[PDF] Top 20 Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

... soldering reactions of Sn and Sn-3.5Ag with Ag thick films, scallop-shaped Ag 3 Sn intermetallic compounds ap- pear ... See full document

... depletion of the target material, the Cu backing plate is debonded from the used target and recycled by being soldered with a new ...Out of environ- mental concerns, ... See full document

... reflow of packages with Au/Ni/Cu or Ag/Cu pads, the Au or Ag surface finish dissolves rapidly into the solder matrix and a liquid/solid reaction occurs at the interface of ... See full document

... solder and the Ag thick film is, thus, indirectly as- certained from the thickness decrease ( ⌬X) of the Ag ...thickness of the nonspalling Ag 2 In attached to the ... See full document

... stains with alcohol and deionized water and polished with Al 2 O 3 particles was dipped in a rosin mildly activated (RMA) ...substrate and pure Sn、Sn-3.0 wt% ... See full document

... period of time, the solder drop col- lapsed and the contact angles declined to a value near ...intervals and heights of the transient pla- teaus on the contact-angle curves decreased ... See full document

... words: Sn3Ag0.5Cu, ...eutectic Sn-Ag-Cu alloy system has been con- sidered to be the most promising candidate to re- place traditional Sn-37Pb solders for ... See full document

... into Sn-based solders has constituted an annoying ...deposited with nickel as a diffusion barrier is considered. The interfacial reactions be- tween Sn-Zn-Bi solders ... See full document

... oxidation and promote the wettability of a printed circuit board, many surface finishing techniques have been explored, among which the immersion Au/Ni method is popularly em- ployed in advanced electronic ... See full document

... 20 Sn 47 intermetallics, growth kinetics INTRODUCTION The In-Sn solders possess the merits of low melt- ing points, good ductility, and improved wettabil- ...In-based solders ... See full document

... the interfacial reactions of Sn-Pb solders and most Pb-free solders with Cu pads, Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds ... See full document

... costly and in some cases can cause Au embrittlement failure (Ref ...Immersion Ag is an alternative surface finishing agent, which can provide smooth surfaces and good wettability for liquid ... See full document

... Cu and Ag/Cu pads in ball grid array (BGA) pack- ...formation of in- termetallic compounds that takes place at the inter- face allows for sound wetting and ...overgrowth of ... See full document

... range of 300 –513 °C: initial with n 5 1.85, intermediate with n 5 ...8.33, and final with n 5 1.59. Kang reported the interfacial reaction between EP-Ni on ... See full document

... observations of the morphology of intermetallic compounds formed at the Ag/Sn interface after soldering re- actions, scanning electron microscopy (SEM) was ...ground with SiC paper, ... See full document

... words: Sn3Ag0.5Cu, ...immersion Ag surface finish, intermetallic compounds INTRODUCTION Among the types of lead-free solders, the eutectic Sn-Ag-Cu alloy has ... See full document

... solid-state reactions, samples were aged at 0, 200, 500, and 1000 h at 150 °C in nitrogen ...about 5 °C/s for all the samples because it can change the Ag 3 Sn ...height ... See full document

... behavior of the specimens was also ...endothermic and exothermic peaks of the samples used upon heating and cooling ...temperature with a small amount of Cu additions, but this ... See full document

... Many Sn- based ternary and quaternary Pb-free systems have been ...electrical and thermal conductivity, thermal expansion coefficient, mechanical strength and ductility, creep resistance, ... See full document

... characteristics of the intermetallics that appear in Sn–Zn–Ag solder alloys, particularly their behavior in molten solder during cooling and ...form of inhomogeneous dendrites ... See full document