[PDF] Top 20 Board- and Chip-Aware Package Wire Planning
Has 10000 "Board- and Chip-Aware Package Wire Planning" found on our website. Below are the top 20 most common "Board- and Chip-Aware Package Wire Planning".
Board- and Chip-Aware Package Wire Planning
... the package substrate, and lay out the PCB, as shown in Fig. 2, and each modification of the interfaces can result in costly ...For chip core designers, several iterations of modifying I/O ... See full document
11
Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs
... the chip and package, it is necessary to consider them at the same ...handle chip and package performances, co-design of chip and package is a widely adopted ... See full document
10
Efficient Package Pin-Out Planning With System Interconnects Optimization for Package-Board Codesign
... Lee and Hung-Ming Chen Abstract—In conventional package design, engineers designate the ball grid array (BGA) pin-out manually, this always postpones the time-to-market (TTM) of products due to the ... See full document
6
A Study of Row-Based Area-Array I/O Design Planning in Concurrent Chip-Package Design Flow
... designing and optimizing a system. Package and board/system designs are usually followed by almost-ready chip designs, which causes long turn-around time communicating with ... See full document
19
Wafer Level Chip Sized Package LED 楊秋忠、蕭宏彬,鍾翼能
... cost-decreasing and less heat-reserving package method of LED – Wafer Level Chip Sized Package [WLCSP ...wafer chip process to protect the grains from oxidation and ...moisture. ... See full document
2
Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign
... for Package-Board Codesign Ren-Jie Lee, Student Member, IEEE, and Hung-Ming Chen, Member, IEEE Abstract—Deep submicrometer effects drive the complication in designing chips, as well as in ... See full document
12
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
... Lim, and Yueh-Chin Lin Abstract— This paper presents a flip-chip-on-board (FCOB) packaging technology using a Rogers RO3210 laminate for microwave ...ceramic package and thus results in ... See full document
8
Ribbed Package Geometry for Reducing Thermal Warpage and Wire Sweep during PBGA Encapsulation
... ribbed package geometry for reducing thermal warpage, wire sweep is another challenging ...problem. Wire sweep is a common defect in plastic integrated high density ...the wire sweep is too ... See full document
7
Graph-based Wire Planning for Analog Circuits
... Graph-based Wire Planning for Analog Circuits Abstract―In this paper, we propose the graph-based approach which constructs the electromigration-free wire planning according to the current ... See full document
8
RLC coupling-aware simulation and on-chip bus encoding for delay reduction
... interconnects, and then increase wire capacitance to see whether the worst case switchingpattern will change or not as the wire capacitance becomes ...↑↑↑↑↑ and the best case pattern changes ... See full document
7
How to improve chip strength to avoid die cracking in a package
... In this paper, additional thousands of chips on different wafers were tested to find the solution to enhance the chip strength in these weak regions, which included the effe[r] ... See full document
6
High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes
... Results and Discussion In general applications, LEDs are typically mounted on a PCB; thus, there is no influence regard- ing the type of SMD used because all of the photons originate from the top surface of the ... See full document
10
Design migration from peripheral ASIC design to area-I/O flip-chip design by chip I/O planning and legalization
... cost = all nets (HP newBBox 0 HP orgBBox ) 0 W sqCell (3) where HP means half-perimeter of the bounding box of the net for that squeezed cell, W means the width of the squeezed cell, and is to tradeoff the ... See full document
5
Planning the development strategy for the mobile communication package based on consumers' choice preferences
... image and video photographs and so on depended on the customers’ ...specifications and functions of the mobile phone generally evolved with the development of telecommunication ...functions and ... See full document
12
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
... IEEE, and Szu-Ping Tsai Abstract—Flip-chip package has great potential for use in mil- limeter-wave ...the chip and the substrate usually gen- erates thermal stresses that fracture the ... See full document
3
Printed circuit board production planning using Physical programming approach 姜平、陳偉星
... circuit board (PCB) assembly had focused on machine-level optimization problems, such as placement sequence and feeder ...production planning problems ...production planning from Master ... See full document
2
Evaluation of Cu-bumps with lead-free solders for flip-chip package applications
... thickness and uniformity mainly de- pend on the spin time and the spin ...rate and using pulsed current ...rate and the electrolyte solu- tion concentration ...rate and 1/100 s pulse ... See full document
4
Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis
... (Tg) and elastic modulus than the baseline underfill, which could lower the substrate bending effect under the thermal ...Tg and elastic modulus combined with the thicker die would further increase the ... See full document
11
Voltage-Aware Chip-Level Design forReliability-Driven Pin-Constrained EWOD Chips
... Performance-driven Analog Placement Considering Monotonic Current Paths " at the concurrent sessions. It is my great honor to present my research in front of so many scholars which come from different places around the ... See full document
10
Integration of Demand Planning and Manufacturing Planning
... • To prove it, we must show that, for every feasible solution of Q, there is a corresponding feasible solution of P having a better or equal objective function value. • The feasible so[r] ... See full document
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