以WIP SPC改善晶圓代工廠生產週期之個案研究

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(1)國立交通大學管理學院(工業工程與管理學程)碩士班碩士論文. 以 WIP SPC 改善晶圓代工廠生產週期之個案研究. The Study of the Cycle Time Improvement by WIP SPC for IC Foundry Manufacturing. 研究生 : 林育成指導教授 : 李榮貴博士. 中華民國九十六年一月.

(2) 以 WIP SPC 改善晶圓代工廠生產週期之個案研究 The Study of the Cycle Time Improvement by WIP SPC for IC Foundry Manufacturing. 研究生:林育成指導教授:李榮貴博士. Student: Yu-Cheng Lin Advisor: Dr. Rong-Kwei Li. 國立交通大學管理學院(工業工程與管理學程)碩士班碩士論文. A Thesis Submitted to Department of Industrial Engineering and Management College of Management National Chiao Tung University In Partial Fulfillment of the Requirements For the Degree of Master of Science In Industrial Engineering and Management Jan. 2007 Hsinchu, Taiwan, Republic of China. 中華民國九十六年一月.

(3) 以 WIP SPC 改善晶圓代工廠生產週期之個案研究學生:林育成. 指導教授:李榮貴博士. 國立交通大學管理學院(工業工程與管理學程)碩士班. 中文摘要. 投片到產出的時間稱為生產週期(Cycle time)，半導體產品從投入到產出通常需一到二個月的時間。因為對市場的反應時間很長，所以生產週期一直是晶圓代工廠影響客戶滿意度的重要指標之一，不良的生產週期常造成客戶抱怨，甚至訂單流失；而且半導體工廠的投資額高，生產週期代表的是資金的堆積。所以晶圓代工廠一直都投注大量人力於生產週期的管理與改善。一般工廠做生產週期的管理通常只是根據經驗訂定 Turn Rate 及標準在製品量(STD WIP)，再據以拉貨和消 WIP，沒有一套較完整的生產週期管理理論。當工廠狀況改變，如產品組合改變或產能使用率改變，此時根據 Little’s law 可以預知生產週期及在製品量將會跟著改變，過去經驗也跟著不適用。目前絕大多數的工廠並無法反應此狀況，以至於產品組合改變或產能使用率改變都須經過一段爭執的陣痛期，當情況穩定時，經驗能派上用場，管理才又上軌道。本論文期望發展出一套計算標準在製品(STD WIP)的方式，再利用 SPC (Statistical Process Control)的觀念，訂定 WIP 上下限，當超出上下限則採取適當的派工以修正 WIP Profile，如此可以降低 WIP 水位，生產週期也得以逐步降低。. 關鍵詞: 晶圓代工、生產週期時間、達交率、派工、在製品管理. i.

(4) The Study of the Cycle Time Improvement by WIP SPC for IC Foundry Manufacturing Student: Yu-Cheng Lin. Advisor: Dr. Rong-Kwei Li. Department of Master Program of Industrial Engineering and Management National Chiao Tung University. ABSTRACT The definition of cycle time is the time from the wafer start to the wafer output. It usually takes one or two months to get the product since customer decides to produce it. Cycle time is a critical factor for customer satisfaction because it represents the response time to the market. Long cycle time also reflects the ineffective investment for the capital. Cycle time is very important for foundry because long cycle time will cause customer unsatisfied and the order loss. Consequently, all of the foundries put lots of human source in the cycle time improvement. Usually, we make decisions based on the experience in cycle time management. We have no mechanism or theory for cycle time management. We do WIP management based on turn rate and standard WIP set by experiences. But the experience didn’t mean the optimal solution, when the situation changed, the cycle time or the standard WIP will also be changed. The experience will not always be applicable. If we only have the experience and no mechanism, management will not be work out. After interview several foundry fab managers, all of the fab can’t reflect the situation. That is, all of them will have an impact period after product mix or utilization varied. In this study, we want to develop a formula for standard WIP and use SPC concept to set WIP upper/lower limit. When WIP exceed the limit, it will trigger action plans to compensate WIP profile. If WIP profile balances, we don’t need too much WIP. So WIP level could be reduced and cycle time also could be reduced.. Key words: Foundry, Cycle Time, Delivery, Dispatch, WIP Management. ii.

(5) 目錄頁次中文摘要 ---------------------------------------------------------------------------------------------. i. 英文摘要 ---------------------------------------------------------------------------------------------. ii. 目錄. ---------------------------------------------------------------------------------------------. iii. 表目錄. ---------------------------------------------------------------------------------------------. iv. 圖目錄. ---------------------------------------------------------------------------------------------. v. 符號說明 ---------------------------------------------------------------------------------------------. vi. 一、. 緒論 --------------------------------------------------------------------------------------. 1. 1.1 問題描述 ---------------------------------------------------------------------------------. 1. 1.2 研究目的 ----------------------------------------------------------------------------------. 1. 1.3 研究方法 ----------------------------------------------------------------------------------. 2. 1.4 研究範圍與限制 -------------------------------------------------------------------------. 2. 二、. 文獻探討 -------------------------------------------------------------------------------. 3. 2.1 投料法則 ---------------------------------------------------------------------------------. 3. 2.2 派工法則-----------------------------------------------------------------------------------. 5. 三、. 個案研究 -------------------------------------------------------------------------------. 6. 3.1 個案現況 ---------------------------------------------------------------------------------. 6. 3.2. Cycle Time 改善方法分析 ------------------------------------------------------------. 7. 3.3. WIP SPC 方法說明 –-------------------------------------------------------------------. 8. 四、. WIP SPC 效果驗證 ---------------------------------------------------------------- 18. 4.1 生產數據比較分析 ---------------------------------------------------------------------- 18 4.2. 有效性驗證 ------------------------------------------------------------------------------ 18. 4.3. 其他效益 --------------------------------------------------------------------------------- 19. 五、. 結論及未來研究方向 -------------------------------------------------------------- 20. 參考文獻 ------------------------------------------------------------------------------------------- 22. iii.

