[PDF] Top 20 Intermetallic compounds formed at the interface between liquid indium and copper substrates

... from the specimens re- acted at 400°C for 120 min is shown in ...5. The bi- layered intermetallic compounds formed in the speci- mens after soldering reactions at ... See full document

... words: Indium, silver, intermetallic compound, kinetics, wettability tin and silver, studies on In/Ag interfaces are ...an intermetallic compound Ag 2 In formed in the ... See full document

... Science and Engineering, National Taiwan University, Taipei 106, [email protected] The interfacial reactions between liquid In-49Sn solder and Ni substrates at ... See full document

... solders and the avoidance of costly In-based solders, Sn-Zn alloys have been considered as one alternative be- cause they also possess the advantages of high strength, good creep resistance, ... See full document

... in the soldering reaction was of the AuIn 2 phase. In a study on the solid-liquid reaction of Cu/Sn, Ni/ Bi and Cu/In systems, Kao 19 showed that the rapid dissolution of ... See full document

... For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at the In-49Sn/Cu inter- face are ... See full document

... ing, the solder alloy melts and reacts with the sub- strate to form intermetallic compounds at the joining ...interface. The formation of ... See full document

... words: Intermetallic compounds, diffusion soldering, Au/In/Sn/Cu interfacial reactions INTRODUCTION Diffusion soldering provides novel applications for high density and high power devices in meeting ... See full document

... as the material for backing plates. Upon the depletion of the target material, the Cu backing plate is debonded from the used target and recycled by being soldered with a new ... See full document

... For the observations of morphology of the interface after soldering reactions, optical microscopy (OM) and scanning electron microscopy (SEM) were ...used. The specimens were ... See full document

... is the most prominent joining material for the interconnection and packaging of mod- ern electronics because of its unique combination of low cost and convenient material ...its ... See full document

... As the peak temperature is increased to 220°C, the intermetallic compounds are found to change from a continuous layer into a nearly square shape, as shown in ...shows the morphological ... See full document

... zirconia and titanium specimens were cut and machined to dimensions of 14 mm  14 mm  5 ...ground and polished to 0.5 mm with a diamond paste, and then ultrasonically cleaned in ...in ... See full document

... reactions between titanium and zirconia have been studied in the past several ...that the oxygen of zirconia is readily dissolved into the titanium to form a-Ti(O), resulting in ... See full document

... Thermal aging the electroless copper plated substrate at 150°C results in recrystallization of electroless copper, and the ductility of the electroless copper is increased.. It is[r] ... See full document

... obtained the first experimental evidence for the Pockels effect of water, which is induced by a high electric field in the electric double layer (EDL) on the water–transparent electrode ... See full document

... on the interface re- action between titanium and zirconia in the last few dec- ...when the titanium melt reacted with the ZrO 2 ...discussing the effect of ... See full document

... of the most promising substrate materials for use in semiconductor, microwave, optic, electronic, and other high-performance appli- cations, because of its high thermal conductivity (  320 W  (m  L) 1 ... See full document

... strength and tough- ness, light weight, and extraordinary corrosion resistance, they are widely applied to some parts of aircraft, medical devices, golf club heads, consumer electronics, ...water-cooled ... See full document

... nonrelativistic and confined in a half space by a uni-directed In magnetohydrodynamic approximation a steady state between the plasma and magnetic field exists when the pressure in ... See full document