[PDF] Top 20 Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface

... Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road,Tainan, 80782, Taiwan (Received 18 October 1999; accepted 12 September 2000) The eutectic ... See full document

... resistance of the wiring trace on the Si side is much longer than that on the substrate ...the solder joints. For Pb-containing solder, Pb atoms move to the cold end on the substrate ...hand, ... See full document

... without solder con- necting to them since the IMC is the reaction product be- tween the metallization layer and the ...the solder, the surface morphology of the IMCs is quite rough, making this ... See full document

... phase at the solder/pad interfaces after the reflowing process and aging at 100 ...aging at a higher temperature of 150 °C, many column-shaped (Cu ...the solder/pad ... See full document

... range of 300 –513 °C: initial with n 5 ...on Cu and various kinds of solders without kinetic ...kinetics of Ni 3 Sn 4 follow parabolic law in Ni/Sn diffusion couples in the ... See full document

... reactions of Ni-P/Cu under bump metallurgy with various ...case of a Sn-3.5Ag solder, it is the Ni 3 Sn 4 intermetallic phase generated at the ...4 Cu 7 ... See full document

... porous Cu 3 Sn, we observed that the effect of side wall reaction is very ...wall of a bump. The bump has had porous-type Cu 3 Sn IMCs ...IMCs formation on the side wall, ... See full document

... systems of Cu/Ti/Si and Au/ Cu/Al 2 O 3 were diffusion-soldered at various temper- atures ranging from 150 to 300 °C with an In/Sn dou- ble layer inserted between ...melted ... See full document

... spite of the compositional modification, the melting points of the Sn–Ag-based solders are still 25–61 °C higher than that of the Sn–Pb eutectic ...temperatures of the ... See full document

... Pb-free solder has been an important issue in elec- tronic material development for a ...Many Sn- based ternary and quaternary Pb-free systems have been ...lead-free solder alloy has to ... See full document

... reflow of packages with Au/Ni/Cu or Ag/Cu pads, the Au or Ag surface finish dissolves rapidly into the solder matrix and a liquid/solid reaction occurs at the interface of ... See full document

... formed at the solder/pad interfaces of ...and Sn-20In-2Ag-0.5Cu BGA packages, respectively. Further aging at 100°C and 150°C for ...Sn-3.8Ag-0.7Cu solder joints leads to ... See full document

... the formation of in- termetallic compounds that takes place at the inter- face allows for sound wetting and ...overgrowth of interfacial intermetallics will cause embrittlement and ... See full document

... acted at 400°C for 120 min is shown in Fig. 5. The bi- layered intermetallic compounds formed in the speci- mens after soldering reactions at lower temperatures are also ...shaped ... See full document

... appearance of a number of cubic-shaped AuIn 2 intermetallic compounds in the solder in addition to Ag 2 In precipitates after the reflow of ...Sn-20In-2.8Ag solder ... See full document

... aging at 150°C causes a planar interme- tallic phase to form at the solder/pad interface of Au/Ni surface finished Sn-9Zn BGA packages, as shown in ...(at.%) of ... See full document

... Instead of the formation of Ag–Sn compounds, recent experiments indicate that the addition of Ag into the eutectic Sn–Zn solder leads to the ... See full document

... flip-chip solder joints has become a major reliability issue in recent years because of the minia- turization trend to meet the demand of higher performance in portable consumer ...chip solder ... See full document

... Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 80782 Kaohsiung, Taiwan The solid-state reactions at the interface of Sn-9Zn-xAg ... See full document

... CTEs of IMCs formed at the interface between lead-free solders and ...layer of IMC on the substrate, and the area needs to be large enough to suit the resolution of the metrology ... See full document