[PDF] Top 20 Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

... of Sn-9Zn solder ball grid array (BGA) packages with Au/Ni/Cu and Ag/Cu pads, the surface-finished Au ... See full document

... Cu and Ag/Cu pads in ball grid array (BGA) pack- ...of in- termetallic compounds that takes place at the inter- face allows for sound wetting ... See full document

... of packages with Au/Ni/Cu or Ag/Cu pads, the Au or Ag surface finish dissolves rapidly into the solder matrix and a liquid/solid reaction ... See full document

... of Sn-58Bi solder joints in a BGA package with Au/Ni/Cu pads has been performed by employing various temperature profiles, which results in the formation of ... See full document

... 2 intermetallic compounds in the solder in addition to Ag 2 In precipitates after the reflow of ...Sn-20In-2.8Ag solder balls on ... See full document

... element Ni, in trace amounts, has been added to the ternary eutectic ...Sn3Ag0.5Cu solder alloy for the purpose of improving its mechanical strength and ...of Ni ... See full document

... words: Sn-0.4Co-0.7Cu, Au/Ni/Cu pads, intermetallic compounds, ball shear strength INTRODUCTION For the development of Pb-free solders, the eutectic ... See full document

... INTRODUCTION In order to prevent oxidation and promote the wettability of a printed circuit board, many surface finishing techniques have been explored, among which the immersion Au/Ni method ... See full document

... along with the growth of the IM2b intermetallic ...the reactions between IM1b interfacial intermetallics and the Ni layer of the Au/Ni surface ...An in- teresting ... See full document

... the solder/pad interfaces after the reflowing process and aging at 100 ...0.92 In 0.08 ) 5 intermetallics grew rapidly from the solder/pad interface into the solder matrix (Ref ... See full document

... of Ni-P/Cu under bump metallurgy with various solders. 9 In the case of a ...Sn-3.5Ag solder, it is the Ni 3 Sn 4 intermetallic phase generated ... See full document

... into Sn-3.6Ag-1.0Cu solder was also reported by Anderson et ...The ball-grid array (BGA) package used in this study had 49 Cu pads on a FR-4 ... See full document

... Science and Engineering, National Taiwan University, Taipei 106, ...The intermetallic compounds formed after reflow and burn-in testing of a Sn- ...20In-0.8Cu ... See full document

... the intermetallic compounds are found to change from a continuous layer into a nearly square shape, as shown in ...the intermetallic compounds formed dur- ing reflow at different peak temperatures ... See full document

... of Cu or Zn atoms in Sn crystals is significantly larger than that of the self- diffusion of ...of Cu in a Sn matrix is 1,000–10,000 times larger than that of ...enables ... See full document

... between Sn–Zn based solders and Cu/Ni–P/Au substrate under aging Cu/Ni–P/Au substrates are commonly utilized for met- allization in the ball ... See full document

... metallization, intermetallic compound, diffusion, phase transformation INTRODUCTION Flip-chip technology with the aid of ball-grid array interconnection has attracted a great amount of ... See full document

... shown in Fig. 8(b). Figure 9(a) shows the BEI micrograph of the Sn-Zn+10wt%Cu/Au system aging at 160°C for 24 ...wt% Cu was added into the Sn-9Zn ... See full document

... tronic packages with Pb-free solder joints. 1 In fact, the formation of whiskers on electrodeposited Sn and Sn alloys during storage and usage has been discovered ... See full document

... A and thus serious Joule heating takes place during the electromigra- tion ...the solder joints. For Pb-containing solder, Pb atoms move to the cold end on the substrate ...hand, Sn atoms ... See full document