綜合上述，我們可以得到下列結論：
1. 二氧化鈦光催化氧化含氧有機物的速率，受到操作因子(初始濃度、反應 溫度、溼度、氧含量)影響。(1)初始濃度越高反應速率越快(吸附為速率 決定步驟)，不過當初始濃度高於某一程度，吸附速率不再增加，則反應 速率也不再增加(反應為速率決定步驟)。(2)反應溫度越高反應速率越 快，當溫度高於100℃，隨著溫度越高反應速率越慢；而 DMF 在反應溫 度150℃時有最大的反應速率(3) 溼度低時，溼度越高反應速率越快，但 是在高溼度，溼度越高反而會抑制含氧化合物氧化的進行。(4) 氧含量越 高，可以促進含氧化合物分解速率，當氧含量高於20%，反應速率趨於 平穩。
2. 異丙醇催化光氧化過程，氣相中主要的中間產物是丙酮；而丙酮催化光 氧化過程，並未發現氣相中間產物。正丙醇催化光氧化過程出現兩種主 要的中間產物丙醛與乙醛；催化光氧化丙醛的過程中，主要的中間產物 是乙醛。催化光氧化DMF 過程，發現甲醛、甲胺、碳酸根離子、銨離子 與硝酸根離子等產物吸附於觸媒表面。
3. 藉由 Langmuir-Hinshelwood 方程式可以模擬反應速率與濃度的關係，並 求得含氧有機物的反應速率常數與吸附常數。
4. 異丙醇與中間產物(丙酮)在光催化過程有競爭氧化的情形，以競爭氧化模 式模擬可得良好結果。雖然催化光分解丙酮的過程未發現氣相中間產 物，不過比較丙酮實測半生期與初始濃度推測的半生期，發現初始濃度 越高，兩者的差距越大，可能的原因為氧化過程中產生非氣相中間產物，
此中間產物與丙酮競爭氧化，從最終產物二氧化碳的測定可間接印證此
現象。
5. 催化光氧化五種含氧有機物，其中兩種(異丙醇、丙酮)沒有發現觸媒毒化 現象，其餘三種(正丙醇、丙醛、DMF)則有觸媒毒化現象。
6. 含氧有機物進流濃度愈高，流量越大，觸媒毒化速率越快。反應溫度的 影響則依反應物的不同，而有不同的趨勢；對丙醛而言，溫度越高毒化 速率越快，高於100℃以後趨於平緩；對 DMF 而言，溫度越高毒化速率 越慢，溫度200℃時，毒化速率趨近於零。
7. 可以用 Lepvenspiel 毒化模式模擬光催化 DMF 觸媒活性衰退現象。
8. 毒化的觸媒表面吸附了 NH4+
及NO3
-離子，經由實驗證明這兩種離子會造 成觸媒活性衰退，而以NH4+離子的影響較嚴重。
9. 以七種觸媒活性再生程序以恢復觸媒的活性，其中四種為氣相再生處理 (Dry Air、Dry Air/UV、Wet Air/UV、O2/UV)，三種為液相再生處理 (H2O/UV、H2O2、H2O2/UV)，其優劣順序為 H2O2/UV＞H2O2＞H2O/UV
＞Wet Air/UV＞O2/UV＞Dry Air/UV＞Dry Air，可明顯看出液相再生處理 優於氣相再生處理。觸媒經H2O2/UV 再生後，觸媒活性接近完全恢復。
10. 綜合上述，可以了解以光催化分解含氧有機物是可行的，操作條件在低 進流濃度、低進流量、中溼度、溫度在100℃、氧含量大於 20%，有最 佳的去除效率、少量的中間產物與緩慢的觸媒活性衰退。而觸媒活性再 生的方式可以過氧化氫淋洗後再照光。
本研究之觸媒薄膜製作方式，具有簡單，容易操作與方便觸媒改質等優 點，但是在均勻度方面稍嫌不足；另外，我們雖然確定銨離子與硝酸根離子 是觸媒毒化的原因之一，但是對於其他有機的吸附物種則需進一步的鑑定與 判別是否造成觸媒毒化。上述兩點若能加以改善，光催化處理技術的實用性 將可大大提高，這也是我們未來研究的方向。
本研究對於光催化氧化含氧有機物之各項操作因子的影響、反應過程中
間產物的變化與催化劑的毒化現象皆有詳細的研究，將有助於了解如何增加 污染物的分解速率，並且避免具有毒性的中間產物產生。另外，對氣相光催 化的研究者而言，將有助於學習中間產物的鑑定與化學反應路徑的推測；藉 由模式的建立，有助於未來的實場設計與操作最佳化，期望能提供一個經 濟、有效處理氣相有機污染物的方法。最後，我們希望經由最佳的設計與操 作，能夠讓我們在享受科技帶來的便利之餘，也能讓環境免於傷害。
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