(6) 表目錄頁次表 3-1: High Utilization Equipment Group --------------------------------------------------------. 9. 表 3-2: STD WIP and Target T/R -------------------------------------------------------------------. 13. 表 3-3: STD WIP 分配及 STD WIP Upper/Lower Limit --------------------------------------. 14. 表 3-4: 派工法則評分表 ---------------------------------------------------------------------------. 15. 表 3-5: Utilization FCST -----------------------------------------------------------------------------. 16. 表 4-1: 改善前、改善後之生產數據 ------------------------------------------------------------. 18. 表 4-2: 生產週期之假設檢定 ---------------------------------------------------------------------. 18. iv.

(7) 圖目錄頁次圖 3-1: STD WIP SPC 概念圖 ---------------------------------------------------------------------. 9. 圖 3-2: 派工法則示意圖 ---------------------------------------------------------------------------. 15. 圖 5-1: 改善前、改善後之 WIP 與 cycle time 相關圖 ---------------------------------------. 20. 圖 5-2: 改善前、改善後之 utilization 與 CLIP 相關圖 --------------------------------------. 20. v.

(8) 符號說明 Theoretical Cycle Time : 一批貨從投片到產出，所有 Process time 加總 Avail. : 機台可提供生產的時間(%)，即 1-Down%-PM%. Process Timei. : 第i個製程步驟所花的生產時間. Running WIPi. : 第i個機台群組上正在Run的WIP量. Waiting WIPi. : 第i個機台群組前等待進入機台Run的WIP量. Group Capacityi. : 第i個機台群組可提供的產能. Xij. : 第i種產品第j個區段的X-Ratio. TCTij. : 第i種產品第j個區段的Theoretical Cycle Time. vi.

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(22) 3.3 WIP SPC WIP 1 (Rework)"" E. /. ú. K. #. '". '. ². 'j. w. l. <. . . L. G. á. . . ¿. H. t. ô. '9. 8. . . "4.3. . ë. E. . ¹. ò. F. '1 j. "O. Â. . ¹. z. J. j. . D. Ó . e. N. D. . Í WIP . ×. >. S.. 3 . (setup) 6 ¨. WIP '. 1 ò. '. . é. . ý. Ø. *j. . ¥ê. ô. j. ì. . j. j. (. . 3. ·. |. ¥'W |. xW. ¥W ¥. ^. . 8. ù. ¶. ³ 6. æ. . ?. ^. = ¿. Å. E. loss . . . . £. . . . Ó. I. ~. ¨. . A. N "O. ¥ )¢ l. . å. . Ü. . T 7. l. ". Thin . 14 W. ¥. ç Ø. . |. 6. . j. è. WIP Û s. '. WIP . Å. j. å. E. '"D. ". t "1.. ¾ W. ;. @ j. ö. "õ. « "1. :. D . k "= ô. 1. 5. ? s. 5 s. ´ "W. "Ê ¿. 6. 4. "?. A. '. WIP Ú. {. cycle time E . 3-1 c. . ¨. . s. 8. ². . '3. 6. WIP j. +. ù. [ 10%"c Ö. H. 6. #. '". [ 90%¢ N. 14 B. . "-. . "ì. ~. SPC ' ô. ç. "O. . ;. N. 'b. ¿. Å. å. Ø "2.. j j. ^. ~. '. . j I. Ì 3. "c. (. l. l. ":. / =. *@. T. ,. 5. ¥(2. Å. t. '. 4. j. . ¨. ò. '"ý. 2006 &. F. j. b. ². 3. 7. M "5.b line balance Ö. 1~5 's. . £. C. -. ' WIP Á l. E. WIP à "3.È ß. õ. x. b. z. Ä. P. ). T. í . ¥'~. ¿. Î. . 6. j. ý. ß "E ¨. ¶. Ø. A. . /. F "3. Ñ. 8. ¥. [ 10%"¢. 9. "}. #. 3. Oxide+HTOX"D. time . ¥'^. TOC 'q 2. 6 "A. G. N. '". 2 (. 6. Ñ. . 'F j. WIP '. TOC ' }. |. ' . . . 0 "W. "~. ò F. #. | N. Cycle . ²j i. ¥. WIP balance ' "6. x WIP . ·. Ä. C. Ø ". J ·. K :.

