[PDF] Top 20 Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad

... 1.—Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, ...after reflow and burn-in testing of a Sn- ...solder ball ... See full document

... appearance of a number of cubic-shaped AuIn 2 intermetallic compounds in the solder in addition to Ag 2 In precipitates after the reflow of ...on ... See full document

... Cu and Ag/Cu pads in ball grid array (BGA) pack- ...formation of in- termetallic compounds that takes place at the inter- face allows for sound wetting ... See full document

... because of the formation of an IM1 inter- metallic layer on the Ni/Cu ...obvious with the coarsening of the IM2 intermetallics induced by 2 times ...10b and 11b show that ... See full document

... after reflow, the needle- shaped Ag 3 Sn precipitates resolidified into fine par- ticles, while a (Cu ...0.55 Ni 0.40 Au 0.05 6 Sn 5 intermetal- lic ... See full document

... INTRODUCTION In order to prevent oxidation and promote the wettability of a printed circuit board, many surface finishing techniques have been explored, among which the immersion ... See full document

... diminution of the origi- nal IM1b intermetallics along with the growth of the IM2b intermetallic ...rate of IM2b is much greater than the diminishing rate of IM1b, as indicated by ... See full document

... one of the most important issues critical to the reliability of elec- tronic packages with Pb-free solder ...1 In fact, the formation of whiskers on electrodeposited Sn ... See full document

... the Sn-3.5Ag packages with Ag/Cu pads, the interfacial scallop-shaped Cu 6 Sn 5 intermetallic compounds grow with increasing aging time during aging at 100 °C, as shown in ... See full document

... causes a planar interme- tallic phase to form at the solder/pad interface of Au/Ni surface finished Sn-9Zn BGA packages, as shown in ...(at.%) of these interfacial ... See full document

... constant of Cu or Zn atoms in Sn crystals is significantly larger than that of the self- diffusion of ...magnitude of diffusivity of Cu in a ... See full document

... from a continuous layer into a nearly square shape, as shown in ...variation of the intermetallic compounds formed dur- ing reflow at different peak temperatures for the BGA ... See full document

... crossing and generate a ring-grid list on each ...into a physical arbitrary-angle wires adhering to design ...limit of wires passing through the ball pitches. We apply a ... See full document

... into Sn-3.6Ag-1.0Cu solder was also reported by Anderson et ...show a beneficial effect on its shear strength induced by refining the joint ...The ball-grid array (BGA) ... See full document

... technology with the aid of ball-grid array interconnection has attracted a great amount of attention in today’s electronics ...as a large number of ... See full document

... BGA package is presented in this paper to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate ...consist of layer assignment, ... See full document

... between Sn–Zn based solders and Cu/Ni–P/Au substrate under aging Cu/Ni–P/Au substrates are commonly utilized for met- allization in the ball ... See full document

... through a row of solder balls and polished with ...(SEM), and their chemical compositions were analyzed using an energy-dispersive X-ray spectrometer (EDX) installed in the ... See full document

... density of primary Cu 6 Sn 5 in Sn-0.7Cu and Sn- ...on Cu and ENIG from Fig. 4 are given in Table ...density of Cu 6 ... See full document

... 1.—Department of Material Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan ...2.—Department of Material Science and Engineering, National Chiao Tung Univer- sity, ... See full document