[PDF] Top 20 Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions

... Taiwan. 2.—E-mail: [email protected] The morphology and growth kinetics of intermetallic compounds formed during the interfacial reactions between liquid ...and Ni ... See full document

... For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at the In-49Sn/Cu ... See full document

... words: In-49Sn/Ni, soldering reaction, ternary Ni 33 In 20 Sn 47 intermetallics, growth kinetics INTRODUCTION The In-Sn solders possess ... See full document

... and Ag/Cu pads in ball grid array (BGA) pack- ages. During the soldering reaction, the formation of in- termetallic compounds that takes place at the inter- ... See full document

... concerns for Sn-Pb solders and the avoidance of costly In-based solders, Sn-Zn alloys have been considered as one alternative be- cause they also possess the advantages of high ... See full document

... voids in the Ni-based UBM system during reaction Kirkendall void formation in the solder/UBM reaction has been reported in other ...3,39,40 The presence of ... See full document

... of Ni-P/Cu under bump metallurgy with various solders. 9 In the case of a ...is the Ni 3 Sn 4 intermetallic phase generated at the ...However, the ternary ... See full document

... During the reflow of packages with Au/Ni/Cu or Ag/Cu pads, the Au or Ag surface finish dissolves rapidly into the solder matrix and a liquid/solid reaction occurs at ... See full document

... For the observations of the morphology of intermetallic compounds formed at the Ag/Sn interface after soldering re- actions, scanning electron microscopy (SEM) was ... See full document

... used in a sputtering target assembly as the material for backing ...Upon the depletion of the target material, the Cu backing plate is debonded from the used target and ... See full document

... words: Intermetallic compounds, diffusion soldering, Au/In/Sn/Cu interfacial reactions INTRODUCTION Diffusion soldering provides novel applications for high density and ... See full document

... study, the solder volume used was substantially greater than the actual array–array package solder ...Therefore, the results presented here were for the condi- tion that the ... See full document

... Conclusions During the soldering reactions of Sn and ...with Ag thick films, scallop-shaped Ag 3 Sn intermetallic compounds ap- pear at their ...on ... See full document

... nalize the occurrence of the massive spalling in four different solder/substrate systems, including SnAgCu/Ni, SnZn/Cu, PbSn/Cu, and ...PbSn/Ni. The massive spalling occurs ... See full document

... reveals the appearance of a number of cubic-shaped AuIn 2 intermetallic compounds in the solder in addition to Ag 2 In precipitates after the reflow ... See full document

... Experimental The BGA package used in this study contained 49 Cu pads set on each FR-4 ...substrate. The Cu pads were immersion-plated with 0.2 lm thick Ag ...film. The ... See full document

... EXPERIMENTAL The surface of an alumina substrate was coated with silver paste using a screen printer (composi- tion: Ag 75–80%, glass 1–5%, resin 1–5%, terpineol 5–10%, and diethyl phthalate ...150°C ... See full document

... reveals the diminution of the origi- nal IM1b intermetallics along with the growth of the IM2b intermetallic ...However, the growth rate of IM2b is much greater ... See full document

... 1) Intermetallic formation between thick film mixed bonded conductor and Sn/Pb solder is evaluated. 2) Microstructural analysis of the soldered conduc- torhbstrate assembly rev[r] ... See full document

... words: Sn3Ag0.5Cu, Sn3Ag0.5Cu0.06Ni0.01Ge, Au/Ni surface finishes, ball-grid-array package, intermetallic compounds INTRODUCTION The eutectic Sn-Ag-Cu ... See full document