(23) 3-1 High Utilization Equipment Group Equipment. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40. PECVD - SiH4 Lam4500/4520(SOGEB) Thin Oxide / HTOX Oxide CMP (EBARA) Metal Etcher - Hitachi 308 Metal Etcher - Hitachi 501 Gate Oxide UTC Mid Current Implanter Metal Etcher - W Plug EB PECVD - SIN Sputter PECVD - SiH4&SiON&SiN SAUSG PRS HDPCVD (PS) TEL 85S HDPCVD (STI) High Current Implanter NS Asher TEL DRM BPSG Flow Vacuum / SOG Baking Metal Etcher - DDPSM RTP - Metal Oxide CMP (Mirra Mesa) Laser Mark PETEOS SOG Coater OPRS (EKC) W CMP RE OZ3000 Alloy WCVD Wafer Scrubber WCMP - Buffing MOCVD LamTCP9400/Alliancechamber. Step 1: f. Jul-06. No. . !. ". Util.. . LittlePs Law (Q. Output y m. g ¨. 118.7% 105.2%. 97.1% 100.0% 100.0% 100.0%. 97.1% 91.6% 89.9% 100.0%. 92.6% 88.9% 99.2% 85.6% 87.1% 92.1% 93.1% 88.8% 79.2% 81.5% 82.7% 85.8% 79.7% 81.5% 81.0% 81.4% 72.7% 74.0% 68.8% 77.2% 73.3% 77.8% 74.7% 85.1% 74.3% 73.3% 72.0% 74.8% 72.5% 68.2%. Tools 7.2 2.0 35.0 1.0 3.0 2.0 10.5 7.0 9.5 8.0 4.2 13.0 17.0 10.0 11.0 1.7 21.0 1.0 10.0 3.0 23.6 9.0 5.0 11.0 9.0 8.0 9.0 3.0 11.0 8.0 4.0 8.0 4.0 6.0 5.0 12.0 21.0 7.0 5.0 14.0. Aug-06. Sep-06. Util. Tools 104.9% 8.7 104.3% 2.0 100.7% 35.0 100.0% 1.0 100.0% 3.0 100.0% 2.0 96.7% 11.0 95.5% 7.0 94.7% 9.5 89.9% 8.5 91.8% 4.2 85.1% 13.0 92.5% 18.5 86.8% 10.0 88.9% 11.0 84.9% 2.0 85.8% 21.0 82.1% 1.0 82.5% 10.0 82.7% 3.0 86.7% 23.6 72.5% 9.0 77.5% 5.0 79.8% 11.0 80.2% 9.0 80.5% 8.0 72.3% 9.0 76.0% 3.0 76.8% 11.0 75.6% 8.0 71.7% 4.0 78.9% 8.0 77.5% 4.0 79.7% 6.0 71.5% 5.0 71.7% 12.0 74.1% 21.0 76.1% 7.0 74.3% 5.0 73.8% 14.0. Util. Tools 104.4% 9.2 102.5% 2.0 102.4% 35.0 100.0% 1.0 100.0% 3.0 100.0% 2.0 100.0% 11.0 98.8% 7.0 98.6% 9.5 97.9% 9.0 96.4% 4.2 94.2% 13.0 94.0% 19.0 93.6% 10.0 89.6% 11.0 88.7% 2.0 88.1% 21.0 87.7% 1.0 87.7% 10.0 87.1% 3.0 85.5% 23.6 84.3% 9.0 83.3% 5.0 82.9% 11.0 81.9% 9.5 8.0 81.1% 80.3% 9.0 78.2% 3.0 77.5% 11.0 77.0% 8.0 76.9% 4.0 76.6% 8.0 76.4% 4.0 76.3% 6.0 75.4% 5.0 75.4% 12.0 73.9% 21.0 73.8% 7.0 72.3% 5.0 71.9% 14.0. Oct-06. Nov-06. Util. Tools Util. Tools 98.8% 9.2 103.7% 9.2 98.4% 2.0 109.3% 2.0 105.3% 35.0 102.6% 35.0 100.0% 1.0 100.0% 1.0 100.0% 3.0 100.0% 3.0 100.0% 2.0 100.0% 2.0 100.8% 11.0 98.4% 11.0 99.7% 7.0 96.8% 7.0 100.2% 9.5 98.2% 9.5 99.3% 9.0 99.6% 9.0 96.5% 4.2 97.5% 4.2 97.1% 13.0 97.3% 13.0 90.3% 19.0 95.1% 19.0 95.9% 10.0 97.4% 10.0 91.7% 11.0 93.7% 11.0 86.8% 2.0 99.2% 2.0 90.4% 21.0 85.9% 21.0 91.3% 1.0 98.2% 1.0 86.9% 10.0 87.1% 10.0 91.1% 3.0 92.8% 3.0 89.1% 23.6 94.7% 23.6 85.9% 9.0 92.6% 9.0 84.9% 5.0 86.6% 5.0 83.4% 11.0 86.5% 11.0 79.3% 10.0 84.0% 10.0 84.6% 8.0 90.8% 8.0 83.1% 9.0 85.0% 9.0 80.1% 3.0 78.9% 3.0 81.8% 11.0 86.2% 11.0 75.5% 8.0 81.2% 8.0 79.1% 4.0 81.7% 4.0 77.5% 8.0 87.1% 8.0 80.5% 4.0 84.2% 4.0 69.3% 6.0 67.8% 6.0 76.6% 5.0 79.3% 5.0 76.8% 12.0 79.0% 12.0 77.9% 21.0 82.8% 21.0 74.7% 7.0 83.9% 7.0 73.0% 5.0 81.4% 5.0 75.2% 14.0 85.1% 14.0. Dec-06 Util. Tools 103.1% 9.2 103.0% 2.0 99.3% 35.0 100.0% 1.0 100.0% 3.0 100.0% 2.0 96.5% 11.0 94.6% 7.0 98.7% 9.5 98.8% 9.0 97.3% 4.2 96.3% 13.0 96.7% 19.0 95.6% 10.0 91.4% 11.0 91.2% 2.3 89.1% 21.0 99.2% 1.0 88.7% 10.0 96.2% 3.0 90.4% 23.6 94.3% 9.0 85.6% 5.0 85.5% 11.0 85.2% 10.0 88.9% 8.0 87.0% 9.0 79.5% 3.0 81.6% 11.0 77.9% 8.0 82.7% 4.0 90.6% 8.0 80.3% 4.0 68.5% 6.0 79.4% 5.0 79.4% 12.0 80.0% 21.0 87.1% 7.0 83.9% 5.0 82.3% 14.0. WIP # $ Æ. . ^. . V. =Q Æ. ,s. Q. . à. /^. "@ WIP Level = Cycle Time * Output. 9. Î. Ó. )"ç . Cycle time ß. m. R. ".

