds in the solder in addition to Ag 2 In precipitates after the reflow of ...Sn-20In-2.8Ag solder balls on ... See full document

... of Sn-58Bi solder joints in a BGA package with Au/Ni/Cu pads has been performed by employing various temperature profiles, which results in the formation of ... See full document

... words: Sn3Ag0.5Cu, ...Sn3Ag0.5Cu0.06Ni0.01Ge, Au/Ni surface finishes, ball-grid-array package, ... See full document

... utilized in this study had Cu pads on a bismaleimide tri- azine (BT) resin ...The Cu pads were deposited with an Au/Ni surface ...the Au and Ni ... See full document

... INTRODUCTION In order to prevent oxidation and promote the wettability of a printed circuit board, many surface finishing techniques have been explored, among which the immersion Au/Ni method ... See full document

... Au/Ni/Cu pads after reflowing and aging processes were analyzed. In addition, the growth of interfacial intermetallics was measured and its kinetics dis- ...various ... See full document

... into Sn-3.6Ag-1.0Cu solder was also reported by Anderson et ...The ball-grid array (BGA) package used in this study had 49 Cu pads on a FR-4 ... See full document

... along with the growth of the IM2b intermetallic ...the reactions between IM1b interfacial intermetallics and the Ni layer of the Au/Ni surface ...An in- teresting ... See full document

... the solder/pad interfaces after the reflowing process and aging at 100 ...0.74 Ni 0.26 ) 6 (Sn 0.92 In 0.08 ) 5 intermetallics grew rapidly from the solder/pad interface ... See full document

... tronic packages with Pb-free solder joints. 1 In fact, the formation of whiskers on electrodeposited Sn and Sn alloys during storage and usage has been discovered ... See full document

... of Ni-P/Cu under bump metallurgy with various solders. 9 In the case of a ...Sn-3.5Ag solder, it is the Ni 3 Sn 4 intermetallic ... See full document

... the intermetallic compounds are found to change from a continuous layer into a nearly square shape, as shown in ...Figure 5 shows the morphological variation of the intermetallic compounds ... See full document

... Science and Engineering, National Taiwan University, Taipei 106, ...The intermetallic compounds formed after reflow and burn-in testing of a Sn- ...20In-0.8Cu ... See full document

... of Cu or Zn atoms in Sn crystals is significantly larger than that of the self- diffusion of ...of Cu in a Sn matrix is 1,000–10,000 times larger than that of ...enables ... See full document

... The Sn-3Ag-0.5Cu-0.5Ce solder used for this study was prepared by melting a ...vacuum and then remelting it with the addition of the elements Sn, ... See full document

... The ball grid array (BGA) technology has become a preferable interconnect technology for electronic pack- aging for the features of high input–output terminal den- sities, small footprints, ... See full document

... solid-state reactions, samples were aged at 0, 200, 500, and 1000 h at 150 °C in nitrogen ...about 5 °C/s for all the samples because it can change the Ag 3 Sn ...height ... See full document