[PDF] Top 20 Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers

... metallic thin-film interlayer is em- ployed in the process, which melts at low tempera- tures and reacts rapidly with both high-melting (HT 1 and HT 2 ) layers or with ... See full document

... compounds, diffusion soldering, Au/In/Sn/Cu interfacial reactions INTRODUCTION Diffusion soldering provides novel applications for high density and high ... See full document

... application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at the In-49Sn/Cu inter- face are ...consist of a ... See full document

... reflow of packages with Au/Ni/Cu or Ag/Cu pads, the Au or Ag surface finish dissolves rapidly into the solder matrix and a liquid/solid reaction occurs at the interface ... See full document

... Properties of Sputtered TiB 2 Between Cu and Si ...z and J. L. Wang Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan ... See full document

... merits of low melting point (138
C), high tensile strength (Ref 1), and good creep resistance (Ref 2, ...the Au/Ni metallization has been one of the most commonly used surface finishes ... See full document

... Cu and Ag/Cu pads in ball grid array (BGA) pack- ages. During the soldering reaction, the formation of in- termetallic compounds that takes place at the inter- face allows for ... See full document

... deposition of Al film, some n-type silicon wa- fers (Silicon ...covered with a thin SiO 2 and a Ti layer, ...SiO 2 layer of 20-nm thickness was ... See full document

... between Sn–Zn based solders and Cu/Ni–P/Au substrate under aging Cu/Ni–P/Au substrates are commonly utilized for met- allization in the ball grid array (BGA) ...that Au ... See full document

... TiSi 2 thin film was formed during the deposition of PECVD Ti on ...CVD-Ti/TiN thin film was deposited on TiSi 2 ...NH 3 postannealing ... See full document

... observations of the morphology of intermetallic compounds formed at the Ag/Sn interface after soldering re- actions, scanning electron microscopy (SEM) was ...ground with SiC paper, ... See full document

... solid/solid reactions of Sn-3.5Ag and other Sn-based solders with Cu substrates, which result in the formation of scallop-shaped Cu 6 Sn 5 ... See full document

... amount of the solder was relatively large so that the supply of Zn was also ...constant during the ...static, and the forma- tion of one compound or another was more or less dictated by ... See full document

... Pure Cu and dilute Cu共Ti兲 and Cu共Ta兲 alloy films were deposited onto the substrates by magnetron ...The Cu alloy films were prepared by cosputtering in Ar gas and ... See full document

... words: Sn3Ag0.5Cu, Sn3Ag0.5Cu0.06Ni0.01Ge, Au/Ni surface finishes, ball-grid-array package, intermetallic compounds INTRODUCTION The eutectic Sn-Ag-Cu alloy ... See full document

... interface of Au/Ni surface finished Sn-9Zn BGA packages, as shown in ...(at.%) of these interfacial intermetallics is Ni:Zn # ...grows with the increase in aging time at 150°C. The ... See full document

... micrograph of the Sn-Zn+10wt%Cu/Au system aging at 160°C for 24 ...wt% Cu was added into the Sn-9Zn solder, two kinds of IMC layer were observed at the ...composition ... See full document

... ics of the electronic states intimate to superconductivity, has proven to be a powerful tool to provide new insights into the fundamental nature of both the pseudogap and the supercon- ducting ... See full document

... vibrational and magnetic Raman excitation spectra were examined in overdoped Y 1–x Ca x Ba 2 Cu 3 O 7–δ thin ...YBa 2 Cu 3 O 7–δ (YBCO) show strong ... See full document

... 1st, 2nd, and 5th charge/discharge curves for Cu 6 Sn 5 films deposited at 0, −100, and −150 V ...capacity of the 0 V film exceeds the theoretical capacity of ␩ ⬘ ... See full document