(24) Step 2:. %. ¿. ' WIP µ . Î ¨. 9. Q. U. ¨. Stage Æ. WIP Ì. 1 ":. ,2. . 'S. ³. £. T. Cycle time: . O. g . ? V. 8 ´. . #. ê. ë. g B. ¨. D. "O. 'Ì. ^. 60,000pcs" ² Î. 120"@ STD Move = 60,000*120/30 Õ= 240,000é. ' Turn Rate F. g à. ²'¤. ç Q. WIP Profile. . ' WIP W ¹. ^. &. 2. W "2 O F. c. E. ^. Gate oxide ' process step 8 Q. £. E. #. ²e ê. j. ¥. A "Gate oxide F. furnace ' turn rate 1.2 @ Gate oxide furnace ' STD WIP = STD Move / STD turn = (60,000*1/30)/1.2=1,667pcs": ç c. . ´. è. º. è. Í STD WIP ¢ Î. . . ;. WIP"2 ¹. 3. . . 4. |. 8. . ¥w. Q. t. j. ¥. [. Z. d. ý. WIP Process Time E \ y. ]. j. ¥£. ¶. ^ . . W . Run . ,. '· ^. . ¿ F. . |. "c. '·. ¸. j. W 5. ¿. è. Å. I. Î. ý |. "£. ¸. ¹. PM"® P. j. ¶. ¶. ". 4. º. ³. Running e. "F. PM y . Run "j. . ß. ) ". ¥ò. ý. Running WIP . . Þ. e ¥. . Y Â. W. ' STD WIP. B j. c X. . T. ¶. ¢. ^. 7. Y . ¥Í "y. . @. W. W . . ) "P. Waiting WIP"Á e. ¿. . Q. ç "WIP 'S 9. . . F. "c. Å. ¥Ï. E. Ý . T. H. Í^. 1.2 standard" 2. . . . . þ. T. ^. 'µ. WIP Ú ;. . ¥Ï. e. . Û. Ü. ". Loss ¿. Running WIP? ¨. ×. '. ' WIP

(25). ß. ,¶. ë "¹. WIP 'S. l. Running WIP '¨ | "^. N. ,. E. w |. ê. ' Fab"j. x' WIP . ¥'W. g . ¶. ¹. . j. #. ,. . ¹. 2. "j. j. (1).O. ¢. ÍJ. ,W. º. . . e F. PM . ¿ "O Î. . E. j ":. ^. Í STD WIP £ Î. gate oxide furnace turn rate 1.2 . ¶. 1Ö ·. 6 ^ Running r. O N. å . K "O. ,j . ¥b. É. ^ "c à. . . ^. 2. WIP '?. ¶. ß. 4. Ó. ,\. * X-ratio E. 10. ]. K "ç. 3 E. F. ' WIP B Þ. (batch type)'j. "WIP , Furnace 'j µ. ' WIP"2 ^. Ú. ¥' 6 ^ . W . ¥ Furnace F j. "j. A. W . running. | "c. run . . ¶. 6Ö. "Running WIP '?. ·. " . X-ratio 3.8 "Running WIP.

(26) _. WIP 40%` a. µ 2. 3 ^. Q. . r j E. ¥ Group"@r. i j. ¥ Group Í run WIPi . Run WIPi=Run WIP Level * Process Timei / Theoretical Cycle Time. (2).O. g . Waiting WIP? ¨. Waiting WIP '¨ W. |. ¥^ . ¿. . . ^. ³. . $. E. O. Loss"D ¿. ,j. ¥. v. . (Utilization x)"È p. ¿. ¿. 3. . . ^. ^. 2. . . Z. ;. . d. . à. ^. j. r j. )y E ¿. ¥¹. ¥9. j. F "Ë. Á. ~. j. 1. . \e . j. ¹. Â. j. b. . ¥¹ F. À. . ¥9. · b. j. E. · "y. ¥C. Å c. '" F. j W. 'c. ' WIP"} ^. j. =j Ó #. n j. ý. D. ç ¿. N. #. ^. ´ . ´ T. ·. ·. . . ?. ¥" @r. g. ". . Ì. "c. . j. ^. ¥ . v . STD Waiting WIP ý. ¥. *". Â. 'Á. j. (v ¿. j. ¥. . i j. ¥9. F. Í STD Wait WIPi. D n. Wait WIP Level*. j =1. r. (. i =1. r ¹. (. n j =1. i j. C nj (1 − Avail ) j * Avail ( n− j ) * Max( 0 ,. C nj (1 − Avail ) j * Avail ( n− j ) * Max( 0 ,. ¥9. n * Util − 100%) * Group Capa cityi / n− j. n * Util − 100%) * Group Capa cityi ) n− j. ' STD Running WIPi and STD Waiting WIPi g F. ¨. §. " @r. i j. ¥9. F. Í STD WIPi = STD Running WIPi + STD Waiting WIPi. Example: 2 3 L £ E B 9 F 'j ¥ Gate oxide f 6 I-line Stepper" À s ? s t £ E Gate oxide F A 6 I-line 2 A g M s t } b Gate oxide ' process time 6 Ö · " I-line ' process time 44 W h , 2006 i Ì > Ü µ WIP5,000 pcs"} b Running WIP 2,000"Waiting WIP3,000Gate oxide f j ¥ g E 11 ¥"} j ¥~ Å Ó 80%S avail 88%"Group capacity 10,000 pcsjI-line Stepper j 99%Savail 92%"Group capacity 12,000 pcs. ¥. g. Running WIP ® O \: Gate oxide j ¥' Running WIP : 2,000*6/(6+44/60*2)=1,607 I-line j ¥' Running WIP : 2,000*(44/60*2)/(6+44/60*2)=393 Waiting WIP ® . O. \:. 11. 10 ¥"} j. ¥~. Å. Ó.

(27) Gate Oxide (EQP Variability impact) : 1 (11−1) 11 (11−11) (C11 * (11 * 80% /(11 − 1) − 100%) + ... + C11 * (11 * 80% /(11 − 11) − 100%)) * 10,000 1 * (1 − 0.88 ) * 0.88 11 * (1 − 0.88 ) * 0.88. = 2.1* 10,000 = 21,000. I- line Stepper (EQP Variability impact) : 1 (10 −1) 10 (10 −10 ) (C10 * (10 * 99% /(10 − 1) − 100%) + ... + C10 * (10 * 99% /(10 − 10) − 100%)) * 12,000 1 * (1 − 0.92) * 0.92 10 * (1 − 0.92) * 0.92. = 9.1 * 12,000 = 109,200. Gate Oxide STD Waiting WIP=3,000*21,000/(21,000+109,200)=484 I-line Stepper STD Waiting WIP=3,000*109,200/(21,000+109,200)=2,516.

