[PDF] Top 20 Electromigration at the high-Pb-eutectic SnPb solder interface
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Electromigration at the high-Pb-eutectic SnPb solder interface
... from the interface of Cu electrode and eutectic SnPb solder, line scans were performed approximately every 7 m along the length direction of the sample to obtain ... See full document
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Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes
... EXPERIMENT Eutectic SnPb solder stripes of about 1 – 2 m in thick- ness were fabricated in Si trenches according to the fabrica- tion procedure described in our previous ...of solder ... See full document
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Critical length of electromigration for eutectic SnPb solder stripe
... on electromigration of solder ...on the measurement of fundamental electromigration param- eters of ...that the dominant diffusion species was Sn atoms in a thin SnPb stripe when ... See full document
4
Threshold current density of electromigration in eutectic SnPb solder
... in the microelectronics packaging industry since the dimension of solder joints has continued to ...enables the precise measurement of the important parameters of solder ... See full document
4
Microstructure evolution during electromigration in eutectic SnPb solder bumps
... to the chemical potential gradient, because the ternary IMCs may have lower free ...on the anode/chip side, electron flow enhances the dif- fusion of nickel ...on the cathode side, ... See full document
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Study of electromigration in eutectic SnPb solder stripes using the edge displacement method
... is the EM flux, C is the concentration of atoms per unit volume of the eutectic alloy, D is the effective lattice diffusivity of the solder at testing temperature, ... See full document
5
Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
... This study investigates electromigration study of eutectic SnPb flip-ch.ip .solder joints on ceramic substrates.. The under bump metalltzatlon (UBM) structure consists of 5-J.lIll Cu / 3[r] ... See full document
3
Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes
... EXPERIMENTAL The SnPb solder strips of various lengths were pre- pared, each about ...13 Eutectic SnPb solder was re- flowed on a ...film at 210 °C for 4 s on a hot plate. ... See full document
6
Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration
... crystal at temperatures above 13 °C. This means that the crystal is ...instance, the electrical resistivity was ...in the elastic constants in the principal directions (C 11 ⳱ ...27 ... See full document
10
Microstructural evolution during electromigration in eutectic SnAg solder bumps
... on the anode/chip side, 10 and EM-induced IMC forma- tion on the anode/chip side in this ...For eutectic SnPb solder bumps, the concentration of Sn is only 63%, and Pb ... See full document
11
Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface
... kept at low levels to keep the melting point as low as ...an eutectic point of 470 K as reported by Sebaoun et al, 9 who discussed the diffusion paths of various Sn–Zn–Al systems at ... See full document
7
Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization
... Thus, the mea- surement of activation energy mainly involves the processes of Cu–Sn IMC formation and void formation on the chip ...side. The resistivities for the Cu, SnAg, ... See full document
7
Hermetic packaging using eutectic SnPb solder and Cr/Ni/Cu metallurgy layer
... for the three setups. As expected, the self-alignment behavior was also observed during the bonding ...m. The average misalignment of all sam- ples was about 12 ...and the fracture ... See full document
6
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
... and the eutectic SnPb phase in both iso- thermal and cycling ...ary eutectic phase diagram such as SnPb, below the eutectic temperature, a constant temperature line is a ... See full document
4
Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints
... during the accelerated electromigration test for flip-chip Pb-containing solder ...Typically, the applied current ranges from ...during the electromigra- tion test. The ... See full document
9
Electromigration issues in lead-free solder joints
... As the microelectronic industry advances to Pb-free solders due to environmental concerns, elec- tromigration (EM) has become a critical issue for fine- pitch packaging as the diameter of the ... See full document
10
Thermomigration in flip-chip SnPb solder joints under alternating current stressing
... flip-chip solder joints has attracted a lot of attention in recent years due to the miniaturization trend in high-performance ...As the current density in solder bump continues to ... See full document
4
Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration
... with the Cu/Ni/Al UBM to study the effect of the surface fin- ish on the reliability of flip-chip solder joints under current ...assembly, the Au layer of the Au/Ni surface ... See full document
7
Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology
... with the aid of ball-grid array interconnection has attracted a great amount of attention in today’s electronics ...and high reliability. 1–3 One of the challenging issues is the material ... See full document
6
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
... during the final 5% of the stressing ...in the melted solder ...in the solder joints with downward electron current, for two possible ...First, the 5 lm Cu UBM on ... See full document
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