[PDF] Top 20 Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions

... For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at ... See full document

... 3.—Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, [email protected] The interfacial reactions between liquid In-49Sn ... See full document

... words: Intermetallic compounds, diffusion soldering, Au/In/Sn/Cu interfacial reactions INTRODUCTION Diffusion soldering provides novel applications for high density ... See full document

... solder and the Ag thick film is, thus, indirectly as- certained from the thickness decrease ( ⌬X) of the Ag ...film. In this case, the thickness of the ... See full document

... for Sn-Pb solders and the avoidance of costly In-based solders, Sn-Zn alloys have been considered as one alternative be- cause they also possess the advantages of ... See full document

... For the observations of the morphology of intermetallic compounds formed at the Ag/Sn interface after soldering re- actions, scanning electron ... See full document

... 1 and W.H. LIN 1 1.—Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, [email protected] The morphology and growth kinetics ... See full document

... reveals the diminution of the origi- nal IM1b intermetallics along with the growth of the IM2b intermetallic ...However, the growth rate of ... See full document

... ployed in the process, which melts at low tempera- tures and reacts rapidly with both high-melting (HT 1 and HT 2 ) layers or with substrates to form intermetallic compounds ... See full document

... solders and Ni substrates at temperatures ranging from 200 to 400 ...4 intermetallic phase with the composition of Ni ...41.5 Sn 57.9 Bi 0.6 formed at the ... See full document

... Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095-1595, USA Received 1 November 2011; revised 21 January 2012; accepted 23 January 2012 ... See full document

... to the soldering reaction between liquid In and a Cu substrate, Kao dipped Cu disks into In and In ⫹ Cu baths at ...6 Cu 11 In 9 was ... See full document

... Cu and Ag/Cu pads in ball grid array (BGA) pack- ages. During the soldering reaction, the formation of in- termetallic compounds that takes ... See full document

... tallic phase to form at the solder/pad interface of Au/Ni surface finished Sn-9Zn BGA packages, as shown in ...4. The EDX analysis indicates that the composition (at.%) ... See full document

... During the reflow of packages with Au/Ni/Cu or Ag/Cu pads, the Au or Ag surface finish dissolves rapidly into the solder matrix and a liquid/solid reaction occurs at ... See full document

... reactions of Ni-P/Cu under bump metallurgy with various solders. 9 In the case of a ...is the Ni 3 Sn 4 intermetallic phase generated at the ... See full document

... 1.—Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, [email protected] The intermetallic compounds (IMCs) formed during ... See full document

... studied the growth mechanism of Ag 3 Sn precipitation in SnAg solder ...that the primary Ag 3 Sn parti- cles form before the onset of the eutectic ... See full document

... Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan 共Received 4 January 2007; accepted 9 February 2007; published online 23 April 2007兲 Massive spalling of ... See full document

... As the peak temperature is increased to 220°C, the intermetallic compounds are found to change from a continuous layer into a nearly square shape, as shown in ...shows the ... See full document