(28). STD WIP . . :Gate Oxide STD WIP = STD Running WIP + STD. . Waiting WIP = 1,607+484=2,091I-line STD WIP = STD Running WIP + STD Waiting WIP = 393+2,516=2,909.

(29). WIP#$ %. &. I-line: J. ,. V. G. W. H. XY. K ?. (. @. b. <. f. 2. , S. (. x. U. *. >. +. . F2. ]. c. &. T. 2. ^. .. /. :. ;. 0. $. 1. <. 4. e. m n. 2. B. 3. C. . . . (. `.. . n. F2. S. W. Fz. p. q. KSR(Key Stage Report)j. {. . . . . . E ,. . ¦ stage §. (. ¤ U. ¦< 2. M z. FM. . ¨. w. . !. . B. I. ]. ª. @. <. 6. P. . 7. E E. . A. . .

(30). FG. . !. ". 8. 9. I-line STD WIP , H. #;. . -. Q. R. S. }. f. 4. q ~. . c. . !. . . e h. T. M. M (. B. K. A. ?. *. . . @. . Q. . T. B. (. U. I '. (. @. . 2. W. . M. ] t. ,. ¯. 10 sectorS1~S10 z. ° ·. ± . ` . ^ E. F². \. i. . stage 10 ¸ 12. f. 4. v. . M. . *. ?. gj. 300~500 w. . . stage ³ D,. . R. . S. ¤. 4. M. 2. m ,. ¬. ;. StageN K. n. £. ´. (. @ . Stage i. *. . 100~150 ¢ ¡. ^. u. . E. #oE. stage U. s. i. (Theory of Constraints, TOC). . f. . 2 . ?. (. E. r<. o. #'. . g h. DPSN o Generic Logic X HVstage L. « . {. T. N. stage #®. 5. NO. ^. Nop |. z. S. Stage B. #? ©. T K. 4. D2. [Goldratt et al. 1986a,b; Goldratt et al. 1990a,b] B . STD WIP . ` STD WIP ProfileN _. d. @. -.

(31). D I-line WIP ,. l. ?. . @ A. M. k. . ,. ?. B. h. Fy. ). =. \. P. (. <. [. a. F'. $. L. Z. M. '. ;. K. STD WIP . . ¥ ©. Nµ. stage O. e. K. ( ,. ¥ ¶. b . C. U. ¥. E ¨. .

(32) ¯. °. ¹. º. ». ¼. F sector Æ. ¤. L. ¾. ½. ¾. Ç. ¯. . °. NÈ. ¿. '. (. Î. Ï. _. Ã. '. (. 2. Ð. Ñ. . *. (. ;. Ò. 3. É. Ê. . *. K. '. 4.. È. . ÛË. 5. Ý. G. S. T. f. . WIPN. µ. ¶. Þ. ß. à. M. F2. z. j ¸ . æi â (. oS. DNw. T ,. ã. . ` WIP z Á. F sector Æ . 1.. Æ. À. Ö×. Ô. . I. . .. Õ. . Þ. m. Õ. .. .. ;. Ô. ]. L. Ó (. ^. Â. E f. É. WIP profile . F¦< Ê. Ø. ». ¼. -. _. Æ. . b. Ü. Ë. *. Ì. Ä. Å. ,. oÙ. J. ´. Ú. . . F. . Ã. Í. ^. . ç. æ j D. Ê. :. É. N. WIP Profile z. á É. Ê. S. i â T. (. U. , y â. æ j D STD WIP ij = CT ij *Output ij =X-ratio ij * Theoretical CT ij * Output ij m U. . . Q. R. D STD X-ratioJ ¸. STD WIPj =. n i =1. è. é. j =1. Xij * TCTij = CT Target i. Outputi * X ij * TCTij. Wait Time = WIP/Capacity * Process Time Wait Time / Process Time = X ratio = WIP / Capacity = WIP / (Tool Qty * Batch Size) EX: GateOx 11 set WIP 2000pcs, X-Ratio = 2000/(11*150)=1.21 3-2 STD WIP and Target T/R Sector S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 TTL. STD WIP TTL 6,210 13,868 7,757 18,987 8,968 8,623 3,546 2,707 3,756 1,571 75,993. e. Littleås Law : WIP = CT * Output ä. n. ä. Å. N. X-ratioij = (Full Process CT / Theoretical CT ) of Part i. ã. Ä. Target T/R. %. D. P. 8% 18% 10% 25% 12% 11% 5% 4% 5% 2% 100%. 4,967. 1,146. 97. 10,529. 2,018. 1,073. 4,685. 1,212. 1,339. 521. 7,160. 4,105. 2,650. 5,072. 1,214. 2,309. 5,445. 1,217. 2,253. 5,154. 806. 363. 2,377. 417. 912. 1,378. 526. 1,195. 2,035. E. T 248. 1,571 27,343. 12,659. 13,761. 13. 22,231. Avg. 2.0 2.3 2.3 3.0 3.5 3.0 3.8 4.1 3.3 1.8 2.8. D. P. E. T. 1.7 1.9 1.7 2.5 2.0. 4.4 3.7 3.5 3.7 3.3 2.8 2.3 2.4 4.3 3.5. 6.0 5.3 4.6 5.4 3.9 3.2 5.8 4.0 4.0 1.8 4.1. 5.2 3.3 2.5 3.4 3.0 3.9 4.5 2.8 3.2. B. ,.

(33) Step 3:

(34) Û STD WIP Formula _ D STD WIP : f. C. µ. ¶. :. Fì. Frê $. ®. Ã. *. ` control limitw ï. ë. 0. gí v. ð. f. C. µ. `% ¸ ¦y. ñ. ¶. ò. ó. . (. Dc. ¸. U. â. D_. Profile . 2. z.

(35). D(Sector)y. STD WIP A. WIP f . 10 ¸ . . . :. F. `%. ¸ . (control limit)Û WIP î . N Normal. Upper Limit. WIP. Lo. WIP. Target Lower Limit. Hi. Lo. Priority Change. S1. S2. S3. S1. S4. S2. S3. S4. S3. S4. WIP Profile Change WIP. g 3-1 STD WIP SPC ô 3-3 STD WIP z Sector TTL 6,210 13,868 7,757 18,987 8,968 8,623 3,546 2,707 3,756 1,571 75,993. S :. . ×. Ø. û. D. 8% 18% 10% 25% 12% 11% 5% 4% 5% 2% 100%. :DBR ø Ã. ;. %. Ö STD WIP Upper/Lower Limit ö. w. F. E. Avg. 2.0 2.3 2.3 3.0 3.5 3.0 3.8 4.1 3.3 1.8 2.8. T. 4,967. 1,146. 97. 10,529. 2,018. 1,073. 4,685. 1,212. 1,339. 521. 7,160. 4,105. 2,650. 5,072. 1,214. 2,309. 5,445. 1,217. 2,253. 5,154. 806. 363. 2,377. 417. 912. 1,378. 526. 1,195. 2,035. 12,659. 13,761. 248. 1,571. ¦ù ü. j. . s. S2. Target T/R. P. 27,343. S1. g. STD WIP. S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 TTL. ÷. õ. . . 22,231. . #ö ×. Ø. . . . S. ý. 14. Low Limit. D. P. E. T. 1.7 1.9 1.7 2.5 2.0. 4.4 3.7 3.5 3.7 3.3 2.8 2.3 2.4 4.3 3.5. 6.0 5.3 4.6 5.4 3.9 3.2 5.8 4.0 4.0 1.8 4.1. 5.2 3.3 2.5 3.4 3.0 3.9 4.5 2.8 3.2. ú. j. :. S. N. þ. n. . . 5,589 12,481 6,982 17,088 8,071 7,761 2,482 1,895 2,629 1,100. $. -10% -10% -10% -10% -10% -10% -30% -30% -30% -30%. Upper Limit 6,831 15,255 8,533 20,885 9,865 9,486 4,610 3,519 4,883 2,042. FIFOÛ . +10% +10% +10% +10% +10% +10% +30% +30% +30% +30%. .

(36) g 3-1 ô . . õ. Ê. . M. ÷. S. í. w. :. . (1). Set Set Sn high priority if Sn WIP over upper limit (2). Set Sn-1 high priority if WIP of Sn below lower limit (3). If Sn below lower limit and Sn-1 over upper limit, Sn-1 High Priority lot double (4). If consecutive sectors (ex:Sn&Sn+1) below lower limit, upside priority forward and quantity of upside priority sectors = below lower limit sectors. ã. ä. F. , Ê. í. w. . . :. . F. f. ÷. S. 3-4 ÷ Sector. g 3-2 Ö 3-4 w. S. w. z. . S1. S2. S3. S4. S5. S6. S7. S8. S9. S10. WIP. N. N. L. H. L. L. N. N. N. N. Init. Score. 0. +1. 0. +2. +1. 0. 0. 0. 0. 0. See Dispatching Rule. Qty Gap. 100. 500. -1,000. 3,000. -1,000 -2,000. 0. 0. 0. 0. Qty Gap = Act WIP - STD WIP. Gap Accu.. -400. -500. -1,000. 0. -3,000 -2,000. 0. 0. 0. 0. Gap Accu.n = Qty Gapn + Gap Accu.n+1. Gap Score. +1. Score. +1. If Gap-Accu.<0 & Qty Gap >0 & Init. Score =0, Gap Scroe = +1. +1. 0. +2. +1. 0. 0. 0. 0. +2. +1. S3. S2. Score = Init. Score + Gap Score. WIP. +1. S1. 0. +1. +1. WIP. W/S +1. Rule Discription. S4. S6. S5. +1. +1. S1. S3. S2. S4. S6. S5. Note: +1 means 30% WIP upside priority to (2,20), W/S +1 means more wafer start +2 means 60% WIP upside priority to (2,20). g 3-2 ÷ S. . w. g. ¦µ. ¶. Step 4:

(37) È . ì. ñ $. v M. . ) . z. Ð. {. Ñ. S. µ . f ¶. Ë µ . ß. ü. ¶ M. . . . . Murphy . .

(38) Ð. Ñ. s. . !. . ÖC. . . f. ð. N. Utilization FCST System ( . 15. . Ã 3-4 E. ) . (FCST) %.

(39) M. . M. . # ; *. A. Q. . D (. . . . . n !. w. O. ) Í ;. . ¤. 7. F6. o. . ¬. . . n. ð. :. ®. ¾. (WIP . . ·. ". . )J ±. `í. # b. 9 .. . /. (. $. .. . : . ÛE. . ð. . [. ®. . 3. :. #¦ F ¾ ñ. ù. ñ. ò. . ó. . ©. , %. . . . $ &. N. (. Setup! &. ;. '. j. (. " . ) M. D01. (. Setup . B. 0. 4. / . ®. (Buffer Management)´ . [. 3. 4. w. ². \. n. F5. . S. ò. ó. G. F; ^. f. G. . ù. . < . A. (Q ö. B. [. : (A 9. . H. Ø. B. 3. 4. *. )&. I. J. A. B. ). ®. K. ; G. . . . . D02. D03. 102.6% 72.9% 83.6% High Temp 71.5% 68.4% 82.2% High Current Implanter 92.5% 98.0% 118.4% Mid Current Implanter 90.3% 92.8% 76.1% SIN 108.5% 56.2% 61.3% NS 87.7% 83.1% 99.3% Gate Oxide 96.7% 68.3% 86.7% D-POLY 115.9% 91.2% 65.3% Thin Oxide 65.5% 50.7% 65.5% HTO 79.7% 101.2% 104.3% ANNL 76.7% 68.6% 57.3% BPSG FLOW + S/D 62.2% 80.0% 95.9% ALLOY (AL9) 70.4% 83.8% 72.5% ALLOY (Baking + Curing) 87.2% 67.6% 59.6% BPSG (DSABP) 99.8% 114.9% 128.9% SIH4 69.8% 83.3% Sputter (non_mocvd,non_ms) 87.9% 92.7% 77.8% 71.3% Sputter (MOCVD) 57.0% 97.3% 68.9% Sputter (Al - MS) 87.2% 91.6% 86.8% WCVD. . 16. < . NC 1 (. )N. 3-5 Utilization FCST EQP. Group. ". N. ¸ ². .. *. 2 ;. 0. . ð. Cycle TimeN. . û. . . .. $. . S. -. . J. n. . ì. . ó. . F. ³. :'. @. . 8. 9. ?. 1 K. ×. . >. ù. & .. : . =. S. ò. . F. S. ñ. S. Û¦ Profile . ö. . ,. . ). . Nù . -. . . $ +. B/N L. . D04. D05. D06. D07. 110.2% 95.0% 145.0% 61.0% 100.2% 85.2% 111.1% 76.3% 77.9% 110.7% 46.7% 86.9% 95.4% 46.4% 148.3% 83.5% 87.2% 80.8% 93.7%. 136.5% 102.1% 187.3% 96.2% 95.0% 84.9% 103.7% 86.6% 55.6% 123.1% 63.3% 77.8% 83.4% 61.6% 178.0% 83.1% 74.8% 96.3% 89.6%. 185.6% 121.0% 237.9% 129.1% 80.6% 70.3% 91.3% 112.6% 67.0% 145.4% 59.0% 83.8% 95.7% 60.8% 205.7% 85.9% 77.2% 74.4% 94.0%. 266.3% 146.9% 308.6% 188.4% 74.5% 85.6% 75.7% 129.1% 69.6% 175.7% 67.1% 84.6% 94.4% 61.9% 235.6% 90.0% 79.5% 74.1% 88.4%. Ø. '. ¦è . .

(40) Step 5: WIP Level Cycle Time K M. ?. WIP S. L. QR. L. M «. é . | 7. ÛF S. T. . (. ?. @. :. FM. N . ` 60,000pcs. (. ¤. T. U. U. . ¯. ¶. [. \. °. . ». ¼. E. oP. . K. L X. K |. L í. ¯. Y °. }. . l. ?. @. #). *. .

(41). . N. 17. }. . (. WIP ; Z. WIP Q 5%STD WIP = 80,000*95%=76,000 . 76,000/60,000*30=38 W QR. . '. Stage . turn rate 3.0Cycle time 40 WSTD WIP = 60,000*40/30=80,000. _. O. . P. 120V O. STD WIP = 3. K. L µ. Cycle Time Target . û. l. # ;. ?. @ STD WIP ] :. ^ ?.

(42) WIP SPC . . . . 4.1

(43) C. ¦p. h _ ò. . S. T. F. . ). .. a. D STD WIPP ¸. *. `. #_. (action plan)' ó. :. . q. û. WIP i ^. ³. b. Xc. ì. a û. 8. SPC ] $. balanceb j. WIP S. QR ?. b. L. ,. 4-1 K L. k . l. Ì. Ä. loss b . cycle time © Z. O. f þ. WIP ) g. Å. õ Û WIP î` control limit j. $. Z. e. d. K. L C. f. '. ;. (. 3. Y. . K. Z L. 1.84. 1.60. Wafer out per month (pcs). 54,500 . 61,400 . Average WIP (pcs). 79,400 . 83,175 . CLIP (%). 92.5%. 98.4%. 208,440 . 240,278 . 90.2%. 97.8%. Daily Move. Stepper Utilization. ñ. ä. (Aug-06~Oct-06). Per layer cycle time (days/L). ð. N. (May-06~Jul-06). . . . WIPÛ WIP &. !. . ®. 4.2 . . m. n. WIP ® o. . . . NMay-06~Jul-06 (r 92 W) $. o. ®. . . Ã. ¦ cycle time K $. s Ã. '. (. ®. '. b. b. (t2) p Ñ (Z). H0: 1<=. H1: 1> G. . f. (cycle time) Ì Ì T U . (. (. :o $. o. 2. 2. WIP ®. y. . É. ' Ê. ¶. É. Ê. p . %. m. n. q. ( 1=1.84,t2=0.15)Aug-06~Oct-06 Ã. v. µ. p. (. b. 1 K. w. x. ?. ª. . May-Jul 92 1=1.84. Aug-Oct 92 2=1.60. 0.15. 0.02. 7.01 z. Z > 1.65 {. |=5%. . K. (WIP SPC, 2=1.60,t2=0.02)u 4-2 '. r 4-2 ;. L. . Ã. Reject H0. (WIP SPC)f C. 18. Cycle time w. x. K. L. .

(44) [. \. . 95%N <. 4.3 È. . '. (. } . WIP SPC f. ;. 3. K. L f. Ë. O Supervisor . ' #4. . Ö¦'. A. . . (. Ú . ~. s. &. Line balance . d. ÷ Ó. S . È. . ¦<. . o STD WIP SPC 0 r STD WIP SPC . . :. F. . v \. . . K. . ¤. Q. . !. s. A. §. *. +. . . &. d. &. û. Ó 2. . . û. E. . ; A. 3. K. L. STD . o0. ¦< \. g Ç. (. . C. (. Line balance Q . . ¾. `~ b. . û. . #. _ U R. u. â. Line balance. ¦ Supervisor ÷ f. Priority F. S. . . N. m. \. #. . '. 19. . (. Priority & . # . `~. Move ². C Supervisor f. R. [. o(. . S. Ô. Ë <. ÷. . . &. (CLIP; Customer Line Item Performance Ö CVP; b. . Supervisor . ¦ Supervisor ® . a . Customer Volume Performance)² \. Supervisor S ~. (. (. . }. N. d. `~ j. :. Öa. b Line balance ». Supervisor S &. . ¼ .

(45) C ¦. ¦p ,. Time Ö_. q. . S. T. Move `. 4. cycle time ¥. ”. a `. #_. . E Ng 5-1 E a ¦ ½. K. L O. .. Xc. U :. (. . . e. . ¢ ä. f þ. £. Ì. Ä. o 1.6 W/Layer ¢ é. ru. F. WIP Ö( £. . N 2.50. 1.98. 1.86. 200,000. 2.00. 222,946. 208,084. 194,291. 251,699. 242,104. 227,032. 1.86. 1.62. 1.6. 1.58. 84,161. 85,994. 1.50. 150,000 100,000. 77,020. 74,039. 69,139. 79,369. 1.00. 0.50. 50,000. 0.00. 0 May-06. Jun-06. Jul-06. Aug-06. g 5-1 K L. l O. Sep-06. Oct-06. . K. L C. f. WIP X cycle time ¨. g. CLIP. Utilization. Output. A. 120,000. 120% 100% 80% 60%. 95%. 96%. 94%. 95%. 92%. 99%. 97%. 98%. 100%. 100,000. 98%. 80,000. 82%. 61,100. 59,450. 53,502. 48,581. 99%. 61,028. 64,038. 60,000. 40%. 40,000. 20%. 20,000 0. 0% M ay-06. g 5-2 K. Jun-06. Jul-06. L.

(46) O. l. K. L C. Aug-06. f. 20. Sep-06. . Oct-06. utilization X CLIP ¨ A. g. f. M. QR. `(move)¤. 300,000 250,000. . Move. CT. WIP. Å. WIP SPC : w. (Jul-06~Oct-06)j ' C. F§. . ”d. '. L. a. ¡. oK. T.

(47). 4 û. WIPNr . QR . b. C. Cycle n .

(48) g 5-2 E. oK. L. (Jul-06~Oct-06) j C. '. CLIP(Customer Line Item Performance)¥ r 95%_ `. oÄ . . |. 9. . Å. Å. :¯. Ë ^. B :. o_ J. ,. ¦<. . .

(49). STD WIP û f. STD WIP _. o<. «. . . µ. . ¦<. ¬. :. M. ¶ ¾. ] . L. . ® . . f. ³ .. S. . F. ¦ WIP . ·. (utilization) ¤ E. $. n. . 98%N ©. ®. F stage WIP SPC Æ °. ß. STD WIP ª. _. `Ö' (. ª. T «. 10 ¸ z. ±. ¸. ¹. WIP ProfileN ² ³. .. Dm. .. Ì. ´ . Ä. . (1).Recipe match dispatching (Furnace / CS) º. » ö. (Chemical Station)V =. ,. ¥. =. ®. WIP A (2).Á. =. ². \. F ¾. &. 2. . ,. ¼ ¥. lot © M. ¼. P. ® ®. ½. ¿. , E. ,. lot ¿. Ã. À. #. O. ». Fº. =. ¥. 4. ¼. º. . .. » . ®. = !. O M. (Recipe). Ã ». º. = . WIP `%. ;. . ¾. run , STD. N. (Photo). Photo 2. o critical layer . 1A-I200Û3 . Ã. # run lot. ¼. . ». º. K. ª. !. m. «. M. 4 . M. critical 2. lot # runj . . `%. F. Ä. ' m. STD WIP A Å. _. Á. . . c. Æ. ². Contact û. \. Â. . ¾. K F. Ã ¬. A. « . 7 '. ,. ; ;. lot o2 M. 1A-I200Nx $. run . lotE . P1 ' . û. 21. :. F . %. f. Ä. Å. . . . 1A-I200 Û. F Photo WIP. N. STD WIPe. $. N.

(50) 1. Ç È. É. Ê . » . 2. Ò. Ð. Ó. Ô. * Ñ. Ð. . ×. $. <. p. q. 2. s. T. f. '. Ì. Í. (. X). Î *. Ï. a ü. ». . . S. d. S. X®. 2004N ´. . Ö. Õ. Ë. . . Ê *. Ø 0. Ã. Ú. ú. X®. s. f. o2. U. ®. . . Ã. Ù . Ú. Î ®. Û. Ü. Ù. gÝ. Þ. ß. » S. d. S. X®. . à. . ê. Ð. ä. . 2003N 3. á â. ã. Ê p. 4. å Ð. æ. 2. T. Î Ï. a ü. . . ». Ñ. 1998N ´. . q. ç ä. Ê Ñ . ´. . è. é. . Â f. z. {. Xm. ®. . ¦ê. f. Ä. Å. Î. Ï ü. a . . » S. d. S. X®. . 1998N. 5. Glassey C.R. and Resende, M.G.C., “Closed-loop Job Release Control for VLSI Circuit Manufacturing” , IEEE Transactions on Semiconductor Manufacturing, Vol. 1, No.1, pp. 36-46, February 1988. 6. Lawton, J.W., Drake, A., Henderson, R., Wein, L.M., Whitney, R., and Zuanich, D., “Workload Regulating Wafer Release in a GaAs Fab Facility” IEEE Int’l Semiconductor Manufacturing Science Symposium, pp. 33-88, 1990. 7. Miller, D.J. “Simulation of a semiconductor manufacturing line”, Communication of The ACM 33/10, pp. 99-109, 1990. 8. Wein, L.M., “Scheduling Semiconductor Wafer Fabrication” , IEEE Transactions on Semiconductor Manufacturing, Vol.1, No.3,pp.115-130, August 1988.. 22. ».

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